Patents by Inventor Sainan HUAI

Sainan HUAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220317573
    Abstract: This application relates to a photoresist removal method, including: acquiring a target wafer, a photoresist being provided on a surface of the target wafer, a surface of a photoresist layer of the photoresist being plated with a metal overhead layer; immersing the target wafer in a first organic solvent at a first temperature in a water bath for a first duration; rinsing the target wafer with a new first organic solvent in response to an end of the first duration; performing, in the first organic solvent, ultrasonic cleaning on the rinsed target wafer for a second duration based on a target ultrasonic power; removing the residual first organic solvent on the surface of the target wafer in response to an end of the second duration; and drying the target wafer with the solvent removed by simultaneous centrifugal drying and gas purging to obtain the target wafer with the photoresist removed.
    Type: Application
    Filed: January 14, 2022
    Publication date: October 6, 2022
    Inventors: Zhongping ZHAO, Wenlong ZHANG, Maochun DAI, Sainan HUAI, Yu ZHOU
  • Publication number: 20220269970
    Abstract: A quantum circuit includes: a qubit, a resonant cavity, and a feeder, the resonant cavity being coupled to the qubit, and the feeder being coupled to the qubit. The feeder is configured to feed an initialization signal to the qubit, the initialization signal being a modulation signal used for causing a frequency of the qubit to generate a vibration. The vibration causes an equivalent state exchange to occur between the qubit and the resonant cavity, and an excited state of the qubit is initialized to a ground state by using the resonant cavity.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Inventors: Yu ZHOU, Zhenxing ZHANG, Shuoming AN, Zelong YIN, Sainan HUAI, Xiu GU, Xiong XU, Shengyu ZHANG
  • Publication number: 20220231215
    Abstract: A superconducting quantum hybrid system includes: a silicon carbide (SiC) epitaxial layer; and a superconducting qubit line, the superconducting qubit line corresponding to a superconducting qubit, where a designated region of the SiC epitaxial layer includes a nitrogen vacancy (NV) center, the NV center being formed by implanting nitrogen ions into the designated region of the SiC epitaxial layer, and where the superconducting qubit line is located on a surface of the SiC epitaxial layer, the superconducting qubit is coupled to a solid-state defect qubit, and the solid-state defect qubit is a qubit corresponding to the NV center in the designated region.
    Type: Application
    Filed: February 3, 2022
    Publication date: July 21, 2022
    Inventors: Yu ZHOU, Zhenxing ZHANG, Sainan HUAI, Yarui ZHENG, Shengyu ZHANG
  • Publication number: 20220216134
    Abstract: A manufacturing method for an air bridge structure includes forming a first photoresist structure on a substrate. The first photoresist structure includes a first opening that reveals the substrate. The manufacturing method further includes forming a bridge supporting structure on the substrate by depositing an inorganic bridge supporting material on the substrate based on the first opening in the first photoresist structure, and stripping the first photoresist structure after the deposition. Then, the manufacturing method includes forming a second photoresist structure on the substrate. The second photoresist structure includes at least a second opening that reveals at least a portion of the bridge supporting structure on the substrate. Then, the method include forming the air bridge structure by depositing an air bridge material on the substrate based on the second opening and stripping the second photoresist structure after the deposition. Further, the bridge supporting structure can be removed.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 7, 2022
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Wenlong ZHANG, Chuhong YANG, Sainan HUAI, Yarui ZHENG, Sheng Yu ZHANG, Jiagui FENG, Kanglin XIONG, Biao WU, Yongdan HUANG, Xiao CHEN, Sunan DING
  • Publication number: 20220216390
    Abstract: This disclosure includes a method for fabricating an air bridge, an air bridge structure, and a superconducting quantum chip, and relates to the field of circuit structures. In some examples, a method for fabricating an air bridge includes forming an air bridge brace structure on a substrate, and forming, on the air bridge brace structure and the substrate, an air bridge material layer with one or more openings in the air bridge material layer that reveal the air bridge brace structure. The air bridge material layer with the one or more openings is formed based on a patterned photoresist layer with patterns corresponding to the one or more openings. The method further includes removing, based on the one or more openings in the air bridge material layer, the air bridge brace structure to obtain the air bridge having the one or more openings.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Applicants: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED, SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES
    Inventors: Wenlong ZHANG, Sainan HUAI, Yarui ZHENG, Jiagui FENG, Kanglin XIONG, Sunan DING
  • Publication number: 20220092462
    Abstract: This application discloses methods and devices for a quantum chip, a quantum processor and a quantum computer, and relates to the field of quantum technology. The quantum chip includes a bottom sheet and a top sheet; a qubit array disposed on the top sheet, the qubit array comprising a plurality of qubits distributed in an array structure of M rows by N columns, and M and N being both integers greater than 1; a reading cavity disposed on the bottom sheet, and the reading cavity being configured to acquire status information of a qubit in the qubit array; and the bottom sheet and the top sheet being electrically connected.
    Type: Application
    Filed: December 2, 2021
    Publication date: March 24, 2022
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Sainan HUAI, Yu ZHOU, Zhenxing ZHANG, Yarui ZHENG, Wenlong ZHANG, Chuhong YANG, Maochun DAI, Yicong ZHENG, Shengyu ZHANG