Abstract: An example programmable integrated circuit (IC) includes a processor, a plurality of endpoint circuits, a network-on-chip (NoC) having NoC master units (NMUs), NoC slave units (NSUs), NoC programmable switches (NPSs), a plurality of registers, and a NoC programming interface (NPI). The processor is coupled to the NPI and is configured to program the NPSs by loading an image to the registers through the NPI for providing physical channels between NMUs to the NSUs and providing data paths between the plurality of endpoint circuits.

Abstract: An example programmable integrated circuit (IC) includes a processing system having a processor, a master circuit, and a system memory management unit (SMMU). The SMMU includes a first translation buffer unit (TBU) coupled to the master circuit, an address translation (AT) circuit, an AT interface coupled to the AT circuit, and a second TBU coupled to the AT circuit, and programmable logic coupled to the AT circuit in the SMMU through the AT interface.

Abstract: Techniques related to a high bandwidth interface (HBI) for communication between multiple host devices on an interposer are described. In an example, the HBI repurposes a portion of the high bandwidth memory (HBM) interface, such as the physical layer. A computing system is provided. The computing system includes a first host device and at least a second host device. The first host device is a first die on an interposer and the second host device is a second die on the interposer. The first host device and the second host device are interconnected via at least one HBI. The HBI implements a layered protocol for communication between the first host device and the second host device. The layered protocol includes a physical layer protocol that is configured according to a HBM physical layer protocol.

Abstract: Examples of the present disclosure generally relate to integrated circuits, such as a system-on-chip (SoC), that include a memory subsystem. In some examples, an integrated circuit includes a first master circuit in a first power domain on a chip; a second master circuit in a second power domain on the chip; and a first memory controller in a third power domain on the chip. The first master circuit and the second master circuit each are configured to access memory via the first memory controller. The first power domain and the second power domain each are separate and independent from the third power domain.

Abstract: An example method of generating a configuration for a network on chip (NoC) in a programmable device includes: receiving traffic flow requirements for a plurality of traffic flows; assigning routes through the NoC for each traffic flow based on the traffic flow requirements; determining arbitration settings for the traffic flows along the assigned routes; generating programming data for the NoC; and loading the programming data to the programmable device to configure the NoC.

Abstract: An example integrated circuit (IC) includes a network-on-chip (NoC), a master device coupled to the NoC, a memory controller coupled to the NoC configured to control a memory coupled to the IC, and an inline error-correcting code (ECC) circuit coupled to the NoC. The ECC circuit is configured to receive read and write transactions from the master device that target the memory, compute ECC data based on the read and write transactions, and provide outgoing transactions to the memory controller.

Abstract: An example integrated circuit (IC) includes a network-on-chip (NoC), a master device coupled to the NoC, a memory controller coupled to the NoC configured to control a memory coupled to the IC, and an inline error-correcting code (ECC) circuit coupled to the NoC. The ECC circuit is configured to receive read and write transactions from the master device that target the memory, compute ECC data based on the read and write transactions, and provide outgoing transactions to the memory controller.

Abstract: A disclosed network on chip includes a semiconductor die and switches disposed on the semiconductor die. Each switch has ports configured to receive packets from and transmit packets to at least two other switches. Each switch includes first circuitry that specifies a first mapping of interface identifiers of interfaces on the semiconductor die to port identifiers, and second circuitry that specifies a second mapping of region identifiers of regions of the semiconductor die to port identifiers. Each switch further includes third circuitry coupled to the first and second circuitry. The third circuitry is configured to select, in response to an input packet that specifies a destination region and a destination interface, a port based on the specification of the destination region, specification of the destination interface, first mapping, and second mapping, and output the packet on the selected port.

Abstract: Methods and systems are disclosed for transferring data using descriptors to reference memory locations at which data is to be written to or read from. Each descriptor references a respective linked list of descriptor blocks. Each of the descriptor blocks includes a contiguous portion of the memory that stores a plurality of addresses, at which data is to be written to or read from. In response to receiving the data transfer request, a set of data is transferred from a first set of addresses specified in a first descriptor to a second set of addresses specified in a second descriptor by traversing the linked lists of descriptor blocks in the first and second descriptors.

Abstract: Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to a qualified stacked silicon interconnect (SSI) technology programmable integrated circuit (IC) region by providing an interface (e.g., an HBM buffer region implemented with a hierarchical switch network) between the added feature device and the programmable IC region. One example apparatus generally includes a programmable IC region and an interface region configured to couple the programmable IC region to at least one fixed feature die via a first plurality of ports associated with the at least one fixed feature die and a second plurality of ports associated with the programmable IC region. The interface region is configured as a switch network between the first plurality of ports and the second plurality of ports, and the switch network includes a plurality of full crossbar switch networks.

Abstract: Various example implementations are directed to circuits and methods for communicating between disparate processor circuits. According to an example implementation, a circuit arrangement includes a plurality of processor circuits and an inter-processor communication circuit. The inter-processor communication circuit is configured to provide, for each pair of the processor circuits, a respective communication channel between the pair of processor circuits. The inter-processor communication circuit includes a plurality of buffers including a respective first buffer and a respective second buffer for each communication channel. An access control circuit included in the inter-processor communication circuit is configured to restrict write access to the respective first buffer to the first processor circuit and restrict write access to the respective second buffer to the second processor circuit.

