Abstract: A main body (100) may constitute the frame of a drying apparatus, and a moving bar (230) may be mounted to the main body (100) to move up and down along the front surface thereof. The moving bar (230) may be moved up and down by being driven by the drive assembly (210). Most of the drive assembly (210) may be installed at a position corresponding to the installation space (150) of a duct (130) formed in the main body (100).

Abstract: A drying apparatus is proposed. A moving bar (230) may be mounted to a main body (100) of the drying apparatus to move relative thereto. The inlet (248) may be formed in a side of a lower surface of the moving bar (230), the inlet allowing air to be introduced into the moving bar (230). The bar fan assembly (250) may be provided in the moving bar (230). The nozzle slot (245?) may be formed in the moving bar (230), the nozzle slot allowing the air to be discharged slantingly toward a front lower part of the main body (100). A bar casing (232) having an open lower part and a bar cover (242) covering the open lower part may constitute the exterior of the moving bar (230).

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: A filter assembly and a drying apparatus having the filter assembly are proposed. The filter assembly (180) may purify air introduced into the main body (100) of the drying apparatus. The filter assembly (180) may be protruded by a predetermined distance to a side surface of the main body (100) by the moving plate (190). The filter frame (182) protruded by the moving plate (190) may be removed from the moving plate (190) to perform maintenance of filters (184, 186, 188).

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: An apparatus and method for designing an amplifier are proposed. The method may include measuring a frequency of an object by coming into contact with the object wherein the object generates vibration energy, and calculating a natural frequency of the object. The method may also include, in correspondence to a selection of one vibration energy amplifier from among a plurality of vibration energy amplifiers that are preset, loading specification information about the selected vibration energy amplifier. The method may further include specifying at least one parameter in the specification information of the vibration energy amplifier so as to coincide with the natural frequency of the object.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: Embodiments may relate to an optical modulator system. The optical modulator system may include a first photodiode to measure a first optical level at an output of a Mach-Zehnder modulator (MZM). The system may further include a second photodiode to measure a second optical level at a termination of the MZM. The system may further include a logic coupled with the first photodiode and the second photodiode, the logic to identify a modulator bias that minimizes the first optical level. Other embodiments may be described or claimed.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: Methods/structures of forming package structures are described. Those methods/structures may include a mold material, wherein a plurality of die are embedded in the mold material, a package substrate, wherein the mold material comprising the plurality of die is at least partially embedded in a cavity of the substrate, and wherein a liner is between side and bottom portions of the mold material and the package substrate, at least one optical die disposed on the package substrate, and a thermal solution disposed on a top surface of the optical die.

Abstract: Embodiments may relate to an optical modulator system. The optical modulator system may include a first photodiode to measure a first optical level at an output of a Mach-Zehnder modulator (MZM). The system may further include a second photodiode to measure a second optical level at a termination of the MZM. The system may further include a logic coupled with the first photodiode and the second photodiode, the logic to identify a modulator bias that minimizes the first optical level. Other embodiments may be described or claimed.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an apparatus comprising an electro-optical modulation device with a bias control and adjustment. In some embodiments, the apparatus may comprise an electro-optical modulator having first and second arms, to modulate light passing through the first and second arms in response to an input data signal, and output a corresponding optical data signal. The apparatus may further comprise a control module coupled with the electro-optical modulator, to differentially adjust respective phases of first or second light portions passing through the first and second arms, to achieve a bias point for the optical data signal. The bias point may define a desired power output of the apparatus that corresponds to the optical data signal. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein may include apparatuses, systems, and processes related to a photonic die package with an edge lens that includes a photonic integrated circuit (IC) die, a lens coupled to the photonic IC die and disposed at an edge of the package to provide an optical path at the edge of the package for photon signals generated or received by the photonic IC die, and an electronic IC die coupled to the photonic IC die, where the electronic IC die is to process electrical signals received from the photonic IC die, and where the electronic IC die and the photonic IC die are in a stack formation to facilitate thermal energy conduction from the electronic IC die to the photonic IC die. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an apparatus comprising an electro-optical modulation device with a bias control and adjustment. In some embodiments, the apparatus may comprise an electro-optical modulator having first and second arms, to modulate light passing through the first and second arms in response to an input data signal, and output a corresponding optical data signal. The apparatus may further comprise a control module coupled with the electro-optical modulator, to differentially adjust respective phases of first or second light portions passing through the first and second arms, to achieve a bias point for the optical data signal. The bias point may define a desired power output of the apparatus that corresponds to the optical data signal. Other embodiments may be described and/or claimed.

Abstract: The disclosure provides an electrophotographic toner and methods for preparing the electrographic toner. The electrographic toner includes a binder, a colorant and a releasing agent, wherein the electrophotographic toner includes strontium (Sr), iron (Fe), titanium (Ti), and silicon (Si) containing particles; wherein, if [Sr], [Fe], [Ti] and [Si] denote the intensities of Sr, Fe, Ti, and Si in the electrophotographic toner, respectively, as measured by X-ray fluorescence spectrometry, then the [Sr]/[Fe] ratio is in the range of about 5.0×10?1 to about 4.5, the [Ti]/[Fe] ratio is in the range of about 5.0×10?1 to about 8.1×10?1, and the [Si]/[Fe] ratio is in the range of about 2.0×10?3 to about 4.0×10?3.

Abstract: The disclosure provides an electrophotographic toner and methods for preparing the electrographic toner. The electrographic toner includes a binder, a colorant and a releasing agent, wherein the electrophotographic toner includes strontium (Sr), iron (Fe), titanium (Ti), and silicon (Si) containing particles; wherein, if [Sr], [Fe], [Ti] and [Si] denote the intensities of Sr, Fe, Ti, and Si in the electrophotographic toner, respectively, as measured by X-ray fluorescence spectrometry, then the [Sr]/[Fe] ratio is in the range of about 5.0×10?1 to about 4.5, the [Ti]/[Fe] ratio is in the range of about 5.0×10?1 to about 8.1×10?1, and the [Si]/[Fe] ratio is in the range of about 2.0×10?3 to about 4.0×10?3.

Abstract: In a method of removing particles on an object in accordance with one aspect of the present invention, air is injected into a space where the object is placed to remove foreign substances in the space. A first light is irradiated onto the object to remove charges in the object. A second light is irradiated onto the object to remove moisture droplets between the object and the particles. A third light is irradiated onto the object to remove static electricity between the object and the particles. The particles are then blown off from the object. Thus, an adhesion force between the particles and the object may be removed so that the particles may be readily blown off from the object.

Abstract: In a method of removing particles on an object, a fluid is injected into a spacer where the object is placed to remove foreign substances in the space. A first light is irradiated to the object to remove charges between an upper face of the object and the particles, and inner walls of holes and the particles. A second light is irradiated to the object to remove moisture droplets between the upper face of the object and the particles, and the inner walls of the holes and the particles. A third light is irradiated to the object to remove static electricity between the upper face of the object and the particles, and the inner walls of the holes and the particles. A fluid is applied to the upper face and the holes of the object to remove the particles from the object.