Patents by Inventor Samuel G. Parker
Samuel G. Parker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230088030Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.Type: ApplicationFiled: November 22, 2022Publication date: March 23, 2023Applicant: APPLE INC.Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
-
Patent number: 11540039Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.Type: GrantFiled: March 19, 2021Date of Patent: December 27, 2022Assignee: APPLE INC.Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
-
Patent number: 11523205Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.Type: GrantFiled: April 19, 2021Date of Patent: December 6, 2022Assignee: APPLE INC.Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
-
Patent number: 11159869Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and an attachment structure coupled to the inner eartip body at the attachment end. The eartip body can include: an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end; and an outer eartip body sized and shaped to be inserted into an ear canal and extending from the interfacing end, the outer eartip body extending toward the attachment end of the eartip. The attachment structure including a sidewall extending around a periphery of the attachment structure and defining an opening extending through the sidewall that fluidly couples the channel to an ambient environment.Type: GrantFiled: September 26, 2019Date of Patent: October 26, 2021Assignee: Apple Inc.Inventors: Scott C. Grinker, Esge Andersen, Ethan L. Huwe, Benjamin A. Cousins, Samuel G. Parker, Sean T. McIntosh, Jason C. Della Rosa, Craig M. Stanley, Edward Siahaan, Ethan W. Juhnke
-
Publication number: 20210243514Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.Type: ApplicationFiled: April 19, 2021Publication date: August 5, 2021Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
-
Publication number: 20210211796Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.Type: ApplicationFiled: March 19, 2021Publication date: July 8, 2021Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
-
Patent number: 11012770Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.Type: GrantFiled: September 26, 2019Date of Patent: May 18, 2021Assignee: Apple Inc.Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
-
Patent number: 10986433Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.Type: GrantFiled: September 26, 2019Date of Patent: April 20, 2021Assignee: Apple Inc.Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
-
Patent number: 10944156Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.Type: GrantFiled: September 29, 2017Date of Patent: March 9, 2021Assignee: Apple Inc.Inventors: Benjamin A. Cousins, Carlo Di Nallo, Ethan L. Huwe, Jerzy S. Guterman, Joachim S. Hammerschmidt, Mattia Pascolini, Ruben Caballero, Samuel G. Parker
-
Publication number: 20200314519Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.Type: ApplicationFiled: September 26, 2019Publication date: October 1, 2020Applicant: Apple Inc.Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
-
Patent number: 10771890Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.Type: GrantFiled: June 2, 2017Date of Patent: September 8, 2020Assignee: Apple Inc.Inventors: Craig M. Stanley, Jason C. Della Rosa, Samuel G. Parker, Ethan L. Huwe, Glenn K. Trainer, Javier Mendez, Sean T. McIntosh
-
Publication number: 20200154184Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.Type: ApplicationFiled: January 3, 2020Publication date: May 14, 2020Applicant: Apple Inc.Inventors: Meiting Wu, Simon K. Porter, Glenn K. Trainer, Jacob A. Pfitsch, Rex P. Price, Samuel G. Parker, Ethan L. Huwe, Craig M. Stanley
-
Patent number: 10631071Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.Type: GrantFiled: March 27, 2018Date of Patent: April 21, 2020Assignee: Apple Inc.Inventors: Meiting Wu, Simon K. Porter, Glenn K. Trainer, Jacob A. Pfitsch, Rex P. Price, Samuel G. Parker, Ethan L. Huwe, Craig M. Stanley
-
Publication number: 20200107099Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.Type: ApplicationFiled: September 26, 2019Publication date: April 2, 2020Applicant: Apple Inc.Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
-
Publication number: 20200107101Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and an attachment structure coupled to the inner eartip body at the attachment end. The eartip body can include: an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end; and an outer eartip body sized and shaped to be inserted into an ear canal and extending from the interfacing end, the outer eartip body extending toward the attachment end of the eartip. The attachment structure including a sidewall extending around a periphery of the attachment structure and defining an opening extending through the sidewall that fluidly couples the channel to an ambient environment.Type: ApplicationFiled: September 26, 2019Publication date: April 2, 2020Applicant: Apple Inc.Inventors: Scott C. Grinker, Esge Andersen, Ethan L. Huwe, Benjamin A. Cousins, Samuel G. Parker, Sean T. McIntosh, Jason C. Della Rosa, Craig M. Stanley, Edward Siahaan, Ethan W. Juhnke
-
Patent number: 10524044Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.Type: GrantFiled: June 2, 2017Date of Patent: December 31, 2019Assignee: Apple Inc.Inventors: John H. Sheerin, Samuel G. Parker, Ethan L. Huwe, Meiting Wu, Craig M. Stanley
-
Publication number: 20190103661Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.Type: ApplicationFiled: September 29, 2017Publication date: April 4, 2019Inventors: Benjamin A. Cousins, Carlo Di Nallo, Ethan L. Huwe, Jerzy S. Guterman, Joachim S. Hammerschmidt, Mattia Pascolini, Ruben Caballero, Samuel G. Parker
-
Publication number: 20180227661Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.Type: ApplicationFiled: June 2, 2017Publication date: August 9, 2018Inventors: John H. Sheerin, Samuel G. Parker, Ethan L. Huwe, Meiting Wu, Craig M. Stanley
-
Publication number: 20180220213Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.Type: ApplicationFiled: March 27, 2018Publication date: August 2, 2018Inventors: Meiting Wu, Simon K. Porter, Glenn K. Trainer, Jacob A. Pfitsch, Rex P. Price, Samuel G. Parker, Ethan L. Huwe, Craig M. Stanley
-
Publication number: 20180091894Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.Type: ApplicationFiled: June 2, 2017Publication date: March 29, 2018Inventors: John H. Sheerin, Samuel G. Parker, Ethan L. Huwe, Meiting Wu, Craig M. Stanley