Patents by Inventor Saeed Momenpour
Saeed Momenpour has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7550985Abstract: A testing apparatus, system and method for testing computer memory modules are disclosed. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.Type: GrantFiled: July 27, 2006Date of Patent: June 23, 2009Assignee: Micron Technology, Inc.Inventors: Steven J. Brunelle, Saeed Momenpour
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Patent number: 7326066Abstract: An adapter and method for aligning and connecting the external leads of at least one integrated circuit device to conductors on a substrate of a multi-chip module. The adapter includes a component frame configured to receive the integrated circuit device. The component frame is attached to a support member. The support member with attached component frame is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit device are aligned with corresponding conductors on the multi-chip module substrate. A second support member, which may also have a component frame attached thereto, is placed over the opposing side of the multi-chip module substrate. The ends of the first support member are attached to the ends of the second support member such that the external leads of the IC device are forced into electrical contact with the corresponding conductors on the multi-chip module substrate.Type: GrantFiled: December 2, 2004Date of Patent: February 5, 2008Assignee: Micron Technology, Inc.Inventors: Saeed Momenpour, Steven J. Brunelle
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Patent number: 7202681Abstract: A testing apparatus, system and method for testing computer memory modules are disclosed. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.Type: GrantFiled: August 27, 2004Date of Patent: April 10, 2007Assignee: Micron Technology, Inc.Inventors: Steven J. Brunelle, Saeed Momenpour
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Publication number: 20060261839Abstract: A testing apparatus, system and method for testing computer memory modules are disclosed. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.Type: ApplicationFiled: July 27, 2006Publication date: November 23, 2006Inventors: Steven Brunelle, Saeed Momenpour
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Publication number: 20050028041Abstract: A testing apparatus, system and method for testing computer memory modules. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.Type: ApplicationFiled: August 27, 2004Publication date: February 3, 2005Inventors: Steven Brunelle, Saeed Momenpour
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Patent number: 6843661Abstract: An adapter and method for aligning and non-permanently connecting the external leads of a plurality of integrated circuit devices to conductors on a substrate of a multi-chip module. The adapter includes a plurality of component frames, each component frame being configured to receive at least one integrated circuit device. The plurality of component frames is attached to at least one support member. The support member with attached component frames is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit devices are aligned with corresponding conductors on the multi-chip module substrate. A second support member, which may also have component frames attached thereto, is placed over the opposing side of the multi-chip module substrate.Type: GrantFiled: August 29, 2002Date of Patent: January 18, 2005Assignee: Micron Technology, Inc.Inventors: Saeed Momenpour, Steven J. Brunelle
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Patent number: 6788081Abstract: A testing apparatus system and method for testing computer memory modules. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.Type: GrantFiled: July 18, 2001Date of Patent: September 7, 2004Assignee: Micron Technology, Inc.Inventors: Steven J. Brunelle, Saeed Momenpour
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Patent number: 6721195Abstract: A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.Type: GrantFiled: July 12, 2001Date of Patent: April 13, 2004Assignee: Micron Technology, Inc.Inventors: Steven J. Brunelle, Saeed Momenpour
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Patent number: 6693816Abstract: A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module is disclosed. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing the memory modules in multimotherboard test systems is also described. The invention further includes a method of converting a conventional motherboard and memory socket assembly for such testing.Type: GrantFiled: January 13, 2003Date of Patent: February 17, 2004Assignee: Micron Technology, Inc.Inventors: Steven J. Brunelle, Saeed Momenpour
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Patent number: 6693817Abstract: A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module is disclosed. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing the memory modules in multimotherboard test systems is also described. The invention further includes a method of converting a conventional motherboard and memory socket assembly for such testing.Type: GrantFiled: January 13, 2003Date of Patent: February 17, 2004Assignee: Micron Technology, Inc.Inventors: Steven J. Brunelle, Saeed Momenpour
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Publication number: 20030137862Abstract: A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing the memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.Type: ApplicationFiled: January 13, 2003Publication date: July 24, 2003Inventors: Steven J. Brunelle, Saeed Momenpour
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Publication number: 20030107365Abstract: A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing the memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.Type: ApplicationFiled: January 13, 2003Publication date: June 12, 2003Inventors: Steven J. Brunelle, Saeed Momenpour
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Publication number: 20030016040Abstract: A testing apparatus, system and method for testing computer memory modules. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote-memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.Type: ApplicationFiled: July 18, 2001Publication date: January 23, 2003Inventors: Steven J. Brunelle, Saeed Momenpour
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Publication number: 20030011391Abstract: A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.Type: ApplicationFiled: July 12, 2001Publication date: January 16, 2003Inventors: Steven J. Brunelle, Saeed Momenpour
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Publication number: 20020196598Abstract: An adapter and method for aligning and non-permanently connecting the external leads of a plurality of integrated circuit devices to conductors on a substrate of a multi-chip module. The adapter includes a plurality of component frames, each component frame being configured to receive at least one integrated circuit device. The plurality of component frames is attached to at least one support member. The support member with attached component frames is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit devices are aligned with corresponding conductors on the multi-chip module substrate. A second support member, which may also have component frames attached thereto, is placed over the opposing side of the multi-chip module substrate.Type: ApplicationFiled: August 29, 2002Publication date: December 26, 2002Inventors: Saeed Momenpour, Steven J. Brunelle
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Patent number: 6464513Abstract: An adapter and method for aligning and non-permanently connecting the external leads of a plurality of integrated circuit devices to conductors on a substrate of a multi-chip module. The adapter includes a plurality of component frames, each component frame being configured to receive at least one integrated circuit device. The plurality of component frames is attached to at least one support rod. The support rod with attached component frames is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit devices are aligned with corresponding conductors on the multi-chip module substrate. A second support rod, which may also have component frames attached thereto, is placed over the opposing side of the multi-chip module substrate.Type: GrantFiled: January 5, 2000Date of Patent: October 15, 2002Assignee: Micron Technology, Inc.Inventors: Saeed Momenpour, Steven J. Brunelle