Abstract: In an example, a circuit to manage memory between a first and second microprocessors each of which is coupled to a control circuit, includes: first and second memory circuits; and a switch circuit coupled to the first and second memory circuits, and memory interfaces of the first and second microprocessors, the switch circuit having a mode signal as input. The switch is configured to selectively operate in one of a first mode or a second mode based on the mode signal such that, in the first mode, the switch circuit couples the first memory circuit to the memory interface of the first microprocessor and the second memory circuit to the memory interface of the second microprocessor and, in the second mode, the switch circuit selectively couples the first or second memory circuits to the memory interface of either the first or second microprocessor.

Abstract: Presented systems and methods can facilitate efficient voltage sensing and regulation. In one embodiment, a presented multiple point voltage sensing system includes Multiple point voltage sensing. Multi-point sensing is the scheme where voltage feedback from Silicon to the voltage regulator is an average from multiple points on the die. In one embodiment, multi-point sensing is done by placing multiple sense points across the partition/silicon and merging the sense traces from each sense point with balanced routing. In one embodiment, a presented multiple point voltage sensing system includes Virtual VDD Sensing with guaranteed non-floating feedback. In one exemplary implementation, Virtual VDD Sensing with guaranteed non-floating feedback allows more accurate sensing when a component is power gated off by removing the sensing results associated with the component.

Abstract: Circuits and methods are disclosed that allow devices to control the flow of DMA transfers to or from the devices using a token based protocol. In one example implementation, a DMA circuit includes a transfer control circuit that performs data transfers over a first data channel of a device, when transactions on the first data channel are enabled. The DMA circuit includes a flow control circuit that increments a token count for a data channel of a device when a token for the data channel is received and decrements the token count for each data transfer on the data channel performed by the DMA circuit. The flow control circuit enables data transfers on the data channel when the token count is greater than 0, and otherwise, disables data transfers on the data channel.

Abstract: Methods and apparatus are described for adding one or more features (e.g., HBM) to a qualified SSI technology programmable IC region by providing an interface (e.g., an HBM buffer region with a switch network) between the added feature device and the programmable IC region. One example IC package generally includes a package substrate; at least one interposer disposed above the package substrate; a programmable IC region disposed above the interposer; at least one fixed feature die disposed above the interposer; and an interface region disposed above the interposer and configured to couple the programmable IC region to the fixed feature die via a first set of interconnection lines routed through the interposer between a first plurality of ports of the interface region and the fixed feature die and a second set of interconnection lines routed between a second plurality of ports of the interface region and the programmable IC region.

Abstract: A processing subsystem for providing diagnostic of a processing system is provided. The processing subsystem includes a real-time processing unit that receives a first input that includes data from one or more sensors and processes the first input to generate first output that controls an actuator. The processing subsystem also includes a power and safety management unit that receives a second input and processes the second input to generate second output for testing of the first output. A method and a system for providing diagnostic for a processing system are provided as well.

Abstract: A method of entering a power conservation state comprises selecting and entering one of a plurality of low power states for the computer system in response to a detected system idle event. The plurality of low power states comprise a first low power state and a second low power state for the computer system. A memory of the computer system is self refreshed during the first low power state. A baseband module of the computer system remains powered, and the memory is accessible to the baseband module during the second low power state. The one low power state is selected depending upon baseband module activity. The method also includes exiting from the one of a plurality of low power states when a wake event is detected.

Abstract: A programmable IC is disclosed that includes a programmable logic sub-system, a processing sub-system, and a safety sub-system. The programmable logic sub-system is configured to operate a hardware portion of the user design. The processing sub-system configured to execute a software portion of the user design. The safety sub-system is configured to perform a set of operations to detect errors in the programmable IC. The first set of operations writes to at least one of a set of registers using a write macro function. In response to writing to the register with the write macro function, a list of registers stored in the memory is updated to include the register. Registers included in the list of registers are tested to determine whether or not an upset has occurred.

Abstract: Approaches for bridging communication between first and second buses are disclosed. Address translation information and associated security indicators are stored in a memory. Each access request from the first bus includes a first requester security indicator and a requested address. Each access request from the first bus and directed to the second bus is either rejected, or translated and communicated to the second bus, based on the requester security indicator and the security indicator associated with the address translation information for the requested address. Each access request from the second bus to the first bus includes the requested address, and the access request is translated and communicated to the first bus along with the security indicator that is associated with the address translation information for the requested address.

Abstract: An apparatus is disclosed that includes a processing sub-system having a plurality of processor circuits and an interrupt control circuit. The interrupt control circuit is configured to, in response to a peripheral interrupt, initiate performance of a task indicated by the peripheral interrupt by at least one of the plurality of processor circuits. The processing sub-system is configured to generate a power-down control signal in response to suspension of the plurality of processor circuits. A power management circuit disables power to the processing sub-system, including the interrupt control circuit, in response to the power-down control signal. The power management circuit enables power to the processing sub-system in response to a power-up control signal. The apparatus also includes a proxy interrupt control circuit configured to generate the power-up control signal in response to receiving a peripheral interrupt and power to the processing sub-system being disabled.