Abstract: Discussed is a connection structure between a battery and a protection circuit module (PCM) in a battery pack in which a battery cell is connected to the PCM. The battery cell can include a battery cell main body, and an electrode lead tab electrically connected with the battery cell main body. The PCM can include a printed circuit board (PCB), which can include an insulation board, a second copper foil layer in contact with a first surface of the insulation board, a first copper foil layer above the second copper foil layer, and a first prepreg layer between the first copper foil layer and the second copper foil layer. The electrode lead tab of the battery cell can directly contact the first copper foil layer of the PCM.

Abstract: A coil component includes a body, a coil disposed in the body, an external electrode disposed on one surface of the body and including at least one recess, and a via electrode disposed in the body and connecting the coil to the external electrode.

Abstract: An embodiment is battery charging system including an external voltage conversion device including an input unit configured to receive a system AC voltage, an output unit configured to output a charging DC voltage, and a power factor correction circuit including a first switching circuit connected to the input unit, a second switching circuit connected to the output unit, and a transformer connected between the first switching circuit and the second switching circuit, and an electrified vehicle including a charging port configured to receive the charging DC voltage, a battery, a motor having a plurality of windings, an inverter connected to each of one-side ends of the plurality of windings, and a relay connected between the charging port and a neutral terminal for the plurality of windings, the electrified vehicle controlling the relay upon recharging of the battery.

Abstract: A disclosed sizing roller apparatus for a folding process of a battery cell includes: a table fixing and supporting a battery cell; a base plate disposed on a side of the table; a plurality of sizing rollers disposed on the base plate and each having a rotation axis, which is inclined inward toward a folding portion of the battery cell, to press the folding portion of the battery cell in contact with the folding portion; and a plurality of air spray nozzles disposed on the base plate and spraying air to the plurality of sizing rollers.

Abstract: A coil component includes a body, a substrate, a first coil, a second coil, a plurality of conductive vias connecting an innermost turn of the first coil and an innermost turn of the second coil to each other, a first external electrode connected to one end of the first coil, and a second external electrode connected to one end of the second coil, wherein the innermost turn of the first coil includes a first region having a line width, narrower than a line width of an adjacent outer turn, and the innermost turn of the second coil includes a second region having a line width, narrower than a line width of an adjacent outer turn, and at least one of the plurality of conductive vias is connected to the first region, and at least one of the other conductive vias is connected to the second region.

Abstract: A touch display device can include a touch screen panel including an active area and a non-active area adjacent to the active area, a dam structure in the non-active area and configured to surround at least a portion of the active area, at least one encapsulation layer to correspond to the active area and the non-active area, a plurality of touch electrodes on the at least one encapsulation layer in the active area and configured to receive and process touches, a first touch line being a touch electrode connection line to connect the plurality of touch electrodes in the active area, a second touch line being an extension of one of the plurality of touch electrodes and disposed on the first touch line in the non-active area, and a touch buffer layer between the dam structure and the first touch line in the non-active area.

Abstract: Exemplary semiconductor structures and processing methods may include forming a first portion of a first semiconductor layer characterized by a first etch rate for an etch treatment, forming a second portion of the first semiconductor layer characterized by a second etch rate that is less than the first etch rate for the etch treatment, and forming a third portion of the first semiconductor layer characterized by a third etch rate that is greater than the second etch rate. The processing methods may further include etching an opening through the first semiconductor layer, where the opening has a height and a width, and where the opening is characterized by a variation in the width between a midpoint of the height of the opening and an endpoint of the opening that is less than or about 5 ?.

Abstract: The present invention can provide a motor including a shaft, a rotor coupled to the shaft, and a stator disposed to correspond to the rotor, wherein the rotor includes a rotor core, a plurality of magnets coupled to the rotor core, and a magnet holder disposed outside the magnets, the rotor core includes protrusions disposed between the adjacent magnets, the magnet holder includes a first part disposed on a side surface of each of the magnets and a second part connected to the first part and disposed on one surface of the magnet, the second part includes holes, and a part of each of the protrusions and a part of the magnet are exposed through one of the holes.

Abstract: A wafer transport box according to an embodiment of the present disclosure includes a lower housing including a bottom plate and at least one lower rib which is formed vertically on an upper surface of the bottom plate and which forms a wall formed in an arc shape so that wafers are stacked in an inner space, an upper housing including an upper plate and an upper rib which is formed vertically on a lower surface of the upper plate and which forms a wall formed in an arc shape, and a sidewall member coupled inside the lower rib. Further, when the upper housing and the lower housing are coupled to each other, the sidewall member fixes the wafers stacked in the inner space.

