Patents by Inventor Sang-Don Lee

Sang-Don Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210364424
    Abstract: Disclosed is a sensor including: a light provision unit including a light-emitting device for providing an optical stimulus, and a first controllable power source for providing driving power to the light-emitting device; a light detection unit including a light-receiving device for detecting an optical response to the optical stimulus and then outputting same as an electric signal, and a second controllable power source for providing driving power to the light-receiving device; and a control unit for controlling the driving powers provided by the first controllable power source and the second controllable power source.
    Type: Application
    Filed: September 13, 2018
    Publication date: November 25, 2021
    Applicant: GIPARANG CO., LTD.
    Inventor: Sang Don LEE
  • Patent number: 11169335
    Abstract: Provided are a slim connector plug capable of transmitting and receiving a large amount of data at an ultra-high speed and implementing a miniaturized and slimmed structure with a thickness of 1 mm while being manufactured at low cost, and an active optical cable (AOC) assembly using the same. The connector plug includes: an optical sub-assembly in which an optical fiber seating groove on which an optical fiber is mounted is formed on one side of the optical sub-assembly and a reflective surface is formed on an inner end of the optical fiber seating groove; an optical element module having an optical engine stacked on the optical sub-assembly and generating an optical signal or receiving an optical signal; and an optical component installed on the reflective surface of the OSA and transmitting the optical signal between the optical fiber and the optical engine.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: November 9, 2021
    Assignee: LIPAC CO., LTD.
    Inventor: Sang Don Lee
  • Publication number: 20210338779
    Abstract: Provided are a combination including glucagon and a compound or substance with therapeutic activity against a metabolic syndrome and a use thereof.
    Type: Application
    Filed: October 4, 2019
    Publication date: November 4, 2021
    Applicant: HANMI PHARM. CO., LTD
    Inventors: Jung Kuk KIM, Young Jin PARK, In Young CHOI, Sang Don LEE, Jong Suk LEE
  • Publication number: 20210320039
    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Inventors: Min-Jae LEE, Sang-Lok KIM, Byung-Hoon JEONG, Tae-Sung LEE, Jeong-Don IHM, Jae-Yong JEONG, Young-Don CHOI
  • Publication number: 20210320380
    Abstract: Disclosed is an organic/inorganic composite porous film comprising: (a) inorganic particles; and (b) a binder polymer coating layer formed partially or totally on surfaces of the inorganic particles, wherein the inorganic particles are interconnected among themselves and are fixed by the binder polymer, and interstitial volumes among the inorganic particles form a micropore structure. A method for manufacturing the same film and an electrochemical device including the same film are also disclosed. An electrochemical device comprising the organic/inorganic composite porous film shows improved safety and quality.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Applicants: LG CHEM, LTD., TORAY BATTERY SEPARATOR FILM CO., LTD.
    Inventors: Hyun Hang YONG, Sang Young LEE, Seok Koo KIM, Soon Ho AHN, Jung Don SUK
  • Publication number: 20210281998
    Abstract: Disclosed is an electronic device. The electronic device may comprise: at least one processor; an eUICC including a plurality of profiles; an RF circuit and a GPS circuit, for communicating with a network by using an activated first profile among the plurality of profiles; and a memory for storing a profile list database including information on the plurality of profiles. The at least one processor may implement a management module for managing the plurality of profiles, and the management module may deactivate the first profile and activate a second profile on the basis of location information acquired by the RF circuit or the GPS circuit. In addition, various embodiments understood through the specification are possible.
