Abstract: A swarm robot and a sweeping method using the swarm robot are provided. The swarm robot removes a plurality of objects in a given sweeping area, and at least two swarm robots collaborate to remove the individual object. The swarm robot searches the sweeping area, detects environment information of the sweeping area, locates the swarm robot in the sweeping area, generates a local map and an object map using the environment information and the acquired position, moves to the object according to the local map and the object map, and removes the object.

Abstract: A device, comprising: a base plate configured to be moveable toward and back from a metal rule having at least one flanged side, wherein the metal rule is fed into the device along a metal rule feeding path; a first plate coupled to the base plate, the first plate including a plurality of cutter holes formed on its surface; a plurality of cutting elements configured to engage the corresponding plurality of cutter holes on the first plate to make cuts on the at least one flanged side of the metal rule.

Abstract: An imaging apparatus includes: a rotator having a shape of a perforated circular plate and rotating around a rotating axis of a center of the perforated circular plate; and a supporter having a perforated circular plate and one side of which is connected to one side of the rotator such that the rotator is restricted only to rotation movement. The supporter includes a supporter opening/closing part a part of which is separated along the rotating axis and then rotates by a predetermined angle around the rotating axis, and the rotator includes a rotator opening/closing part a part of which integrally moves with the supporter opening/closing part.

Abstract: Provided is an apparatus for continuously fabricating superconducting tapes. An evaporation using drum in dual chamber (EDDC) method is suitable for mass production of high-temperature superconducting tapes. However, the EDDC method is limited to fabrication of high-temperature superconducting tapes having a limited length. In an attempt, high-temperature super-conducting tapes having a sufficiently large length can be fabricated using the EDDC method by releasing a long high-temperature superconducting tape from one reel and winding the long high-temperature superconducting tape around the other reel. In this case, it is important to stably move a high-temperature superconducting tape spirally wound around a drum from one reel to the other reel. Therefore, the provided apparatus uses endless tract belts separately disposed around a drum to stably and continuously move a high-temperature superconducting tape spirally wound around the drum along the centerline of the drum from one reel to the other reel.

Abstract: The present invention relates to a stage, particularly to, a stage which is able to move minutely, having a rigidity-improved transfer part. A stage includes a work table on which a working object is placed, a motor configured to provide a rotational force, a shaft rotated by the motor to transfer the work table, a linear moving part configured to be expandable to linearly move the shaft in an axial direction, the linear moving part having a hollow to insert an end of the shaft therein, and an expanding part configured to be expandable as far as the shaft is moved by the linear moving part.

Abstract: A swarm robot and a sweeping method using the swarm robot are provided. The swarm robot removes a plurality of objects in a given sweeping area, and at least two swarm robots collaborate to remove the individual object. The swarm robot searches the sweeping area, detects environment information of the sweeping area, locates the swarm robot in the sweeping area, generates a local map and an object map using the environment information and the acquired position, moves to the object according to the local map and the object map, and removes the object.

Abstract: A device, comprising: a base plate configured to be moveable toward and back from a metal rule having at least one flanged side, wherein the metal rule is fed into the device along a metal rule feeding path; a first plate coupled to the base plate, the first plate including a plurality of cutter holes formed on its surface; a plurality of cutting elements configured to engage the corresponding plurality of cutter holes on the first plate to make cuts on the at least one flanged side of the metal rule.

Abstract: An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.

Abstract: An imaging apparatus includes: a rotator having a shape of a perforated circular plate and rotating around a rotating axis of a center of the perforated circular plate; and a supporter having a perforated circular plate and one side of which is connected to one side of the rotator such that the rotator is restricted only to rotation movement. The supporter includes a supporter opening/closing part a part of which is separated along the rotating axis and then rotates by a predetermined angle around the rotating axis, and the rotator includes a rotator opening/closing part a part of which integrally moves with the supporter opening/closing part.

Abstract: The present invention relates to a stage, particularly to, a stage which is able to move minutely, having a rigidity-improved transfer part. A stage includes a work table on which a working object is placed, a motor configured to provide a rotational force, a shaft rotated by the motor to transfer the work table, a linear moving part configured to be expandable to linearly move the shaft in an axial direction, the linear moving part having a hollow to insert an end of the shaft therein, and an expanding part configured to be expandable as far as the shaft is moved by the linear moving part.

Abstract: Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.

