Patents by Inventor Ryugo KAGETANI

Ryugo KAGETANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12211194
    Abstract: Provided are a defect inspection apparatus and a defect inspection method that can inspect various types of defects in a synthesized image. The defect inspection apparatus synthesizes a first detection signal from a first detector and a second detection signal from a second detector with a first synthesis ratio to generate a first synthesized image, and synthesizes the first detection signal and the second detection signal with a second synthesis ratio different from the first synthesis ratio to generate a second synthesized image. The defect inspection apparatus generates a first inspection image based on the first synthesized image and generates a second inspection image based on the second synthesized image. The defect inspection apparatus executes a logical operation on the first inspection image and the second inspection image to generate a synthesized inspection image. The defect inspection apparatus executes defect determination on the synthesized inspection image.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: January 28, 2025
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yasushi Ebizuka, Hiroyuki Shindo, Ryugo Kagetani
  • Publication number: 20230194253
    Abstract: An object of the disclosure is to provide a pattern inspection and measurement apparatus that can accurately specify a corner point formed on a sample. The pattern inspection and measurement apparatus according to the disclosure specifies a pair of corner points as a corner pair candidate on design data, and specifies a corner point on an actually formed shape pattern in accordance with a relative relation between the corner pair candidate on the design data and the corner pair candidate in the shape pattern (see FIG. 13).
    Type: Application
    Filed: May 25, 2020
    Publication date: June 22, 2023
    Inventors: Ryugo KAGETANI, Kaoru FUKAYA, Hiroyuki SHINDO
  • Publication number: 20220335594
    Abstract: Provided are a defect inspection apparatus and a defect inspection method that can inspect various types of defects in a synthesized image. The defect inspection apparatus synthesizes a first detection signal from a first detector and a second detection signal from a second detector with a first synthesis ratio to generate a first synthesized image, and synthesizes the first detection signal and the second detection signal with a second synthesis ratio different from the first synthesis ratio to generate a second synthesized image. The defect inspection apparatus generates a first inspection image based on the first synthesized image and generates a second inspection image based on the second synthesized image. The defect inspection apparatus executes a logical operation on the first inspection image and the second inspection image to generate a synthesized inspection image. The defect inspection apparatus executes defect determination on the synthesized inspection image.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 20, 2022
    Inventors: Yasushi EBIZUKA, Hiroyuki SHINDO, Ryugo KAGETANI
  • Patent number: 11448663
    Abstract: This invention is directed to a pattern height information correction system which includes a contour line information of a pattern extracted from an acquired image including at least an AFM (atomic force microscope) module, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, in which the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: September 20, 2022
    Assignee: Hitachi High-Tech Corporation
    Inventors: Kenji Yamasaki, Hiroyuki Shindo, Taeko Kashiwa, Ryugo Kagetani
  • Publication number: 20210080485
    Abstract: This invention is directed to a pattern height information correction system which includes a contour line information of a pattern extracted from an acquired image including at least an AFM (atomic force microscope) module, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, in which the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.
    Type: Application
    Filed: August 4, 2020
    Publication date: March 18, 2021
    Inventors: Kenji YAMASAKI, Hiroyuki SHINDO, Taeko KASHIWA, Ryugo KAGETANI