Patents by Inventor Samuel G. Parker

Samuel G. Parker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230088030
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Application
    Filed: November 22, 2022
    Publication date: March 23, 2023
    Applicant: APPLE INC.
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 11540039
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: December 27, 2022
    Assignee: APPLE INC.
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 11523205
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: December 6, 2022
    Assignee: APPLE INC.
    Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
  • Patent number: 11159869
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and an attachment structure coupled to the inner eartip body at the attachment end. The eartip body can include: an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end; and an outer eartip body sized and shaped to be inserted into an ear canal and extending from the interfacing end, the outer eartip body extending toward the attachment end of the eartip. The attachment structure including a sidewall extending around a periphery of the attachment structure and defining an opening extending through the sidewall that fluidly couples the channel to an ambient environment.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: October 26, 2021
    Assignee: Apple Inc.
    Inventors: Scott C. Grinker, Esge Andersen, Ethan L. Huwe, Benjamin A. Cousins, Samuel G. Parker, Sean T. McIntosh, Jason C. Della Rosa, Craig M. Stanley, Edward Siahaan, Ethan W. Juhnke
  • Publication number: 20210243514
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
  • Publication number: 20210211796
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Application
    Filed: March 19, 2021
    Publication date: July 8, 2021
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 11012770
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: May 18, 2021
    Assignee: Apple Inc.
    Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
  • Patent number: 10986433
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: April 20, 2021
    Assignee: Apple Inc.
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 10944156
    Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: March 9, 2021
    Assignee: Apple Inc.
    Inventors: Benjamin A. Cousins, Carlo Di Nallo, Ethan L. Huwe, Jerzy S. Guterman, Joachim S. Hammerschmidt, Mattia Pascolini, Ruben Caballero, Samuel G. Parker
  • Publication number: 20200314519
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.
    Type: Application
    Filed: September 26, 2019
    Publication date: October 1, 2020
    Applicant: Apple Inc.
    Inventors: Dustin A. Hatfield, Shota Aoyagi, Timothy E. Emmott, Ethan L. Huwe, Mitchell R. Lerner, Sean T. McIntosh, Yi-Fang D. Tsai, Jason C. Della Rosa, Patrick W. Sheppard, Samuel G. Parker, David J. Feathers, Brian R. Twehues, Daniel Strongwater
  • Patent number: 10771890
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: September 8, 2020
    Assignee: Apple Inc.
    Inventors: Craig M. Stanley, Jason C. Della Rosa, Samuel G. Parker, Ethan L. Huwe, Glenn K. Trainer, Javier Mendez, Sean T. McIntosh
  • Publication number: 20200154184
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Application
    Filed: January 3, 2020
    Publication date: May 14, 2020
    Applicant: Apple Inc.
    Inventors: Meiting Wu, Simon K. Porter, Glenn K. Trainer, Jacob A. Pfitsch, Rex P. Price, Samuel G. Parker, Ethan L. Huwe, Craig M. Stanley
  • Patent number: 10631071
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: April 21, 2020
    Assignee: Apple Inc.
    Inventors: Meiting Wu, Simon K. Porter, Glenn K. Trainer, Jacob A. Pfitsch, Rex P. Price, Samuel G. Parker, Ethan L. Huwe, Craig M. Stanley
  • Publication number: 20200107099
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 2, 2020
    Applicant: Apple Inc.
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Publication number: 20200107101
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and an attachment structure coupled to the inner eartip body at the attachment end. The eartip body can include: an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end; and an outer eartip body sized and shaped to be inserted into an ear canal and extending from the interfacing end, the outer eartip body extending toward the attachment end of the eartip. The attachment structure including a sidewall extending around a periphery of the attachment structure and defining an opening extending through the sidewall that fluidly couples the channel to an ambient environment.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 2, 2020
    Applicant: Apple Inc.
    Inventors: Scott C. Grinker, Esge Andersen, Ethan L. Huwe, Benjamin A. Cousins, Samuel G. Parker, Sean T. McIntosh, Jason C. Della Rosa, Craig M. Stanley, Edward Siahaan, Ethan W. Juhnke
  • Patent number: 10524044
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: December 31, 2019
    Assignee: Apple Inc.
    Inventors: John H. Sheerin, Samuel G. Parker, Ethan L. Huwe, Meiting Wu, Craig M. Stanley
  • Publication number: 20190103661
    Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Benjamin A. Cousins, Carlo Di Nallo, Ethan L. Huwe, Jerzy S. Guterman, Joachim S. Hammerschmidt, Mattia Pascolini, Ruben Caballero, Samuel G. Parker
  • Publication number: 20180227661
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Application
    Filed: June 2, 2017
    Publication date: August 9, 2018
    Inventors: John H. Sheerin, Samuel G. Parker, Ethan L. Huwe, Meiting Wu, Craig M. Stanley
  • Publication number: 20180220213
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Application
    Filed: March 27, 2018
    Publication date: August 2, 2018
    Inventors: Meiting Wu, Simon K. Porter, Glenn K. Trainer, Jacob A. Pfitsch, Rex P. Price, Samuel G. Parker, Ethan L. Huwe, Craig M. Stanley
  • Publication number: 20180091894
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Application
    Filed: June 2, 2017
    Publication date: March 29, 2018
    Inventors: John H. Sheerin, Samuel G. Parker, Ethan L. Huwe, Meiting Wu, Craig M. Stanley