Abstract: A resin composition includes a polymer including a repeating unit represented by Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the specification, and a solvent and an organic film manufactured using the same is provided.

Abstract: A photosensitive resin composition, a pixel defining layer, and a display device, the composition including a binder resin; a photopolymerizable monomer; a photopolymerization initiator including a first photopolymerization initiator and a second photopolymerization initiator; a black colorant; and a solvent, wherein the first photopolymerization initiator is represented by Chemical Formula 1, the second photopolymerization initiator has a different maximum absorption wavelength from the first photopolymerization initiator, and the first photopolymerization initiator and the second photopolymerization initiator are included in a weight ratio of about 3:7 to about 7:3,

Abstract: A photosensitive resin composition includes a binder resin, a black colorant, a photopolymerizable monomer, a photopolymerization initiator, and a solvent. The binder resin includes a first binder resin having a glass transition temperature of about ?50° C. to about 150° C. and a second binder resin having a glass transition temperature of greater than about 150° C.

Abstract: A refrigerator includes a storage chamber; an evaporator; an evaporator receiving portion and a defrost water tray slantingly arranged at a lower side of the evaporator receiving portion; a machinery chamber having an evaporation tray; an upper hose communicated with the defrost water tray; a lower hose connected to the upper hose while extending to the evaporation tray, the lower hose being provided, at one side thereof, with an air inlet hole to introduce outside air. The air inlet hole is formed at a slanted mounting surface protruding inside of a vertically-extending portion of the lower hose while being slanted downward. An opening and closing unit is provided in the vertically-extending portion of the lower hose that is configured to open the air inlet hole by an internal pressure of the storage chamber during opening of the door, and to close the air inlet hole by gravity.

Abstract: A refrigerator includes a body, first and second storage compartments, first and second refrigerating units to cool the first and second storage compartments, and a heat exchanger to individually condense first and second refrigerants of the first and second refrigerating units and a second refrigerant of the second refrigerating unit. The heat exchanger includes first and second headers each having an opening formed in the outer wall, a tube inserted into the first and second headers through the openings, and a baffle disposed in the internal space of the first header so as to partition off the internal space of the first header. The tube includes a plurality of channels spaced apart from each other by a predetermined gap, and the baffle blocks at least one of the plurality of channels.

Abstract: A method for fabricating a semiconductor device includes: forming an inter-layer dielectric layer and a sacrificial layer over a substrate so that the sacrificial layer covers the inter-layer dielectric layer; forming a conductive pattern that is coupled with a portion of the substrate while penetrating through the inter-layer dielectric layer and the sacrificial layer; protruding a first portion of the conductive pattern by removing the sacrificial layer while maintaining a second portion of the conductive pattern inside the inter-layer dielectric layer; oxidizing the protruded first portion of the conductive pattern without oxidizing the second portion of the conductive pattern; removing the oxidized first portion of the conductive pattern to expose a top of the second portion of the conductive pattern; and forming a variable resistance element on top of the conductive pattern to couple a bottom of the variable resistance element with the top of the second portion of the conductive pattern.

Abstract: A method for fabricating an electronic device is provided to include: forming a hard mask pattern over a substrate to expose a gate formation region; forming a gate trench by etching the substrate using the hard mask pattern; forming a gate insulating layer over an inner wall of the gate trench; forming a gate electrode filling a lower portion of the gate trench in which the gate insulating layer is formed; forming an insulating material covering a resultant structure in which the gate electrode is formed; forming a gate protective layer having a top surface lower than a bottom surface of the hard mask pattern; removing the hard mask pattern; recessing the substrate so that a top surface of the substrate is lower than the top surface of the gate protective layer; and forming a conductive pattern filling a space formed by the recessing of the substrate.

Abstract: A method for fabricating a semiconductor device includes: forming an inter-layer dielectric layer and a sacrificial layer over a substrate so that the sacrificial layer covers the inter-layer dielectric layer; forming a conductive pattern that is coupled with a portion of the substrate while penetrating through the inter-layer dielectric layer and the sacrificial layer; protruding a first portion of the conductive pattern by removing the sacrificial layer while maintaining a second portion of the conductive pattern inside the inter-layer dielectric layer; oxidizing the protruded first portion of the conductive pattern without oxidizing the second portion of the conductive pattern; removing the oxidized first portion of the conductive pattern to expose a top of the second portion of the conductive pattern; and forming a variable resistance element on top of the conductive pattern to couple a bottom of the variable resistance element with the top of the second portion of the conductive pattern.

Abstract: A refrigerator includes a body, first and second storage compartments and a machine compartment formed in the body, a blower fan disposed in the machine compartment, first and second refrigerating units comprising first and second compressors to compress first and second refrigerants, respectively, first and second condensers to condense the first and second refrigerants, respectively, first and second expansion valves to expand the first and second refrigerants, respectively, and first and second evaporators to evaporate the first and second refrigerants, respectively, the first and second refrigerating units supplying cold air to the first and storage compartments, respectively. The first compressor, the second compressor, and the first condenser are disposed in the machine compartment and are cooled by forcible flow of air caused by the blower fan, and the second condenser is disposed outside the machine compartment and is cooled by natural convection of air.

