Patents by Inventor Salvatore B. Olivadese
Salvatore B. Olivadese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11900217Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: GrantFiled: November 15, 2022Date of Patent: February 13, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
-
Publication number: 20230252332Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: ApplicationFiled: November 15, 2022Publication date: August 10, 2023Applicant: International Business Machines CorporationInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
-
Patent number: 11621466Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.Type: GrantFiled: December 21, 2020Date of Patent: April 4, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
-
Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications
Patent number: 11621467Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).Type: GrantFiled: December 21, 2020Date of Patent: April 4, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow -
Patent number: 11551125Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: GrantFiled: February 21, 2019Date of Patent: January 10, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
-
Patent number: 11537929Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: GrantFiled: April 16, 2021Date of Patent: December 27, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
-
Patent number: 11380969Abstract: An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.Type: GrantFiled: July 30, 2020Date of Patent: July 5, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patryk Gumann, Salvatore B. Olivadese, Markus Brink
-
Publication number: 20220021096Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.Type: ApplicationFiled: December 21, 2020Publication date: January 20, 2022Applicant: International Business Machines CorporationInventors: SALVATORE B. OLIVADESE, PATRYK GUMANN, JERRY M. CHOW
-
Patent number: 11178771Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: GrantFiled: July 28, 2020Date of Patent: November 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
-
Publication number: 20210326740Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: ApplicationFiled: April 16, 2021Publication date: October 21, 2021Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
-
Patent number: 11006527Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: GrantFiled: July 15, 2019Date of Patent: May 11, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
-
Patent number: 11005574Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.Type: GrantFiled: June 27, 2019Date of Patent: May 11, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese, Jason S. Orcutt
-
Patent number: 10984335Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: GrantFiled: June 17, 2019Date of Patent: April 20, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
-
WELL THERMALIZED MICROSTRIP FORMATION FOR FLEXIBLE CRYOGENIC MICROWAVE LINES IN QUANTUM APPLICATIONS
Publication number: 20210111471Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).Type: ApplicationFiled: December 21, 2020Publication date: April 15, 2021Applicant: International Business Machines CorporationInventors: SALVATORE B. OLIVADESE, PATRYK GUMANN, JERRY M. CHOW -
Patent number: 10978769Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.Type: GrantFiled: June 22, 2020Date of Patent: April 13, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
-
Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications
Patent number: 10971790Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).Type: GrantFiled: May 21, 2020Date of Patent: April 6, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow -
Publication number: 20200412457Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.Type: ApplicationFiled: June 27, 2019Publication date: December 31, 2020Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese, Jason S. Orcutt
-
Publication number: 20200394546Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: ApplicationFiled: June 17, 2019Publication date: December 17, 2020Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
-
Publication number: 20200358159Abstract: An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.Type: ApplicationFiled: July 30, 2020Publication date: November 12, 2020Applicant: International Business Machines CorporationInventors: Patryk Gumann, Salvatore B. Olivadese, Markus Brink
-
Publication number: 20200359501Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: ApplicationFiled: July 28, 2020Publication date: November 12, 2020Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese