Abstract: The present technology relates to a wireless communication device and method, and a wireless communication terminal and method which allow for increased transmission opportunities using multi-link aggregation. A communication control device transmits a first parameter and a second parameter. The first parameter is used for setting of communication in which a wireless communication terminal uses a plurality of links. The second parameter is used for setting of communication in which the wireless communication terminal uses a single link. It is possible to apply the present technology to a wireless communication system.

Abstract: An image processing device includes an image processing unit configured to generate a delivery image in which a first area which is a main image area and a second area which is an image area different from the first area are formed in a screen on the basis of a plurality of input images which are images obtained by imaging an event by a plurality of imaging devices. Furthermore, the image processing device includes a control unit configured to control the image processing unit such that control in a plurality of switching control modes is capable of being executed when the input images included in the delivery image are switched, and the captured image displayed in the second area is capable of being switched on the basis of any of a plurality of the switching control modes.

Abstract: When producing a non-oriented electrical steel sheet by subjecting a slab containing predetermined amounts of C, Si, Mn, Al, N, and Cr to hot rolling, hot-band annealing, cold rolling, and finishing annealing in a continuous annealing furnace, the following conditions are used: a maximum reached temperature in the finishing annealing is set to be lower than 900° C.; an average cooling rate from a temperature (maximum reached temperature—50° C.) to 500° C. in a cooling process of the finishing annealing is set to 40° C./s or higher; and a parameter ?/t defined from a plastic elongation ratio ? (%) in a rolling direction between before and after the finishing annealing and a soaking time t (s) in the finishing annealing is set to 0.10 or higher. Thus, a non-oriented electrical steel sheet is obtained.

Abstract: A communication apparatus which performs data communication by bundling multiple bands. The communication apparatus includes a communication section that performs transmission and reception of a wireless signal by using multiple bands, and a control section that controls communication operation of the communication section. The control section performs control such that, after a transmission right has been acquired in a first band, a first signal is transmitted in the first band before a transmission right is acquired in a second band. The control section also performs control such that, when the transmission rights are acquired in both the first band and the second band, data transmission is performed by using the first band and the second band simultaneously. An RTS frame, a CTS frame, a data frame, a busy tone, or the like is transmitted as the first signal.

Abstract: When producing a non-oriented electrical steel sheet by subjecting a slab containing a predetermined composition to hot rolling, hot-band annealing, cold rolling, and finishing annealing in a continuous annealing furnace, the following conditions are used: a maximum reached temperature in the finishing annealing is set to be lower than 900° C.; an average cooling rate from a temperature to 500° C. in a cooling process of the finishing annealing is set to 40° C./s or higher; a parameter ?/t defined from a plastic elongation ratio ? (%) in a rolling direction between before and after the finishing annealing and a soaking time t (s) in the finishing annealing is set to 0.10 or higher; an average ferrite grain size is 50 ?m or larger; and compressive residual stresses ?s and ?c in a sheet width direction at a steel sheet surface and a sheet-thickness center part, respectively, are both 2.0 MPa or higher.

Abstract: The present technique relates to a wireless communication device and a wireless communication method that enable a proper communication setting. A wireless communication device according to an aspect of the present technique includes a control unit configured to: transmit an inter-link interference measurement signal by using a first channel from a first antenna or a second antenna that forms a first link from among a plurality of antennas of a communication unit that communicates with an external communication device through a plurality of links, and measure interference caused by the inter-link interference measurement signal, by using a third antenna or a fourth antenna that forms a second link from among the plurality of antennas.

Abstract: The present technology relates to a wireless communication device, a wireless communication terminal, and a wireless communication method capable of performing UL MU communication with the desired number of terminals. A wireless communication device performs communication with a wireless communication terminal over a plurality of links, and causes a first Trigger frame to be transmitted in a first link, the first Trigger frame including information regarding transmission of a frame in the first link and second information regarding transmission of at least a part of a frame in a second link. The present technology can be applied to a wireless communication system.

Abstract: A carbon nanotube composite is described that can be accurately applied to a desired position by inkjet and a dispersion liquid using the same, where a main object is a carbon nanotube composite in which a conjugated polymer is attached to at least a part of the surface of a carbon nanotube, the conjugated polymer having a side chain represented by general formula (1): wherein R, X and A are defined as described.

Abstract: A flexible wireless communication device with high position accuracy and low cost by a simple process is described, including a wireless communication device and a method for manufacturing a wireless communication device formed by bonding a first film substrate on which at least a circuit is formed and a second film substrate on which an antenna is formed, in which the circuit includes a transistor, and the transistor is formed by a step of forming a conductive pattern on the first film substrate, a step of forming an insulating layer on the film substrate on which the conductive pattern is formed, and a step of applying a solution including an organic semiconductor and/or a carbon material on the insulating layer and drying the solution to form a semiconductor layer.

