Patents by Inventor Ryou Miyabara

Ryou Miyabara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180298251
    Abstract: A pressure-sensitive adhesive including an aliphatic polycarbonate as an adhesive component, wherein the aliphatic polycarbonate has no carboxylic acid ester bond or urethane bond in the main chain thereof; and a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer obtained by using the pressure-sensitive adhesive.
    Type: Application
    Filed: May 6, 2016
    Publication date: October 18, 2018
    Applicants: LINTEC CORPORATION, SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Kentaro MIYAZAKI, Fuminori IKEDA, Shuichi KARASHIMA, Kiyoshi NISHIOKA, Ryou MIYABARA
  • Publication number: 20170226374
    Abstract: The purpose of the present invention is to provide a resin composition for forming a hydrophilic coating film with which it is possible to form a hydrophilic coating film imparted with exceptional durability and suitable moisture sorption, wettability, and slip properties without selecting the type of substrate. A resin composition formed by dissolving or dispersing a modified polyalkylene oxide and a polyolefin resin in a hydrophilic organic solvent, and a hydrophilic coating film and hydrophilic-surfaced substrate obtained by drying this resin composition on a substrate.
    Type: Application
    Filed: September 11, 2015
    Publication date: August 10, 2017
    Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Hitoshi Ozawa, Ryou Miyabara
  • Patent number: 9414487
    Abstract: The present invention provides a metal paste composition which can obtain the calcined bodies having low volume resistivity in a wiring substrate after calcining. More specifically, the present invention provides a metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: August 9, 2016
    Assignees: SUMITOMO SEIKA CHEMICALS CO., LTD., OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE
    Inventors: Nobutaka Fujimoto, Tomoki Kawakita, Ryou Miyabara, Masami Nakamoto, Toshinobu Ohno, Mari Yamamoto, Yukiyasu Kashiwagi
  • Publication number: 20140008588
    Abstract: The present invention provides a metal paste composition which can obtain the calcined bodies having low volume resistivity in a wiring substrate after calcining. More specifically, the present invention provides a metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent.
    Type: Application
    Filed: March 6, 2012
    Publication date: January 9, 2014
    Applicants: OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE, SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Nobutaka Fujimoto, Tomoki Kawakita, Ryou Miyabara, Masami Nakamoto, Toshinobu Ohno, Mari Yamamoto, Yukiyasu Kashiwagi