Patents by Inventor Ryuma Mizusawa

Ryuma Mizusawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200201181
    Abstract: A negative-tone photosensitive resin composition containing an epoxy group-containing resin, a cationic polymerization initiator, and a polyfunctional thiol compound.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 25, 2020
    Inventors: Hirofumi IMAI, Ryuma MIZUSAWA, Ryosuke NAKAMURA, Takahiro KONDO
  • Patent number: 7402376
    Abstract: A photosensitive resin composition which gives a dry film having a sand blast proof property and a development property in a well-balanced manner. A photosensitive resin composition containing a carboxy group-containing urethane (meth)acrylate compound having two or more of (meth)acryloyl groups per molecule whose acid value of less than 10 mg KOH/g, an alkali soluble polymer compound, a photopolymerization initiator and a photopolymerizable compound (D) including in the structure thereof a structural unit represented by the formula (I) gives such a well-balanced properties.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: July 22, 2008
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Syunji Nakazato, Ryuma Mizusawa, Hiroyuki Obiya, Takashi Ono, Yusuke Fujito
  • Publication number: 20050238998
    Abstract: A photosensitive resin composition which gives a dry film having a sand blast proof property and a development property in a well-balanced manner. A photosensitive resin composition containing a carboxy group-containing urethane (meth)acrylate compound having two or more of (meth)acryloyl groups per molecule whose acid value of less than 10 mg KOH/g, an alkali soluble polymer compound, a photopolymerization initiator and a photopolymerizable compound (D) including in the structure thereof a structural unit represented by the formula (I) gives such a well-balanced properties.
    Type: Application
    Filed: April 5, 2005
    Publication date: October 27, 2005
    Inventors: Syunji Nakazato, Ryuma Mizusawa, Hiroyuki Obiya, Takashi Ono, Yusuke Fujito
  • Patent number: 6897011
    Abstract: A photosensitive composition for sandblasting comprising the components of: (A) a photopolymerizable urethane (meth)acrylate oligomer comprising (meth)acryloyl group; (B) an acrylic copolymer; and (C) a photopolymerization initiator, wherein the component (B) comprises, as a monomer unit, one of copolymerizable monomers comprising one of a benzene ring and a cyclohexyl group.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: May 24, 2005
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akira Kumazawa, Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya
  • Publication number: 20040175659
    Abstract: A photosensitive composition for sandblasting comprising the components of: (A) a photopolymerizable urethane (meth)acrylate oligomer comprising (meth)acryloyl group; (B) an acrylic copolymer; and (C) a photopolymerization initiator, wherein the component (B) comprises, as a monomer unit, one of copolymerizable monomers comprising one of a benzene ring and a cyclohexyl group.
    Type: Application
    Filed: March 16, 2004
    Publication date: September 9, 2004
    Applicant: Tokyo Ohka Kogyo Co., Ltd., a Japan corporation
    Inventors: Akira Kumazawa, Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya
  • Publication number: 20020076652
    Abstract: A photosensitive composition for sandblasting comprising the components of: (A) a photopolymerizable urethane (meth)acrylate oligomer comprising (meth)acryloyl group; (B) an acrylic copolymer; and (C) a photopolymerization initiator, wherein the component (B) comprises, as a monomer unit, one of copolymerizable monomers comprising one of a benzene ring and a cyclohexyl group.
    Type: Application
    Filed: November 6, 2001
    Publication date: June 20, 2002
    Inventors: Akira Kumazawa, Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya
  • Patent number: 6322947
    Abstract: A photosensitive composition for sandblasting and a photosensitive film laminate having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising (A) a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups and a structural unit represented by formula: (B) an alkali-soluble compound, and (C) a photopolymerization initiator.
    Type: Grant
    Filed: August 13, 1999
    Date of Patent: November 27, 2001
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Ryuma Mizusawa, Shinkichi Asahi, Syunzi Nakazato, Hiroyuki Obiya
  • Patent number: 6200733
    Abstract: A photosensitive composition for sandblasting and a photosensitive film having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups, a photopolymerization initiator, and at least one cellulose derivative selected from the group consisting of hydroxypropyl cellulose, ethylhydroxyethyl cellulose, hydroxypropylmethyl cellulose phthalate, and hydroxypropylmethyl cellulose acetate phthalate. The composition exhibits excellent adhesion to a substrate, high sensitivity, and high resistance to sandblasting.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: March 13, 2001
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya
  • Patent number: 5924912
    Abstract: Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photolithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.
    Type: Grant
    Filed: February 4, 1998
    Date of Patent: July 20, 1999
    Assignees: Matsushita Electronics Corporation, Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hiroshi Takehana, Tetsuo Yamamoto, Hiroyuki Obiya, Ryuma Mizusawa
  • Patent number: 5919569
    Abstract: A photosensitive resin composition comprising the following components (A), (B), (C) and (D): (A) a photopolymerizable urethane (meth)acrylate compound containing at least two acryloyl or methacryloyl groups, (B) an alkali-soluble polymer compound having an acid value of from 50 to 250 mgKOH/g, and (C) a photopolymerization initiator, (D) a polymeric complex of an alkali thioxanate wherein the photosensitive resin composition has an electrical insulation resistance of 8.0.times.10.sup.9 to 1.0.times.10.sup.14 .OMEGA..multidot.cm after photocuring. A photosensitive resin laminated film comprising a flexible film, a photosensitive layer provided on the flexible film, and a releasable film layer provided on the photosensitive layer, wherein the photosensitive layer comprises the above photosensitive resin composition.
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: July 6, 1999
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hiroyuki Obiya, Ryuma Mizusawa
  • Patent number: 5916738
    Abstract: Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photolithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.
    Type: Grant
    Filed: February 4, 1998
    Date of Patent: June 29, 1999
    Assignees: Matsushita Electronics Corporation, Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hiroshi Takehana, Tetsuo Yamamoto, Hiroyuki Obiya, Ryuma Mizusawa
  • Patent number: 5776995
    Abstract: A photosensitive resin composition comprising the following components (A), (B) and (C): (A) a photopolymerizable urethane (meth)acrylate compound containing at least two acryloyl or methacryloyl groups, (B) an alkali-soluble polymer compound having an acid value of from 50 to 250 mgKOH/g, and (C) a photopolymerization initiator, wherein the photosensitive resin composition has an electrical insulation resistance of 8.0.times.10.sup.9 to 1.0.times.1.0.sup.14 .OMEGA..multidot.cm after photocuring. A photosensitive resin laminated film comprising a flexible film, a photosensitive layer provided on the flexible film, and a releasable film layer provided on the photosensitive layer, wherein the photosensitive layer comprises the above photosensitive resin composition.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: July 7, 1998
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hiroyuki Obiya, Ryuma Mizusawa
  • Patent number: 5756261
    Abstract: Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photo-lithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: May 26, 1998
    Assignees: Matsushita Electronics Corporation, Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hiroshi Takehana, Tetsuo Yamamoto, Hiroyuki Obiya, Ryuma Mizusawa