Abstract: A bagmaking and packaging device includes a transverse sealing unit, a first tube member, and a gas flow path member. The first tube member is disposed above the transverse sealing unit and extends in an up and down direction. The first tube member allows a packaging material to become wrapped around it to thereby form the packaging material into a tubular shape. At least part of the gas flow path member is disposed inside the first tube member. The gas flow path member delivers nitrogen into the packaging material formed into the tubular shape. The first tube member includes a cutout portion that extends in the up and down direction. The cutout portion is formed so that the nitrogen can move between a space between the packaging material formed into the tubular shape and the first tube member and the inside space of the first tube member.

Abstract: A resonator device includes a base substrate including a principal surface, a side surface, and an inclined surface that couples the principal surface to the side surface and that is inclined with respect to the principal surface and the side surface, a resonator element arranged on the principal surface of the base substrate, and a lid that is bonded to the principal surface of the base substrate and accommodates the resonator element between the lid and the base substrate. A bonding area in which the base substrate and the lid are bonded is positioned inside an outer edge of the principal surface.

Abstract: A vibrator device includes: an element substrate including a frame portion having a first surface and a second surface, and a vibrator element disposed inside the frame portion; a first substrate having a third surface and a fourth surface, the first substrate being bonded to the first surface of the frame portion at the third surface; a second substrate having a fifth surface and a sixth surface, the second substrate being bonded to the second surface of the frame portion at the fifth surface; and a cavity surrounded by the frame portion, the first substrate, and the second substrate. The second substrate includes a through electrode at a position overlapping the frame portion in the plan view. An outer shape of the through electrode in the sixth surface in the plan view includes a first portion and a second portion. The first portion is located at a position closer to the cavity than is the second portion. A curvature of the first portion is smaller than a curvature of the second portion.

Abstract: A resonator device includes an element substrate including a frame part having a first surface and a second surface in a front-back relationship with each other, and a resonator element which is coupled to the frame part, and is arranged inside the frame part, a first substrate which is arranged at the first surface side, and has a third surface faced to the first surface, a first bonding layer which is arranged between the element substrate and the first substrate, and which is configured to bond the first surface and the third surface to each other, a second substrate which is arranged at the second surface side, and has a fourth surface faced to the second surface, a second bonding layer which is arranged between the element substrate and the second substrate, and which is configured to bond the second surface and the fourth surface to each other, a housing part which is surrounded by the frame part, the first substrate, and the second substrate, and which houses the resonator element, and a getter layer w

Abstract: A resonator device includes a base made of silicon and provided with a first surface and a second surface in a front-back relationship with each other, a resonator element arranged on the first surface, a lid which is made of silicon, which has a third surface arranged at the first surface side to be faced to the first surface, and a recessed part having a bottom surface and opening on the third surface, and the third surface of which is bonded to the first surface, and a getter layer which is arranged on the bottom surface of the recessed part, and which is provided with a gas adsorptive property, wherein the bottom surface of the recessed part is higher in surface roughness Ra than the third surface.

Abstract: A resonator device includes a base substrate that is formed of a single crystal semiconductor and includes a first surface, a resonator element attached to the first surface of the base substrate, and a cover that is bonded to the first surface of the base substrate, accommodates the resonator element between the cover and the base substrate, and is formed of a single crystal semiconductor. The base substrate and the cover are bonded through an amorphous layer.

Abstract: A resonator device includes a base, a resonator element attached to the base, a cover accommodating the resonator element between the base and the cover, and a conductive bonding member positioned between the base and the cover and bonding the base to the cover. The base includes a resonator element mount surface on which the resonator element is attached, a first interconnect and a second interconnect that are arranged on the resonator element mount surface and that are electrically coupled to the resonator element, a bonding surface bonded to the cover through the bonding member, and a step between the resonator element mount surface and the bonding surface.

Abstract: A bagmaking and packaging device includes a transverse sealing unit, a first tube member, and a gas flow path member. The first tube member is disposed above the transverse sealing unit and extends in an up and down direction. The first tube member allows a packaging material to become wrapped around it to thereby form the packaging material into a tubular shape. At least part of the gas flow path member is disposed inside the first tube member. The gas flow path member delivers nitrogen into the packaging material formed into the tubular shape. The first tube member includes a cutout portion that extends in the up and down direction. The cutout portion is formed so that the nitrogen can move between a space between the packaging material formed into the tubular shape and the first tube member and the inside space of the first tube member.

Abstract: A vibration device includes a base, a vibrator disposed at the base, an annular resin element that is bonded to the base and surrounds the vibrator in a plan view, and a lid so disposed that the vibrator is sandwiched between the base and the lid. A first metal layer is disposed at a surface of the resin element, the surface facing the lid. A second metal layer is disposed at a surface of the lid, the surface facing the resin element. The vibrator is encapsulated by the base, the resin element, and the lid when the first metal layer and the second metal layer are bonded to each other.

Abstract: A vibration device includes a semiconductor substrate having a first surface at which an integrated circuit is provided and a second surface that is a rear surface with respect to the first surface, which is a front surface, a vibration element disposed at the first surface, a lid having a recess that opens toward the first surface and a contact surface that is in contact with the first surface, the lid being bonded to the first surface via the contact surface, and a metal layer disposed between the first surface and the contact surface, and at least part of the integrated circuit overlaps with the metal layer in a plan view viewed in the direction of a normal to the first surface.