Abstract: A carbon nanotube composite is described that can be accurately applied to a desired position by inkjet and a dispersion liquid using the same, where a main object is a carbon nanotube composite in which a conjugated polymer is attached to at least a part of the surface of a carbon nanotube, the conjugated polymer having a side chain represented by general formula (1): wherein R, X and A are defined as described.

Abstract: A multilayer chip varistor is provided as one capable of suppressing production of cracks and thereby preventing a connection failure between an internal electrode and a through-hole conductor. An internal electrode 21 is so configured as to be curved toward a direction of penetration of a through hole 10 in a connection portion 28 thereof to a through-hole conductor 27. By this configuration, a region T sandwiched between a curved surface 28a of the connection portion 28 and the through-hole conductor 27 is formed in a varistor layer 9 near the connection portion 28. In this region T, a metal concentration thereof becomes higher because of diffusion of metal of the internal electrode 21 and the through-hole conductor 27 into the varistor layer 9, and therefore, after completion of firing, the region T has an intermediate contraction percentage between that of the internal electrode 21 and through-hole conductor 27 and that of the other region of the varistor layer 9.

Abstract: An aggregate substrate has a first varistor part, a second varistor part, and a heat dissipation layer. The first varistor part includes a first varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of first internal electrodes juxtaposed in the first varistor element layer. The second varistor part includes a second varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of second internal electrodes juxtaposed in the second varistor element layer. The heat dissipation layer is located between the first and second varistor parts and is in contact with the first and second varistor parts.

Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.

Abstract: In a varistor, a heat radiating portion contains the same components as ZnO that is the main component of a varistor element body, as metal oxides, thereby, the structural components of the varistor element body and the heat radiating portion are caused to be common. During firing, Ag contained in the heat radiating portion diffuses into the grain boundaries of ZnO, near the interface between surfaces of the heat radiating portion and the varistor element body. Consequently, in the varistor, cracks hardly occur between the varistor portion and the heat radiating portion during firing (or during binder removal), thereby, ensuring sufficient bonding strength between the varistor portion and the heat radiating portion. Therefore, heat conducted to the varistor portion is radiated efficiently conducting through electrically conducted paths formed in the heat radiating portion from the surface facing the varistor element body to other three surfaces of the heat radiating portion.

Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.

Abstract: A multilayer chip varistor is provided as one having excellent heat radiation performance. A thickness between a first principal face 3 and an outermost internal electrode layer 11A is smaller than a thickness between an internal electrode layer 21 and the outermost internal electrode layer 11A, and because of this configuration, heat generated from a bottom face of a semiconductor light emitting device LE1 is efficiently transferred to the outermost internal electrode layer 11A having a high thermal conductivity. Furthermore, in the multilayer chip varistor V1 of an electronic component EC1, the outermost internal electrode layer 11A has a first internal electrode 13 electrically connected to a first connection electrode 7 and a first terminal electrode 5 through first through-hole conductors 17, and a second internal electrode 15 electrically connected to a second connection electrode 8 and a second terminal electrode 6 through second through-hole conductors 27.

Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.

Abstract: A multilayer chip varistor is provided as one having excellent heat radiation performance. A thickness between a first principal face 3 and an outermost internal electrode layer 11A is smaller than a thickness between an internal electrode layer 21 and the outermost internal electrode layer 11A, and because of this configuration, heat generated from a bottom face of a semiconductor light emitting device LE1 is efficiently transferred to the outermost internal electrode layer 11A having a high thermal conductivity. Furthermore, in the multilayer chip varistor V1 of an electronic component EC1, the outermost internal electrode layer 11A has a first internal electrode 13 electrically connected to a first connection electrode 7 and a first terminal electrode 5 through first through-hole conductors 17, and a second internal electrode 15 electrically connected to a second connection electrode 8 and a second terminal electrode 6 through second through-hole conductors 27.

Abstract: A multilayer chip varistor is provided as one capable of suppressing production of cracks and thereby preventing a connection failure between an internal electrode and a through-hole conductor. An internal electrode 21 is so configured as to be curved toward a direction of penetration of a through hole 10 in a connection portion 28 thereof to a through-hole conductor 27. By this configuration, a region T sandwiched between a curved surface 28a of the connection portion 28 and the through-hole conductor 27 is formed in a varistor layer 9 near the connection portion 28. In this region T, a metal concentration thereof becomes higher because of diffusion of metal of the internal electrode 21 and the through-hole conductor 27 into the varistor layer 9, and therefore, after completion of firing, the region T has an intermediate contraction percentage between that of the internal electrode 21 and through-hole conductor 27 and that of the other region of the varistor layer 9.

Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.