Abstract: An inductor-integrated transformer as an embodiment of the present invention includes a transformer core including an upper core and a lower core; a transformer coil including a primary coil and a secondary coil; an inductor core including an upper core and a lower core; and an inductor coil, wherein the primary coil includes a plurality of input terminals spaced a first distance apart from a first surface of the transformer core; and a plurality of input terminals spaced a second distance apart from a second surface, and the output terminal is electrically connected to the secondary coil and the inductor coil, and the first distance is greater than the second distance.

Abstract: The present invention relates to electrode slurry coating apparatus and method, the present invention ultimately allowing the process efficiency to be increased and rate of errors to be reduced when double-layer structured active material layers are formed by temporally adjusting the height of first and second discharge outlets through which active material is discharged.

Abstract: A flux composition includes an aromatic resin including one benzene ring and one or two hydroxyl (—OH) groups, an activator selected from a group consisting of a dicarboxylic acid and a dicarboxylic anhydride, and a solvent.

Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.

Abstract: A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface.

Abstract: An embedded package includes a chip having a top surface on which a connection member is disposed, a first insulation layer surrounding a portion of the chip, a second insulation layer disposed on the first insulation layer to cover the chip, circuit patterns disposed on a bottom surface of the first insulation layer, a third insulation layer disposed on the bottom surface of the first insulation layer to cover the circuit patterns, an external connection terminal penetrating the third insulation layer to contact any one of the circuit patterns, a metal layer disposed on a top surface of the second insulation layer, a first via penetrating the first insulation layer to electrically couple the connection member to any one of the circuit patterns, and a second via penetrating the first and second insulation layers to electrically couple the metal layer to any one of the circuit patterns.

Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.

Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.

Abstract: A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface.