Abstract: A heat sink is disclosed. The heat sink comprises a base (102, 402) with at least one vapor chamber (208, 408) containing a fluid with a first activation point. The base has at least one vapor chamber (212, 412) containing a fluid with a second activation point. The first activation point is different than the second activation point.

Abstract: Embodiments of a flow control system and method are disclosed. An exemplary method may include causing air to move along an air flow path through at least one inlet formed in the housing over at least a portion of an electronic device, causing the air to move adjacent one or more component of the electronic device, and causing the air to move through at least one outlet formed in the housing. The method may also include adjusting at least one baffle in the air flow path between different positions based on configuration and power requirements of the electronic device to control the air flow through the housing along the air flow path.