Abstract: A coil component includes a body having first and second surfaces opposing each other, and third and fourth surfaces connected to the first and second surfaces and opposing each other, a support member disposed in the body, a coil disposed on at least one surface of the support member and including at least one turn around a core, a first non-magnetic layer extending from a side surface of the support member to the first to fourth surfaces of the body, and first and second external electrodes disposed on the body and connected to the coil.

Abstract: A coil component includes a body including a first surface and a second surface opposing each other in a first direction, a coil portion disposed in the body and including first and second coils, and a via connecting the first and second coils to each other, an insulating film covering the coil portion and extending to a region between the first and second coils, and first and second external electrodes disposed on the body and connected to the coil portion. The insulating film is in contact with at least one of opposing surfaces of the first and second coils which face each other and is in contact with a side surface of the via.

Abstract: A wafer storage container and a cap assembly according to an embodiment include a storage container having a space accommodating at least one wafer therein, a fastening portion having a fastening space capable of fastening a cap, and the cap having a locking portion which is formed linearly on a first side of the cap and which has an end portion provided with a first protrusion portion, the cap being configured in a structure in which the locking portion is fastened to the fastening portion. The fastening portion includes an inner wall, and a fastening hole which is formed in a first side of the fastening portion such that the locking portion is fastened thereto. The cap includes a fixing wall in close contact with the inner wall, thereby fixing the cap to the fastening portion.

Abstract: The present application relates to a solid oral preparation and a preparation method therefor, the preparation comprising granules, which comprise: as an active ingredient, a carbamate compound of chemical formula 1, or a pharmaceutically acceptable salt, an isomer, solvate or a hydrate thereof; a diluent; and a binder.

Abstract: Exemplary semiconductor structures and processing methods may include forming a first portion of a first semiconductor layer characterized by a first etch rate for an etch treatment, forming a second portion of the first semiconductor layer characterized by a second etch rate that is less than the first etch rate for the etch treatment, and forming a third portion of the first semiconductor layer characterized by a third etch rate that is greater than the second etch rate. The processing methods may further include etching an opening through the first semiconductor layer, where the opening has a height and a width, and where the opening is characterized by a variation in the width between a midpoint of the height of the opening and an endpoint of the opening that is less than or about 5 ?.

Abstract: A wafer storage container and a cap assembly according to an embodiment include a storage container having a space accommodating at least one wafer therein, a fastening portion having a fastening space capable of fastening a cap, and the cap having a locking portion which is formed linearly on a first side of the cap and which has an end portion provided with a first protrusion portion, the cap being configured in a structure in which the locking portion is fastened to the fastening portion. The fastening portion includes an inner wall, and a fastening hole which is formed in a first side of the fastening portion such that the locking portion is fastened thereto. The cap includes a fixing wall in close contact with the inner wall, thereby fixing the cap to the fastening portion.

Abstract: A laser transmission characteristic value determination method for determining an appropriate transmission characteristic value of a laser so that a marked letter becomes a predetermined font size or more when marking a letter on a surface of a heat shrinkable tube formed on the outer periphery of a battery cell.

Abstract: Semiconductor processing systems and method are described that may include flowing deposition precursors into a substrate processing region of a semiconductor processing chamber, where the substrate processing region includes an electrostatic chuck. The methods may further include depositing a seasoning layer on the electrostatic chuck from the deposition precursors to form a seasoned electrostatic chuck. The seasoning layer may be characterized by a dielectric constant greater than or about 3.5. The methods may still further include applying a voltage to the seasoned electrostatic chuck of greater than or about 500 V. The seasoned electrostatic chuck may be characterized by a leakage current of less than or about 25 mA when the voltage is applied.

Abstract: A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, ? ? ? D × ? ? ? H ? ? ? D + ? ? ? H ? 1.0 , where ?D is a standard deviation of tablet diameters and ?H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Abstract: A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.

Abstract: A touch display device can include a touch screen panel including an active area and a non-active area adjacent to the active area, a dam structure in the non-active area and configured to surround at least a portion of the active area, at least one encapsulation layer to correspond to the active area and the non-active area, a plurality of touch electrodes on the at least one encapsulation layer in the active area and configured to receive and process touches, a first touch line being a touch electrode connection line to connect the plurality of touch electrodes in the active area, a second touch line being an extension of one of the plurality of touch electrodes and disposed on the first touch line in the non-active area, and a touch buffer layer between the dam structure and the first touch line in the non-active area.