Abstract: An example device includes a first semiconductor component comprising at least two lasers to emit light at a first wavelength; a second semiconductor component comprising at least two lasers to emit light at a second wavelength, the first wavelength being different from the second wavelength; and an optical multiplexer to receive light from two lasers at the first wavelength and light from two lasers at the second wavelength. The optical multiplexer component includes a first output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength to a first optical fiber, and a second output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength beams to a second optical fiber.

Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).

Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

Abstract: In the examples provided herein, an apparatus has an optically transparent block having a filter surface. The apparatus also has two or more filters, where each of the filters has thin films fabricated on an optically transparent substrate, and further wherein the thin films of the filters are coupled to the filter surface. Additionally, the apparatus has an optically transparent overmold material encasing the two or more filters, where the overmold material fills a volume between and above neighboring ones of the two or more filters.

Abstract: An array of monolithic wavelength division multiplexed (WDM) vertical cavity surface emitting lasers (VCSELs) is provided with quantum well intermixing. Each VCSEL includes a bottom distributed Bragg reflector (DBR), an upper distributed Bragg reflector, and a laser cavity therebetween. The laser cavity includes a multiple quantum well (MQW) layer sandwiched between a lower separate confinement heterostructure (SCH) and an upper SCH layer. Each MQW region experiences a different amount of quantum well intermixing and concomitantly a different lasing wavelength shift.

Abstract: In the examples provided herein, an apparatus has a first substrate upon which one or more first filters have been fabricated on a first surface of the first substrate. The apparatus also has a second substrate upon which one or more second filters have been fabricated on a second surface of the second substrate, wherein the one or more first filters and the one or more second filters each transmit a different band of wavelengths. Additionally, the apparatus has a bonding material that bonds the first substrate to the second substrate.

Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.

Abstract: A system for passive optical alignment includes an through optical via formed through a substrate, an optical transmission medium secured to a first side of the substrate such that the optical transmission medium is aligned with the through optical via, and an optoelectronic component secured to a second side of the substrate such that the active region of said optoelectronic component is aligned with the through optical via.

Abstract: An example device in accordance with an aspect of the present disclosure includes a photodetector disposed on a substrate, and a mirror disposed on the photodetector. The mirror is to reflect light back into the photodetector. The mirror includes a reflective layer and a second layer. The second layer is disposed between the reflective layer and the photodetector.

Abstract: A high contrast grating optical modulation includes an optical modulator at a front surface of a substrate to modulate received light. The high contrast grating optical modulation further includes a high contrast grating (HCG) lens adjacent to a back surface of the substrate opposite to the front surface to focus incident light onto the optical modulator. The substrate is transparent to operational wavelengths of the focused incident light and the modulated light.

Abstract: Bidirectional optical multiplexing employs a high contrast grating as one or both of a beam-forming lens and a relay mirror. A bidirectional optical multiplexer includes the beam-forming lens to focus light. The light is one or both of a light beam internal to and another light beam external to the bidirectional optical multiplexer. The bidirectional optical multiplexer further includes an optical filter and the relay mirror. The optical filter is to selectively pass a portion of the internal light beam at a first wavelength and to reflect portions of the internal light beam at other wavelengths. The relay mirror is to reflect the internal light beam along a zigzag propagation path between the optical filter and the relay mirror.

Abstract: A device can include an active optical device (AOD) to at least one of transmit and receive optical signals. The device can also include an interposer having the AOD mounted thereon. The interposer can be in thermal contact with a heat sink and the interposer is mounted on a substrate. The interposer can be formed of a thermally conductive and electrically insulating material. The interposer can include a via to electrically couple the AOD to another electrical device.

Abstract: An example device includes a first semiconductor component comprising at least two lasers to emit light at a first wavelength; a second semiconductor component comprising at least two lasers to emit light at a second wavelength, the first wavelength being different from the second wavelength; and an optical multiplexer to receive light from two lasers at the first wavelength and light from two lasers at the second wavelength. The optical multiplexer component includes a first output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength to a first optical fiber, and a second output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength beams to a second optical fiber.

Abstract: Loss compensated optical switching includes an optical crossbar switch and a wafer bonded semiconductor amplifier (SOA). The optical crossbar switch has a plurality of input ports and a plurality of output ports and is on a substrate of a first semiconductor material. The wafer bonded SOA includes a layer of second semiconductor material that is wafer bonded to a surface of the substrate such that a portion of the wafer bonded SOA semiconductor material layer overlies a portion of a port of the plurality of input ports. The second semiconductor material of the wafer bonded SOA is different from the first semiconductor material of the substrate.

Abstract: A device includes a first element and a second element. The first element includes a plurality of mirrors formed as concave features on the first element. The second element is to support a plurality of filters. The first element is coupleable to the second element to align the plurality of mirrors relative to the plurality of filters to operate as a multiplexer or de-multiplexer.

Abstract: An example apparatus comprises an optical connector coupled to at least one optical fiber cable; an optical interface coupled to the optical connector and to the at least one optical fiber cable, the optical interface to receive or transmit an optical signal; and an alignment collar releasably coupled to the optical connector and coupled to a substrate, wherein the optical interface is in alignment with at least one optical device coupled to the substrate.

Abstract: A monolithically integrated, self-aligning, optical-fiber ferrule for a pigtailed opto-electronic module. The ferrule includes a body, a cavity defined within the body, a lateral alignment structure, and an optical-fiber stop. The cavity is to accept and align an optical fiber with an end of the cavity to face an optical aperture of an opto-electronic component. The lateral alignment structure is to self-align laterally the optical fiber with the optical aperture. The optical-fiber stop is coupled to the body, to self-align vertically the optical fiber. The body, the cavity, the lateral alignment structure and the optical-fiber stop are integrated together as a portion of a monolithically integrated chip. A system and a pigtailed opto-electronic engine that include the ferrule are also provided.

Abstract: Techniques related to optical devices including a high contrast grating (HCG) lens are described herein. In an example, an optical device includes a transparent substrate. A laser emitter or detector at a first side of the transparent substrate to emit or detect a laser light transmitted via the transparent substrate. A HCG lens is at a second side of the transparent substrate to transmit and refract the laser light.

Abstract: A device for converting and optionally processing an optical signal comprises an optical cable having an optical-electrical conversion device at one end, the optical-electrical conversion device to convert the optical signal to an electrical signal or an electrical signal into an optical signal; a electrical package to removably receive the optical-electrical conversion device and generate processed signal; and a general circuit board attached to the electrical package and operable to receive the processed signal.

Abstract: An optical power splitter includes a zig-zag and a reflector element associated with the zig-zag. The zig-zag is to split an input signal based on the reflector element, and output a plurality of split signals.