Abstract: A device includes a substrate; a light blocking layer on the substrate; a passivation film covering the light blocking layer on the substrate; a thin film transistor on the passivation film; another passivation film covering the thin film transistor; a color filter on the another passivation film; and an insulation layer on the another passivation film and covering the color filter, wherein the light blocking layer is patterned using a composition including a heat resistance polymer, a cross-linking agent, a black colorant, and a solvent. A method of patterning the light blocking layer is also provided.

Abstract: A resin composition includes a polymer including a repeating unit represented by Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the specification, and a solvent and an organic film manufactured using the same is provided.

Abstract: A method for fabricating an electronic device including a semiconductor memory may include: forming a first interlayer dielectric layer over a substrate to have an opening exposing the substrate; forming a bottom electrode in a portion of the opening to have an exposed top surface; forming a variable resistance material layer along sidewalls of the remaining portion of the opening and the exposed top surface of the bottom electrode; forming a top electrode over the variable resistance material layer so as to fill the opening; etching the first interlayer dielectric layer to a predetermined depth to expose a part of the variable resistance material layer surrounding sidewalls of the top electrode; and removing the part of the variable resistance material layer to form a unit cell.

Abstract: A thin film transistor (“TFT”) array panel includes; an insulation substrate, a TFT disposed on the insulation substrate and including a drain electrode, a passivation layer covering the TFT and including a contact portion disposed therein corresponding to the drain electrode, a partition comprising an organic material disposed on the passivation layer, and including a transverse portion, a longitudinal portion, and a contact portion disposed on the drain electrode, a color filter disposed on the passivation layer and disposed in a region defined by the partition, an organic capping layer disposed on the partition and the color filter, and a pixel electrode disposed on the organic capping layer, and connected to the drain electrode through the contact portion of the passivation layer and the contact portion of the partition, wherein a contact hole is formed in the organic capping layer corresponding to the contact portion of the passivation layer.

Abstract: A black photosensitive resin composition includes (A) an alkali soluble polyimide-polyamic acid copolymerization resin; (B) a multi-functional monomer; (C) a photopolymerization initiator; (D) a black colorant; and (E) a solvent, a photosensitive resin layer manufactured using the same, and a display device including the photosensitive resin layer.

Abstract: A black photosensitive resin composition includes (A) an alkali soluble polyimide-polyamic acid copolymerization resin; (B) a multi-functional monomer; (C) a photopolymerization initiator; (D) a black colorant; and (E) a solvent, a photosensitive resin layer manufactured using the same, and a display device including the photosensitive resin layer.

Abstract: A method for fabricating an electronic device including a semiconductor memory may include: forming a first interlayer dielectric layer over a substrate to have an opening exposing the substrate; forming a bottom electrode in a portion of the opening to have an exposed top surface; forming a variable resistance material layer along sidewalls of the remaining portion of the opening and the exposed top surface of the bottom electrode; forming a top electrode over the variable resistance material layer so as to fill the opening; etching the first interlayer dielectric layer to a predetermined depth to expose a part of the variable resistance material layer surrounding sidewalls of the top electrode; and removing the part of the variable resistance material layer to form a unit cell.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: A method for fabricating an electronic device including a semiconductor memory may include: forming a first interlayer dielectric layer over a substrate to have an opening exposing the substrate; forming a bottom electrode in a portion of the opening to have an exposed top surface; forming a variable resistance material layer along sidewalls of the remaining portion of the opening and the exposed top surface of the bottom electrode; forming a top electrode over the variable resistance material layer so as to fill the opening; etching the first interlayer dielectric layer to a predetermined depth to expose a part of the variable resistance material layer surrounding sidewalls of the top electrode; and removing the part of the variable resistance material layer to form a unit cell.

Abstract: A pedestrian detection radar for detecting a human being using a crosswalk using an ultra-wide band (UWB) pulse signal and a traffic light control system including the same are provided. The pedestrian detection radar includes a first transmitting module configured to transmit a first signal having a UWB pulse to a detection region; a receiving module configured to receive a second signal which is reflected from an object in the detection region and is related with the first signal; an analyzing module configured to analyze the second. signal, to determine whether the object is a human being according to an analysis result, and to generate a determination signal; and a second transmitting module configured to generate a control signal using the determination signal and to transmit the control signal to the traffic light.

Abstract: A hose clip includes a body made of a steel material, and a composite coating film formed on a surface of the body. The composite coating film is clear post-processed with a silicate-based material so that a silicate inorganic binder and an acrylic inorganic binder are appropriately diluted in the hose clip to perform clear post-processing coating, thereby preventing corrosion by potential difference and improving visibility. Phenomenon such as coolant leakage and engine burning due to fastening omission of the hose clip may be prevented to improve marketability and durability of a vehicle, and a manufacturing process of the hose clip.