Patents by Inventor Sachin Deshpande

Sachin Deshpande has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210102842
    Abstract: A processing system of a mobile device acquires an image of an object of a target color, wherein the image was captured by an integrated digital camera of the mobile device, calculates a first plurality of values that describes the target color, and wherein the calculating is based on an analysis of a pixel of the image, and identifies a first candidate color from among a plurality of candidate colors, wherein each candidate color in the plurality of candidate colors is associated with a second set of values that describes the each candidate color, and wherein the second set of values describing the first candidate color matches the first set of values more closely than any second set of values associated with another candidate color of the plurality of candidate colors.
    Type: Application
    Filed: October 2, 2019
    Publication date: April 8, 2021
    Inventors: Hong Wei, Sachin Deshpande, Taeyoung Park
  • Patent number: 7801635
    Abstract: The invention can provide a method of etch processing a wafer using a Real-Time Parameter Tuning (RTPT) procedure to receive an input message that can include a pass-through message, a real-time feedforward message, or a real-time optimization message, or any combination thereof. The RTPT procedures can use real-time wafer data to create, modify, and/or use etch recipe data, etch profile data, and/or etch model data. In addition, RTPT procedures can use real-time wafer data to create, modify, and/or use process recipe data, process profile data, and/or process model data.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: September 21, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Merritt Funk, Sachin Deshpande, Kevin Lally
  • Patent number: 7642102
    Abstract: The invention can provide a method of processing a wafer using a Real-Time Parameter Tuning (RTPT) procedure to receive an input message that can include a pass-through message, a real-time feedforward message, or a real-time optimization message, or any combination thereof. The RTPT procedures can use real-time wafer thickness data to create, modify, and/or use measurement recipe data, measurement profile data, and/or measurement model data. In addition, RTPT procedures can use real-time wafer thickness data to create, modify, and/or use process recipe data, process profile data, and/or process model data.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: January 5, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Merritt Funk, Sachin Deshpande, Kevin Lally
  • Patent number: 7571074
    Abstract: A method for facilitating an ODP (optical digital profile) measurement of a semiconductor wafer. The method includes obtaining real time wafer characteristic data for a measurement site on the wafer and detecting a measured diffraction signal from a structure within the measurement site of the wafer. The measured diffraction signal is matched with a simulated diffraction signal stored in a wafer characteristic dependent profile library. A hypothetical profile structure associated with the simulated diffraction signal in the wafer characteristic dependent profile library is then identified. The real time wafer characteristic data is used to facilitate at least one of the matching and identifying. The real time wafer characteristic data may be real time wafer thickness data.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: August 4, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Merritt Funk, Sachin Deshpande, Kevin Lally
  • Patent number: 7517708
    Abstract: The invention can provide a method of processing a wafer using a Real-Time Parameter Tuning (RTPT) procedure to receive an input message that can include a pass-through message, a real-time feedforward message, or a real-time optimization message, or any combination thereof. The RTPT procedures can use real-time wafer temperature data to create, modify, and/or use measurement recipe data, measurement profile data, and/or measurement model data. In addition, RTPT procedures can use real-time wafer temperature data to create, modify, and/or use process recipe data, process profile data, and/or process model data.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: April 14, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Sachin Deshpande, Merritt Funk
  • Patent number: 7515283
    Abstract: In processing requests for wafer structure profile determination from optical metrology measurements, a plurality of measured diffraction signal of a plurality of structures formed on one or more wafers is obtained. The plurality of measured diffraction signals is distributed to a plurality of instances of a profile search module. The plurality of instances of the profile search model is activated in one or more processing threads of one or more computer systems. The plurality of measured diffraction signals is processed in parallel using the plurality of instances of the profile search module to determine profiles of the plurality of structures corresponding to the plurality of measured diffraction signals.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: April 7, 2009
    Assignee: Tokyo Electron, Ltd.
    Inventors: Tri Thanh Khuong, Junwei Bao, Jeffrey Alexander Chard, Wei Liu, Ying Zhu, Sachin Deshpande, Pranav Sheth, Hong Qiu
  • Publication number: 20090063280
    Abstract: A request to initiate delivery of content via a messaging services protocol to a mobile phone can be received. Thereafter, content and one or more advertisements associated with the request can be obtained. The content and the one or more advertisements can optionally be converted into a baseline format. The content and the one or more advertisements can be integrated to generate an integrated media file, the integrated media file substantially conforming to content delivery specifications for the mobile phone. Thereafter, delivery of a packet data unit encapsulating the integrated media file to the mobile phone via the messaging services protocol can be initiated. In some variations, the integrated media file can be modified to make it actionable. Related apparatus, systems, techniques and articles are also described.
