Patents by Inventor Samhita Dasgupta

Samhita Dasgupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6925213
    Abstract: A novel fiber optic sensor configuration whose diameter is the same as that of the optical fiber on which it is directly fabricated is introduced. A simple MEMS-compatible fabrication process to accomplish micromachining on the fiber end face has been developed and is detailed. This sensor configuration significantly reduces the size of the sensor and makes the packaging simple and adhesive free. The micromachining process of the present invention also provides for the fabrication of arrays of sensors that would provide two dimensional maps with high spatial resolution of at least one of acoustical vibration, mechanical vibration, pressure, temperature, acceleration, electrostatic fields, magnetic fields or combinations thereof.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: August 2, 2005
    Assignee: University of Cincinnati
    Inventors: Joseph T. Boyd, Don C. Abeysinghe, Samhita Dasgupta, Howard E. Jackson
  • Publication number: 20040240784
    Abstract: An electromagnetic coupler comprising: a coupling waveguide adapted for receiving input modes along an input axis, propagating coupling modes along a coupling axis, and transmitting output modes along an output axis, the output axis being not parallel to the coupling axis; and an output waveguide disposed adjacent the coupling waveguide and adapted for receiving the output modes.
    Type: Application
    Filed: May 30, 2003
    Publication date: December 2, 2004
    Applicant: General Electric Company
    Inventors: Min-Yi Shih, Kelvin Ma, Matthew Christian Nielsen, Samhita Dasgupta
  • Patent number: 6818466
    Abstract: A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: November 16, 2004
    Assignee: General Electric Company
    Inventors: William Kornrumpf, Glenn Claydon, Samhita Dasgupta, Robert Filkins, Glenn Forman, Joseph Iannotti, Matthew Christian Nielsen
  • Publication number: 20040126050
    Abstract: A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 1, 2004
    Inventors: Glenn Scott Claydon, Matthew Christian Nielsen, Samhita Dasgupta, Robert John Filkins, Glenn Alan Forman
  • Publication number: 20040120626
    Abstract: A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.
    Type: Application
    Filed: December 4, 2003
    Publication date: June 24, 2004
    Inventors: William Kornrumpf, Glenn Claydon, Samhita Dasgupta, Robert Filkins, Glenn Forman, Joseph Iannotti, Matthew Christian Nielsen
  • Publication number: 20040119197
    Abstract: A method of fabricating a stamping mold suitable for use in the formation of a tapered waveguide structure includes defining a stamping pattern upon the surface of a silicon wafer, and removing portions of the silicon wafer surface in accordance with the stamped pattern, thereby creating tapered vertical surfaces within the wafer.
    Type: Application
    Filed: December 18, 2002
    Publication date: June 24, 2004
    Inventors: Thomas Gorczyca, Christopher Kapusta, Samhita Dasgupta, Stacey Goodwin
  • Publication number: 20040114867
    Abstract: A technique for implementing a tunable micro-ring filter is disclosed. According to an embodiment of the present invention, a tunable filter for optical communication systems comprises a first waveguide forming a pattern with a second waveguide; a resonator coupled to the first waveguide and the second waveguide wherein the resonator comprises a nonlinear optical material; an electrode structure sandwiching the first waveguide, the second waveguide and the resonator; the electrode structure adapted for receiving a tuning signal and tuning an effective index of the resonator in response to the tuning signal; and a substrate supporting the first waveguide, the second waveguide, the resonator and the electrode structure.
    Type: Application
    Filed: December 17, 2002
    Publication date: June 17, 2004
    Inventors: Matthew Nielsen, Min-Yi Shih, Samhita Dasgupta
  • Publication number: 20040076382
    Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Applicant: General Electric Company
    Inventors: Richard Joseph Saia, Thomas Bert Gorczyca, Christopher James Kapusta, Ernest Wayne Balch, Glenn Scott Claydon, Samhita Dasgupta, Eladio Clemente Delgado
  • Patent number: 6711312
    Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: March 23, 2004
    Assignee: General Electric Company
    Inventors: William Kornrumpf, Glenn Claydon, Samhita Dasgupta, Robert Filkins, Glenn Forman, Joseph Iannotti, Matthew Christian Nielsen
  • Publication number: 20040020896
    Abstract: Embodiments of the present invention are directed to a method of processing an optical fiber to match the optical field coming out of the fiber to that accepted into the optical waveguide to reduce the optical losses due to the optical mode mismatch of the interconnection. In one embodiment, a method of tapering an end of an optical fiber comprises providing a flow of etch vapor from an etch solution generally in an etch vapor flow direction, a concentration of the etch vapor decreasing with distance in the etch vapor flow direction; providing an optical fiber have an end portion with a tip, the end portion of the optical fiber including a core and a clad; and subjecting the end portion of the optical fiber to the flow of etch vapor from the etch solution to etch the end portion and form a taper at the end portion. The end portion is disposed generally along the etch vapor flow direction and the tip of the end portion points generally in a direction opposite from the etch vapor flow direction.
    Type: Application
    Filed: February 13, 2003
    Publication date: February 5, 2004
    Applicant: Lockheed Martin Corporation
    Inventors: Samhita Dasgupta, Christopher J. Kapusta, Min-Yi Shih, Stacey J. Goodwin
  • Publication number: 20020159671
    Abstract: A novel fiber optic sensor configuration whose diameter is the same as that of the optical fiber on which it is directly fabricated is introduced. A simple MEMS-compatible fabrication process to accomplish micromachining on the fiber end face has been developed and is detailed. This sensor configuration significantly reduces the size of the sensor and makes the packaging simple and adhesive free. The micromachining process of the present invention also provides for the fabrication of arrays of sensors that would provide two dimensional maps with high spatial resolution of at least one of acoustical vibration, mechanical vibration, pressure, temperature, acceleration, electrostatic fields, magnetic fields or combinations thereof.
    Type: Application
    Filed: March 11, 2002
    Publication date: October 31, 2002
    Inventors: Joseph T. Boyd, Don C. Abeysinghe, Samhita Dasgupta, Howard E. Jackson