Patents by Inventor Ryukichi Ikeda

Ryukichi Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7087315
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: August 8, 2006
    Assignees: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., Ltd.
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • Publication number: 20050042868
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Application
    Filed: September 21, 2004
    Publication date: February 24, 2005
    Applicants: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., LTD
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • Patent number: 6811672
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: November 2, 2004
    Assignees: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., Ltd.
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • Publication number: 20030003320
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Application
    Filed: June 25, 2002
    Publication date: January 2, 2003
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • Patent number: 5364449
    Abstract: A process for refining a crude material for copper or copper alloy which contains as impurity elements at least one species of Pb, Ni, Sb, S, Bi, and As in combination with at least one species of Sn, Fe, and Zn, which comprises the sequential steps of (1) melting a crude material for copper or copper alloy, (2a) increasing the oxygen concentration in the melt, thereby oxidizing Sn, Fe, and Zn into slag, (this step is carried out if the crude material contains as impurity elements at least one species of Sn, Fe, and Zn) (2b) adding to the melt at least one species selected from the group consisting of Fe, Fe oxide, Mn, and Mn oxide, thereby causing Pb, Ni, Sb, S, Bi, and As in the melt to slag in the form of compound oxide of Fe and/or Mn, (3) removing the thus formed slag from the melt, and (4) subjecting the melt to reduction.
    Type: Grant
    Filed: March 15, 1993
    Date of Patent: November 15, 1994
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Takashi Nakamura, Kenji Osumi, Kiyomasa Oga, Motohiro Arai, Ryukichi Ikeda, Eiji Yoshida, Hirofumi Okada, Ryusuke Hamanaka