    Type: Application
    Filed: September 4, 2008
    Publication date: March 5, 2009
    Inventors: Charles Stewart Wurster, Sachin Deshpande
  • Patent number: 7487136
    Abstract: A local computer sends out mount requests to remote computers for identifying folders or files that are available for sharing (shares). The local computer sends out the mount requests without previously discovering if the folders or files exist or are available for sharing on the remote computers. Any of the folders or files that are successfully mounted are identified as available for sharing.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: February 3, 2009
    Assignee: Sharp Laboratories of America
    Inventor: Sachin Deshpande
  • Patent number: 7469192
    Abstract: A system to process requests for wafer structure profile determination from optical metrology measurements off a plurality of structures formed on one or more wafer includes a diffraction signal processor, a diffraction signal distributor, and a plurality of profile search servers. The diffraction signal processor is configured to obtain a plurality of measured diffraction signals of the plurality of structures. The diffraction signal distributor is coupled to the diffraction signal processor. The diffraction signal processor is configured to transmit the plurality of measured diffraction signals to the diffraction signal distributor. The plurality of profile search servers is coupled to the diffraction signal distributor. The diffraction signal distributor is configured to distribute the plurality of measured diffraction signals to the plurality of profile search servers.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: December 23, 2008
    Assignee: Tokyo Electron Ltd.
    Inventors: Tri Thanh Khuong, Junwei Bao, Jeffrey A. Chard, Wei Liu, Ying Zhu, Sachin Deshpande, Pranav Sheth, Hong Qiu
  • Publication number: 20080282760
    Abstract: A bending apparatus consisting of a rocker rotating in a hybrid constructed saddle. The saddle is preferably made of a steel casing with a low friction liner disposed therein.
    Type: Application
    Filed: May 8, 2008
    Publication date: November 20, 2008
    Applicant: DANLY IEM, LLC
    Inventors: Victor L. Chun, Sachin Deshpande, Gowrishankar Vijayakumar, Brian Russel
  • Patent number: 7451054
    Abstract: A method for facilitating an ODP measurement of a semiconductor wafer. The method includes obtaining real time wafer characteristic data for a measurement site on said wafer and detecting a measured diffraction signal from a structure within the measurement site of the wafer. The measured diffraction signal is matched with a simulated diffraction signal stored in a wafer characteristic dependent profile library. A hypothetical profile structure associated with the simulated diffraction signal in the wafer characteristic dependent profile library is then identified. The real time wafer characteristic data is used to facilitate at least one of the matching and identifying.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: November 11, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Sachin Deshpande, Merritt Funk
  • Publication number: 20080233930
    Abstract: Media can be optimized for delivery via a messaging paradigm to a plurality of mobile communications handsets. In some implementations, advertisements are coupled to the media and delivered in a single message. Such advertisements can also be optimized for the recipient mobile communications handset. Related apparatus, systems, methods, and articles are also described.
    Type: Application
    Filed: March 21, 2008
    Publication date: September 25, 2008
    Inventors: Charles Stewart Wurster, Sachin Deshpande
  • Publication number: 20080183312
    Abstract: The invention can provide a method of etch processing a wafer using a Real-Time Parameter Tuning (RTPT) procedure to receive an input message that can include a pass-through message, a real-time feedforward message, or a real-time optimization message, or any combination thereof. The RTPT procedures can use real-time wafer data to create, modify, and/or use etch recipe data, etch profile data, and/or etch model data. In addition, RTPT procedures can use real-time wafer data to create, modify, and/or use process recipe data, process profile data, and/or process model data.
    Type: Application
    Filed: January 30, 2007
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Merritt Funk, Sachin Deshpande, Kevin Lally
  • Publication number: 20080183412
    Abstract: The invention can provide a method of processing a wafer using a Real-Time Parameter Tuning (RTPT) procedure to receive an input message that can include a pass-through message, a real-time feedforward message, or a real-time optimization message, or any combination thereof. The RTPT procedures can use real-time wafer thickness data to create, modify, and/or use measurement recipe data, measurement profile data, and/or measurement model data. In addition, RTPT procedures can use real-time wafer thickness data to create, modify, and/or use process recipe data, process profile data, and/or process model data.