    Type: Application
    Filed: July 31, 2017
    Publication date: September 9, 2021
    Inventors: Sung Oh KIM, Jeong Don KANG, Sang Soo LEE, Sang Hwi LEE
  • Patent number: 11111580
    Abstract: The present disclosure relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate, which is capable of allowing a substrate processing gas to smoothly flow on the substrate. The apparatus for processing the substrate in accordance an exemplary embodiment may form a laminar flow through a gas supply unit disposed on one side of an inner reaction tube and an exhaust duct disposed on the other side of the inner reaction tube, which faces the gas supply unit, to extend up to the outside of an accommodation region of a pedestal in an accommodation space of the inner reaction tube and control a flow of a substrate processing gas supplied onto the substrate.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: September 7, 2021
    Inventors: Sung Ho Kang, Chang Dol Kim, Sang Don Lee
  • Patent number: 11084498
    Abstract: An apparatus and a method for controlling a driving mode of a vehicle are provided. The apparatus includes a mode converter that converts the driving mode of the vehicle based on an operation of a mode conversion input. When the driving mode is converted into a custom mode, a mode setting screen for adjusting a setting value of a driving characteristic preset is configured and the configured mode setting screen is displayed on a display of the vehicle. A tuning device then tunes a driving characteristic of the custom mode based on a setting value adjusted on the mode setting screen.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: August 10, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Gi Young Kwon, Soo Bang Lee, Kyoung Cheol Oh, Hong Chul Shin, Hye Kil Hwang, Jong Bum Oh, Seul Gi Lee, Jae Myoung Pi, Sang Don Lee, Woo Suk Choi, Seong Ik Park
  • Publication number: 20210242485
    Abstract: A pouch forming method and a pouch forming device are provided. In particular, the pouch forming method for forming an accommodation part that accommodates an electrode assembly in a pouch sheet includes a seating process of seating the pouch sheet on a top surface of a lower die in which a forming groove is formed in an upper portion thereof. In a vacuum elongation process, a lower portion of the pouch sheet, in which the accommodation part is formed, is elongated by vacuum, and in an accommodation part formation process, the portion of the pouch sheet, which is elongated by the vacuum, is pressed by a punch disposed above the pouch sheet in a direction in which the forming groove is formed to form the accommodation part.
    Type: Application
    Filed: April 20, 2021
    Publication date: August 5, 2021
    Inventors: Gee Hwan Kim, Sang Don Lee, Min Seung Choi, Sang Uk Yeo
  • Patent number: 11061193
    Abstract: A semiconductor package including: a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: July 13, 2021
    Assignee: Lipac Co., Ltd.
    Inventor: Sang Don Lee
  • Patent number: 11018368
    Abstract: A pouch forming method and a pouch forming device are provided. In particular, the pouch forming method for forming an accommodation part that accommodates an electrode assembly in a pouch sheet includes a seating process of seating the pouch sheet on a top surface of a lower die in which a forming groove is formed in an upper portion thereof. In a vacuum elongation process, a lower portion of the pouch sheet, in which the accommodation part is formed, is elongated by vacuum, and in an accommodation part formation process, the portion of the pouch sheet, which is elongated by the vacuum, is pressed by a punch disposed above the pouch sheet in a direction in which the forming groove is formed to form the accommodation part.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: May 25, 2021
    Inventors: Gee Hwan Kim, Sang Don Lee, Min Seung Choi, Sang Uk Yeo
  • Publication number: 20210111187
    Abstract: A nonvolatile memory device including a mold structure including a plurality of gate electrodes on a substrate, the plurality of gate electrodes including first, second, and third string selection lines sequentially stacked on the substrate; a channel structure that penetrates the mold structure and intersects each of the gate electrodes; a first cutting region that cuts each of the gate electrodes; a second cutting region that is spaced apart from the first cutting region in a first direction and cuts each of the gate electrodes; a first cutting line that cuts the first string selection line between the first cutting region and the second cutting region; a second cutting line that cuts the second string selection line between the first cutting region and the second cutting region; and a third cutting line that cuts the third string selection line between the first cutting region and the second cutting region.
    Type: Application
    Filed: June 2, 2020
    Publication date: April 15, 2021
    Inventors: Jae Ho AHN, Sung-Min HWANG, Joon-Sung LIM, Bum Kyu KANG, Sang Don LEE
  • Patent number: 10749147
    Abstract: A pouch forming device is provided. The pouch forming device comprises a die member including a die on which a pouch film is disposed on a top surface thereof, in which a forming part is formed, and a die holder to which the die is fixed, a stripper member that presses and fixes the pouch film disposed on the die when descending and a first driving piece to move the stripper vertically, a punch member including a punch plate comprising a punch configured to be inserted into the forming part to form an electrode assembly accommodation part in the pouch film and a second driving piece to move the punch plate vertically, and a control member that controls the first driving piece to allow the stripper to ascend when the punch is inserted into the forming part to decrease a pressing force applied to the pouch film.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: August 18, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Gee Hwan Kim, Sang Don Lee, Min Seung Choi, Sang Uk Yeo
  • Publication number: 20200233160
    Abstract: Provided are a slim connector plug capable of transmitting and receiving a large amount of data at an ultra-high speed and implementing a miniaturized and slimmed structure with a thickness of 1 mm while being manufactured at low cost, and an active optical cable (AOC) assembly using the same. The connector plug includes: an optical sub-assembly in which an optical fiber seating groove on which an optical fiber is mounted is formed on one side of the optical sub-assembly and a reflective surface is formed on an inner end of the optical fiber seating groove; an optical element module having an optical engine stacked on the optical sub-assembly and generating an optical signal or receiving an optical signal; and an optical component installed on the reflective surface of the OSA and transmitting the optical signal between the optical fiber and the optical engine.
