Patents by Inventor Ryu Washino

Ryu Washino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060222032
    Abstract: An InGaAsP thin film layer having the same index of refraction as a diffraction grating is inserted between a p-type InP clad layer and the diffraction grating composed of an InGaAsP layer. In this structure, the InGaAsP layer is present over an active layer, and the amount of thermal diffusion of dopant to the vicinity of the active layer does not depend on an aperture width or the presence or absence of the diffraction grating when the p-type InP clad layer is grown, thereby obtaining a stable optical output, a threshold current, and slope efficiency.
    Type: Application
    Filed: August 31, 2005
    Publication date: October 5, 2006
    Inventors: Yasushi Sakuma, Katsuya Motoda, Kaoru Okamoto, Ryu Washino
  • Publication number: 20050286828
    Abstract: In a dry etching step for an organic material film, a fluorine-containing member is disposed to the periphery of a semiconductor substrate disposed on a lower electrode or a tray for wafer transportation to form fluorine (fluoro-radicals) from the member per se in addition to the fluoric gas added to the etching gas, with a purpose of removing reaction products, thereby removing reaction products deposited on the semiconductor substrate efficiently and stably.
    Type: Application
    Filed: January 10, 2005
    Publication date: December 29, 2005
    Inventors: Yasushi Sakuma, Katsuya Motoda, Kenji Uchida, Ryu Washino
  • Publication number: 20050250334
    Abstract: During the polishing of a semiconductor substrate, the semiconductor wafer that has been reduced in thickness, and hence in strength, by polishing, suffers outer-surface damage (or cracking) due to the initial damage caused by the use of polishing quartz. In order to solve these problems, the present invention applies a semiconductor substrate fixing jig formed with, on the face for fixing the semiconductor substrate, a groove(s) of almost the same diameter as that of the semiconductor substrate. Semiconductor substrate damage and cracking can be suppressed by applying this jig.
    Type: Application
    Filed: January 4, 2005
    Publication date: November 10, 2005
    Inventors: Ryu Washino, Yasushi Sakuma, Masaru Mukaikubo, Hura Harpreet Singh, Kenji Uchida