    Type: Application
    Filed: January 30, 2007
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Merritt Funk, Sachin Deshpande, Kevin Lally
  • Publication number: 20080182343
    Abstract: The invention can provide a method of processing a wafer using a Real-Time Parameter Tuning (RTPT) procedure to receive an input message that can include a pass-through message, a real-time feedforward message, or a real-time optimization message, or any combination thereof. The RTPT procedures can use real-time wafer temperature data to create, modify, and/or use measurement recipe data, measurement profile data, and/or measurement model data. In addition, RTPT procedures can use real-time wafer temperature data to create, modify, and/or use process recipe data, process profile data, and/or process model data.
    Type: Application
    Filed: January 30, 2007
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Sachin Deshpande, Merritt Funk
  • Publication number: 20080183411
    Abstract: A method for facilitating an ODP measurement of a semiconductor wafer. The method includes obtaining real time wafer characteristic data for a measurement site on said wafer and detecting a measured diffraction signal from a structure within the measurement site of the wafer. The measured diffraction signal is matched with a simulated diffraction signal stored in a wafer characteristic dependent profile library. A hypothetical profile structure associated with the simulated diffraction signal in the wafer characteristic dependent profile library is then identified. The real time wafer characteristic data is used to facilitate at least one of the matching and identifying. The real time wafer characteristic data may be real time wafer thickness data.
    Type: Application
    Filed: January 30, 2007
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Merritt Funk, Sachin Deshpande, Kevin Lally
  • Publication number: 20080183413
    Abstract: A method for facilitating an ODP measurement of a semiconductor wafer. The method includes obtaining real time wafer characteristic data for a measurement site on said wafer and detecting a measured diffraction signal from a structure within the measurement site of the wafer. The measured diffraction signal is matched with a simulated diffraction signal stored in a wafer characteristic dependent profile library. A hypothetical profile structure associated with the simulated diffraction signal in the wafer characteristic dependent profile library is then identified. The real time wafer characteristic data is used to facilitate at least one of the matching and identifying.
    Type: Application
    Filed: January 30, 2007
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Sachin Deshpande, Merritt Funk
  • Patent number: 7366720
    Abstract: A distributed share folder & file discovery system allows different local computers to discover hosts and share folders without having to go through a central master browser. The local computer sends a device name query directly to any remote devices connected to a same network. The local computer then sends out a share query to the remote devices identified during the device name query to identify any folders or files that are available for sharing (shares). The local computer assembles a list of shares available on the remote devices and mounts any of the shares that are selected from the list.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: April 29, 2008
    Assignee: Sharp Laboratories of America
    Inventor: Sachin Deshpande
  • Publication number: 20080015812
    Abstract: A system to process requests for wafer structure profile determination from optical metrology measurements off a plurality of structures formed on one or more wafer includes a diffraction signal processor, a diffraction signal distributor, and a plurality of profile search servers. The diffraction signal processor is configured to obtain a plurality of measured diffraction signals of the plurality of structures. The diffraction signal distributor is coupled to the diffraction signal processor. The diffraction signal processor is configured to transmit the plurality of measured diffraction signals to the diffraction signal distributor. The plurality of profile search servers is coupled to the diffraction signal distributor. The diffraction signal distributor is configured to distribute the plurality of measured diffraction signals to the plurality of profile search servers.
    Type: Application
    Filed: July 11, 2006
    Publication date: January 17, 2008
    Applicant: Tokyo Electron Limited
    Inventors: Tri Thanh Khuong, Junwei Bao, Jeffrey A. Chard, Wei Liu, Ying Zhu, Sachin Deshpande, Pranav Sheth, Hong Qui
  • Publication number: 20080013108
    Abstract: In processing requests for wafer structure profile determination from optical metrology measurements, a plurality of measured diffraction signal of a plurality of structures formed on one or more wafers is obtained. The plurality of measured diffraction signals is distributed to a plurality of instances of a profile search module. The plurality of instances of the profile search model is activated in one or more processing threads of one or more computer systems. The plurality of measured diffraction signals is processed in parallel using the plurality of instances of the profile search module to determine profiles of the plurality of structures corresponding to the plurality of measured diffraction signals.
    Type: Application
    Filed: July 11, 2006
    Publication date: January 17, 2008
    Applicant: Tokyo Electron Limited
    Inventors: Tri Thanh Khuong, Junwei Bao, Jeffrey A. Chard, Wei Liu, Ying Zhu, Sachin Deshpande, Pranav Sheth, Hong Qiu