    Type: Application
    Filed: February 22, 2018
    Publication date: July 23, 2020
    Inventor: Sang Don LEE
  • Publication number: 20200233157
    Abstract: A semiconductor package including: a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.
    Type: Application
    Filed: April 3, 2020
    Publication date: July 23, 2020
    Applicant: Lipac Co., Ltd.
    Inventor: Sang Don LEE
  • Publication number: 20200168853
    Abstract: A pouch forming device is provided. The pouch forming device comprises a die member including a die on which a pouch film is disposed on a top surface thereof, in which a forming part is formed, and a die holder to which the die is fixed, a stripper member that presses and fixes the pouch film disposed on the die when descending and a first driving piece to move the stripper vertically, a punch member including a punch plate comprising a punch configured to be inserted into the forming part to form an electrode assembly accommodation part in the pouch film and a second driving piece to move the punch plate vertically, and a control member that controls the first driving piece to allow the stripper to ascend when the punch is inserted into the forming part to decrease a pressing force applied to the pouch film.
    Type: Application
    Filed: February 21, 2019
    Publication date: May 28, 2020
    Inventors: Gee Hwan Kim, Sang Don Lee, Min Seung Choi, Sang Uk Yeo
  • Publication number: 20200153025
    Abstract: A pouch forming method and a pouch forming device are provided. In particular, the pouch forming method for forming an accommodation part that accommodates an electrode assembly in a pouch sheet includes a seating process of seating the pouch sheet on a top surface of a lower die in which a forming groove is formed in an upper portion thereof. In a vacuum elongation process, a lower portion of the pouch sheet, in which the accommodation part is formed, is elongated by vacuum, and in an accommodation part formation process, the portion of the pouch sheet, which is elongated by the vacuum, is pressed by a punch disposed above the pouch sheet in a direction in which the forming groove is formed to form the accommodation part.
    Type: Application
    Filed: February 21, 2019
    Publication date: May 14, 2020
    Inventors: Gee Hwan Kim, Sang Don Lee, Min Seung Choi, Sang Uk Yeo
  • Patent number: 10649159
    Abstract: A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 12, 2020
    Assignee: Lipac Co., Ltd.
    Inventor: Sang Don Lee
  • Publication number: 20200112474
    Abstract: In an information processing method performed in a first gateway device among a plurality of gateway devices for managing a plurality of nodes, a current characteristic value recorded in a first node of the plurality of nodes is replaced with a new characteristic value. Then, a database is updated so that the database stores new information on the first node to which the new characteristic value is reflected. The new information on the first node is transmitted to another gateway device of the plurality of gateway devices.
    Type: Application
    Filed: October 8, 2019
    Publication date: April 9, 2020
    Inventors: Deog Ki SEONG, Myung-Koo KANG, Min-Su PARK, Sang Don LEE
  • Patent number: 10533661
    Abstract: A method for controlling a vehicle installed with an automatic transmission, includes: a sudden stop determination step in which a controller determines whether the vehicle has stopped at a speed greater than or equal to a reference deceleration speed and whether a post-stop elapsed time is within a first reference time; a takeoff determination step in which the controller determines whether an input torque of the transmission exceeds zero within the first reference time when a shift range is in a driving range; a pressure control step in which, when the vehicle takes off, the controller elevates a line pressure of the transmission; a limitation determination step in which if a slippage extent of a turbine exceeds a reference slippage value for a second reference time, the controller limits the takeoff; and a torque reduction step in which the controller reduces a takeoff torque input of the transmission.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: January 14, 2020
    Assignee: Hyundai Motor Company
    Inventors: Jae Young Choi, Hye Kil Hwang, Sang Don Lee, Woo Suk Choi, Joon Shik Park