Patents by Inventor Salvatore B. Olivadese

Salvatore B. Olivadese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220021096
    Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.
    Type: Application
    Filed: December 21, 2020
    Publication date: January 20, 2022
    Applicant: International Business Machines Corporation
    Inventors: SALVATORE B. OLIVADESE, PATRYK GUMANN, JERRY M. CHOW
  • Patent number: 11178771
    Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: November 16, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
  • Publication number: 20210326740
    Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 21, 2021
    Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
  • Patent number: 11006527
    Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: May 11, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
  • Patent number: 11005574
    Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: May 11, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese, Jason S. Orcutt
  • Patent number: 10984335
    Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: April 20, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
  • Publication number: 20210111471
    Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Applicant: International Business Machines Corporation
    Inventors: SALVATORE B. OLIVADESE, PATRYK GUMANN, JERRY M. CHOW
  • Patent number: 10978769
    Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: April 13, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
  • Patent number: 10971790
    Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: April 6, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
  • Publication number: 20200412457
    Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
    Type: Application
    Filed: June 27, 2019
    Publication date: December 31, 2020
    Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese, Jason S. Orcutt
  • Publication number: 20200394546
    Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
  • Publication number: 20200359501
    Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.
    Type: Application
    Filed: July 28, 2020
    Publication date: November 12, 2020
    Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
  • Publication number: 20200358159
    Abstract: An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: International Business Machines Corporation
    Inventors: Patryk Gumann, Salvatore B. Olivadese, Markus Brink
  • Patent number: 10811748
    Abstract: An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: October 20, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore B. Olivadese, Markus Brink
  • Patent number: 10813219
    Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 20, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
  • Publication number: 20200321675
    Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Applicant: International Business Machines Corporation
    Inventors: SALVATORE B. OLIVADESE, PATRYK GUMANN, JERRY M. CHOW
  • Patent number: 10784553
    Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through a first recess in the second polyimide film to make electrical and thermal contact with the first center conductor.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: September 22, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
  • Publication number: 20200280116
    Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).
    Type: Application
    Filed: May 21, 2020
    Publication date: September 3, 2020
    Applicant: International Business Machines Corporation
    Inventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
  • Publication number: 20200272927
    Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.
    Type: Application
    Filed: February 21, 2019
    Publication date: August 27, 2020
    Inventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
  • Patent number: 10749235
    Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage). The stage is maintained at a cryogenic temperature, and the material of the conductor bonds at the cryogenic temperature with a second material of a part of a connector of a microwave line.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: August 18, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow