Patents by Inventor Ryouichi Kubota

Ryouichi Kubota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080225492
    Abstract: To provide an electronic device which can prevent that a heat sink constituting a source of the unnecessary radiation of electromagnetic waves with a simple structure. The electronic device which contains the heat sink in the case is constituted. A heat sink includes: a fin assembly having a wave-guide structure provided with mesh-like openings as a whole and with a plurality of arranged fins and wall portions extending from each of the openings; a heat receiving plate for receiving heat from an electronic device which is a cooled object; and heat pipes. Since each of the openings of the fin assembly has the wave-guide structure, heat generated by the electronic device is dissipated to an exterior through the openings of the fin assembly and an opening section of a case. Leakage of electromagnetic waves to the exterior is prevented by operation of the wave-guide structure.
    Type: Application
    Filed: October 5, 2006
    Publication date: September 18, 2008
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Osamu Murasawa, Ryouichi Kubota
  • Patent number: 7254035
    Abstract: Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381a and a power source substrate 381b. A hood 142d covers the radiation fin 306 so as to collect air for cooling. Major parts of the main substrate 381a are in contact with the heat sink 307 via heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: August 7, 2007
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Chiyoshi Sasaki, Kouji Hirata, Katsushi Itoh, Yasuhiro Ootori, Ryouichi Kubota
  • Publication number: 20020089825
    Abstract: Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381a and a power source substrate 381b. A hood 142d covers the radiation fin 306 so as to collect air for cooling. Major parts of the main substrate 381a are in contact with the heat sink 307 via heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.
    Type: Application
    Filed: October 24, 2001
    Publication date: July 11, 2002
    Inventors: Chiyoshi Sasaki, Kouji Hirata, Katsushi Itoh, Yasuhiro Ootori, Ryouichi Kubota