Abstract: A weighing and packaging system includes a plurality of weighing machines, a plurality of packaging machines, and a control unit. The plurality of weighing machines are configured to weigh articles supplied thereto. The plurality of packaging machines, each of which forms a weighing and packaging unit with a corresponding weighing machine among the plurality of weighing machines, are configured to receive a supply of the articles weighed and discharged by the corresponding weighing machine, and package the articles supplied thereto. The control unit is configured to, in a case where a problem occurs in at least one of weighing by the weighing machine and packaging by the packaging machine in any of the weighing and packaging units, change processing capacities of the weighing machine and the packaging machine of at least some of the weighing and packaging units other than the weighing and packaging units in which the problem occurs.

Abstract: A weighing and packaging system includes a plurality of weighing machines, a plurality of packaging machines, and a control unit. The plurality of weighing machines are configured to weigh articles supplied thereto. The plurality of packaging machines, each of which forms a weighing and packaging unit with a corresponding weighing machine among the plurality of weighing machines, are configured to receive a supply of the articles weighed and discharged by the corresponding weighing machine, and package the articles supplied thereto. The control unit is configured to, in a case where a problem occurs in at least one of weighing by the weighing machine and packaging by the packaging machine in any of the weighing and packaging units, change processing capacities of the weighing machine and the packaging machine of at least some of the weighing and packaging units other than the weighing and packaging units in which the problem occurs.

Abstract: A resonator device includes a base substrate that is formed of a single crystal semiconductor and includes a first surface, a resonator element attached to the first surface of the base substrate, and a cover that is bonded to the first surface of the base substrate, accommodates the resonator element between the cover and the base substrate, and is formed of a single crystal semiconductor. The base substrate and the cover are bonded through an amorphous layer.

Abstract: A resonator device includes a base, a resonator element attached to the base, a cover accommodating the resonator element between the base and the cover, and a conductive bonding member positioned between the base and the cover and bonding the base to the cover. The base includes a resonator element mount surface on which the resonator element is attached, a first interconnect and a second interconnect that are arranged on the resonator element mount surface and that are electrically coupled to the resonator element, a bonding surface bonded to the cover through the bonding member, and a step between the resonator element mount surface and the bonding surface.

Abstract: A resonator device includes a base substrate including a principal surface, a side surface, and an inclined surface that couples the principal surface to the side surface and that is inclined with respect to the principal surface and the side surface, a resonator element arranged on the principal surface of the base substrate, and a lid that is bonded to the principal surface of the base substrate and accommodates the resonator element between the lid and the base substrate. A bonding area in which the base substrate and the lid are bonded is positioned inside an outer edge of the principal surface.

Abstract: A sensor device includes a pressure sensor including a first diaphragm, and a pressure reference chamber which is positioned on a side opposite to the pressure receiving surface with respect to the first diaphragm and measuring pressure received by the pressure receiving surface, a differential pressure sensor including a second diaphragm which is bent and deformed by pressure reception and of which one surface is a first pressure receiving surface and the other surface is a second pressure receiving surface and measuring differential pressure which is a difference between pressure received by the first pressure receiving surface and pressure received by the second pressure receiving surface, and a correction unit correcting an output of one of the pressure sensor and the differential pressure sensor based on an output of the other of the pressure sensor and the differential pressure sensor.

Abstract: In a projection type display apparatus, a lighting device includes two reflection type cutoff filters (first cutoff filter and reflective second cutoff filter) which block out ultraviolet range light on an output optical path from a light source. A cut on wavelength of the second cutoff filter on the front side is longer than that of the first cutoff filter on the rear side. The two cutoff filters are formed on planar-shaped first faces of a first integrator lens and a second integrator lens. For this reason, both input faces of the two cutoff filters are orthogonal to an apparatus optical axis.

Abstract: In a projection type display apparatus, a lighting device includes two reflection type cutoff filters (first cutoff filter and reflective second cutoff filter) which block out ultraviolet range light on an output optical path from a light source. A cut on wavelength of the second cutoff filter on the front side is longer than that of the first cutoff filter on the rear side. The two cutoff filters are formed on planar-shaped first faces of a first integrator lens and a second integrator lens. For this reason, both input faces of the two cutoff filters are orthogonal to an apparatus optical axis.

Abstract: A damping characteristics control apparatus is provided for a vehicle suspension having a shock absorber mounted between a sprung member and an unsprung member for each wheel. Damping force of the shock absorber is controlled on the basis of damping coefficient obtained by C(absorber)=(Gain*|y?z|/|y?|)*[(T|z?|+L)/|y?z|]p wherein C(absorber); damping coefficient, z?; sprung velocity, y?; unsprung velocity, |y?z|; relative displacement, T; interval time of sprung member moving relative to unsprung member, L; displacement of sprung member stopped against unsprung member, Gain; control gain, p; parameter for determining effective range for control about neutral position of absorber.

Abstract: A liquid crystal device includes: a first substrate; a second substrate that is disposed facing the first substrate; a liquid crystal layer that is sandwiched between the first substrate and the second substrate and is composed of a liquid crystal exhibiting, in an initial alignment state thereof, a vertical alignment and having negative dielectric anisotropy; a light shielding film that is formed on a side of the liquid crystal layer on the first substrate and that corresponds to a non-display region and defining a display region; a pixel electrode that is disposed, on the first substrate, from the display region with a periphery projecting on the light shielding film; a vertical alignment film that is disposed, on the pixel electrode, only in the display region or from the display region with a periphery projecting in the non-display region; and a horizontal alignment film that is disposed, in an area without the vertical alignment film above the light shielding film, with a periphery projecting on the pixe