Abstract: Disclosed herein is a high temperature superconducting film and an apparatus for fabricating a high temperature superconducting film in a vacuum chamber through auxiliary cluster beam spraying using an evaporation method, wherein a high temperature superconducting material is deposited on a substrate in a vapor state by evaporating the high temperature superconducting material, and at the same time, a cluster beam material is formed into gas atoms by heating the cluster beam material charged in a material housing, and the formed gas atoms pass through a nozzle of an inlet of the material housing and then are sprayed and grown on the substrate in the form of the cluster beam, thereby forming pinning centers in the high temperature superconducting film.

Abstract: A channel letter bending machine for bending a return of a channel letter from a stock includes a feeding unit disposed along a path of travel of the stock to be bent for feeding the stock, a flanging unit for forming a flange along one edge of the stock, a notching unit for notching the flange of the stock fed by the feeding mechanism along the path of travel, and a bending unit for bending the stock under the control of the computer control system into the desired configuration for the channel letter shape, wherein the notching unit and the flanging unit are disposed upstream of the bending unit and the flanging unit is disposed upstream of the notching unit.

Abstract: Disclosed herein is a method of fabricating a high temperature superconducting film in a vacuum chamber through auxiliary cluster beam spraying using an evaporation method, wherein a high temperature superconducting material is deposited on a substrate in a vapor state by evaporating the high temperature superconducting material, and at the same time, a cluster beam material is formed into gas atoms by heating the cluster beam material charged in a housing, and the formed gas atoms pass through a nozzle of an inlet of the housing and then are sprayed and grown on the substrate in the form of the cluster beam, thereby forming pinning centers in the high temperature superconducting film.

Abstract: Provided is an apparatus for continuously fabricating superconducting tapes. An evaporation using drum in dual chamber (EDDC) method is suitable for mass production of high-temperature superconducting tapes. However, the EDDC method is limited to fabrication of high-temperature superconducting tapes having a limited length. In an attempt, high-temperature super-conducting tapes having a sufficiently large length can be fabricated using the EDDC method by releasing a long high-temperature superconducting tape from one reel and winding the long high-temperature superconducting tape around the other reel. In this case, it is important to stably move a high-temperature superconducting tape spirally wound around a drum from one reel to the other reel. Therefore, the provided apparatus uses endless tract belts separately disposed around a drum to stably and continuously move a high-temperature superconducting tape spirally wound around the drum along the centerline of the drum from one reel to the other reel.

Abstract: Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.

Abstract: A channel letter bending machine for bending a return of a channel letter from a stock includes a feeding unit disposed along a path of travel of the stock to be bent for feeding the stock, a flanging unit for forming a flange along one edge of the stock, a notching unit for notching the flange of the stock fed by the feeding mechanism along the path of travel, and a bending unit for bending the stock under the control of the computer control system into the desired configuration for the channel letter shape, wherein the notching unit and the flanging unit are disposed upstream of the bending unit and the flanging unit is disposed upstream of the notching unit.

Abstract: A channel letter bending machine for bending a return of a channel letter from a stock includes a feeding unit disposed along a path of travel of the stock to be bent for feeding the stock, a flanging unit for forming a flange along one edge of the stock, a notching unit for notching the flange of the stock fed by the feeding mechanism along the path of travel, and a bending unit for bending the stock under the control of the computer control system into the desired configuration for the channel letter shape, wherein the notching unit and the flanging unit are disposed upstream of the bending unit and the flanging unit is disposed upstream of the notching unit.

Abstract: A thermal diffusion apparatus as an object for guiding and reflecting heat, which is provided between grill and heat source and is configured so as to diffuse the heat supplied directly upwards from the heat source for uniform dispersion thereof, is disclosed. The disclosed thermal diffusion apparatus includes a heat inducing diffuser for diffusing the heat supplied directly upwards from the heat source to induce it in a 360 degree radial direction of the grill; and a support for supporting the heat inducing diffuser so as to place said heat inducing diffuser between heat source and grill.

Abstract: Disclosed herein is a method of fabricating a high temperature superconducting film in a vacuum chamber through auxiliary cluster beam spraying using an evaporation method, wherein a high temperature superconducting material is deposited on a substrate in a vapor state by evaporating the high temperature superconducting material, and at the same time, a cluster beam material is formed into gas atoms by heating the cluster beam material charged in a housing, and the formed gas atoms pass through a nozzle of an inlet of the housing and then are sprayed and grown on the substrate in the form of the cluster beam, thereby forming pinning centers in the high temperature superconducting film.