Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

Abstract: A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.

Abstract: A display device includes a first substrate, a display section that is on the first substrate and that displays an image, first pad portions at a first directional edge of the first substrate and connected to the display section and to a driver integrated circuit (driver IC) that supplies a driving voltage, a second substrate on the first substrate with the display section interposed therebetween, and which exposes the first pad portions, a touch section that is on the second substrate and that corresponds to the display section, second pad portions on the second substrate and connected to edges of the touch section, a main flexible printed circuit board (main FPCB) connected to the first pad portions, and a touch flexible printed circuit board (touch FPCB) connected to the second pad portions and overlapping the main FPCB.

Abstract: A display panel that includes: a display substrate; a driving chip bonded onto the display substrate; an anisotropic conductive film provided between the display substrate and the driving chip; and a protection film attached to a bottom of the display substrate, and the protection film is provided with a bending prevention means.

Abstract: An anisotropic conductive film laminate is provided. The anisotropic conductive film laminate includes a first non-conductive film, an anisotropic conductive film disposed on the first non-conductive film, and a second non-conductive film disposed on the anisotropic conductive film, wherein the first non-conductive film has a higher viscosity than the second non-conductive film, and a lower viscosity than the anisotropic conductive film.

Abstract: A display panel that includes: a display substrate; a driving chip bonded onto the display substrate; an anisotropic conductive film provided between the display substrate and the driving chip; and a protection film attached to a bottom of the display substrate, and the protection film is provided with a bending prevention means.

Abstract: A display device includes a first substrate, a display section that is on the first substrate and that displays an image, first pad portions at a first directional edge of the first substrate and connected to the display section and to a driver integrated circuit (driver IC) that supplies a driving voltage, a second substrate on the first substrate with the display section interposed therebetween, and which exposes the first pad portions, a touch section that is on the second substrate and that corresponds to the display section, second pad portions on the second substrate and connected to edges of the touch section, a main flexible printed circuit board (main FPCB) connected to the first pad portions, and a touch flexible printed circuit board (touch FPCB) connected to the second pad portions and overlapping the main FPCB.

Abstract: A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.

Abstract: A method for fabricating a semiconductor device, including forming a gate insulating film and a gate electrode film on a semiconductor substrate, and patterning the gate electrode film to form a gate electrode. A portion of the gate insulating film is removed to form an undercut region beneath the gate electrode. A buffer silicon film is formed over an entire surface of the resultant substrate to cover the gate electrode and to fill the undercut region. The buffer silicon film is selectively oxidized to form a buffer silicon oxide film.

Abstract: A method for fabricating a semiconductor device, including forming a gate insulating film and a gate electrode film on a semiconductor substrate, and patterning the gate electrode film to form a gate electrode. A portion of the gate insulating film is removed to form an undercut region beneath the gate electrode. A buffer silicon film is formed over an entire surface of the resultant substrate to cover the gate electrode and to fill the undercut region. The buffer silicon film is selectively oxidized to form a buffer silicon oxide film.