Abstract: A housing according to the embodiment includes a lower surface part, an upper surface part, and a side surface part. The lower surface part includes a contact surface contacting an adherend. The upper surface part is separated in a vertical direction from the lower surface part with a first space interposed. The side surface part is provided around the first space and is connected to the upper surface part and the lower surface part. The upper surface part and the side surface part include a first material. The lower surface part includes a second material that is softer than the first material. A portion that includes the second material is exposed for at least a portion of the contact surface.

Abstract: A housing according to the embodiment includes a lower surface part, an upper surface part, and a side surface part. The lower surface part includes a contact surface contacting an adherend. The upper surface part is separated in a vertical direction from the lower surface part with a first space interposed. The side surface part is provided around the first space and is connected to the upper surface part and the lower surface part. The upper surface part and the side surface part include a first material. The lower surface part includes a second material that is softer than the first material. A portion that includes the second material is exposed for at least a portion of the contact surface.

Abstract: An ultrasonic probe includes an ultrasonic transducer array and a multilayer body for extracting an electric wiring from each electrode. Transducers are classified into at least a first group and a second group. The multilayer body includes a first FPC layer on which the array is stacked and a second FPC layer on which the first FPC layer is stacked. The first FPC layer and the second FPC layer include upper surface connection pads and lower surface electrode pads which maintain a uniform level at positions spatially corresponding to the respective transducers. FPC layers constituting an FPC multilayer body are bonded to each other to be integrally formed in a region corresponding to the width of the array. On the other hand, the respective FPC layers are not bonded to each other and separated from each other outside the region corresponding to the width of the array.

Abstract: According to an embodiment, a detector pack includes a first substrate, an X-ray detection unit, a second substrate, and a data acquisition device. The first substrate includes a first main surface and a second main surface. The X-ray detection unit is provided in the first main surface, converts an X-ray into an electrical signal, and outputs the electrical signal. The second substrate includes a third main surface and a fourth main surface and is disposed in a posture of making the third main surface face the second main surface. The data acquisition device is provided in at least any one of the third main surface and the fourth main surface.

Abstract: According to an embodiment, a detector pack comprises a first substrate and a second substrate. the first substrate includes a first surface and a second surface. the first substrate is provided with an X-ray detecting element in the first surface. the second substrate includes a third surface and a fourth surface. The second substrate is disposed in the second surface to face the third surface. The second substrate is provided with a data acquisition circuit in the third surface. The first substrate and the second substrate are formed as a stacked body. The data acquisition circuit is provided in the third surface not to come in contact with the second surface of the first substrate.

Abstract: In one embodiment, a control module manufacturing method includes disposing a board, on which electronic components are mounted, in a case includes a top opening, injecting a filler into the case, pressing the filler from the surface side thereof by means of a jig, which comprises an upwardly convex hollow portion corresponding to taller ones of the electronic components with respect to the board and covers the opening and curing the filler.

Abstract: According to an embodiment, a detector pack includes a first substrate, an X-ray detection unit, a second substrate, and a data acquisition device. The first substrate includes a first main surface and a second main surface. The X-ray detection unit is provided in the first main surface, converts an X-ray into an electrical signal, and outputs the electrical signal. The second substrate includes a third main surface and a fourth main surface and is disposed in a posture of making the third main surface face the second main surface. The data acquisition device is provided in at least any one of the third main surface and the fourth main surface.

Abstract: An ultrasonic probe includes an ultrasonic transducer array and a multilayer body for extracting an electric wiring from each electrode. Transducers are classified into at least a first group and a second group. The multilayer body includes a first FPC layer on which the array is stacked and a second FPC layer on which the first FPC layer is stacked. The first FPC layer and the second FPC layer include upper surface connection pads and lower surface electrode pads which maintain a uniform level at positions spatially corresponding to the respective transducers. FPC layers constituting an FPC multilayer body are bonded to each other to be integrally formed in a region corresponding to the width of the array. On the other hand, the respective FPC layers are not bonded to each other and separated from each other outside the region corresponding to the width of the array.

Abstract: According to one embodiment, a radioactive ray detecting apparatus includes: a scintillator that produces visible light from a radioactive ray; a light detecting portion including a light receiving element that generates an electrical signal on a basis of intensity of visible light; a first board; a first electrical connection unit that electrically connects the light detecting portion and a first surface of the first board to each other; a second board disposed to face the first board; a second electrical connection that electrically connects a first surface of the second board and a second surface of the first board being opposite from the first surface of the first board to each other; and a data acquisition device that processes an electrical signal transmitted from the light detecting portion through the first electrical connection unit, the first board, the second electrical connection unit, and the second board.

Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion, a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board.

Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.

Abstract: An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.

Abstract: An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.

Abstract: In one embodiment, a control module manufacturing method includes disposing a board, on which electronic components are mounted, in a case includes a top opening, injecting a filler into the case, pressing the filler from the surface side thereof by means of a jig, which comprises an upwardly convex hollow portion corresponding to taller ones of the electronic components with respect to the board and covers the opening and curing the filler.

Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.

Abstract: According to one embodiment, an ultrasonic probe comprises piezoelectric elements arranged in the form of a two-dimensional array, a processing IC configured to process signal information obtained from the piezoelectric elements, and a flexible wiring substrate disposed between the piezoelectric elements and the processing IC, with the piezoelectric elements mounted on a front surface, and the processing IC mounted on a rear surface.

Abstract: According to one embodiment, a radioactive ray detecting apparatus includes: a scintillator that produces visible light from a radioactive ray; a light detecting portion including a light receiving element that generates an electrical signal on a basis of intensity of visible light; a first board; a first electrical connection unit that electrically connects the light detecting portion and a first surface of the first board to each other; a second board disposed to face the first board; a second electrical connection that electrically connects a first surface of the second board and a second surface of the first board being opposite from the first surface of the first board to each other; and a data acquisition device that processes an electrical signal transmitted from the light detecting portion through the first electrical connection unit, the first board, the second electrical connection unit, and the second board.

Abstract: An ultrasound probe is provided with a piezoelectric sensor module, which includes a plurality of piezoelectric elements arranged two-dimensionally and configured to generate an ultrasound beam so that the beam is reflected by a subject's body and to capture a resulting reflection signal, and a control circuit board that is electrically connected to the piezoelectric sensor module through a flexible substrate and transmits or receives a signal to or from the piezoelectric sensor module. The control circuit board is composed of a transmit-only circuit board, a receive-only circuit board, and a relay flexible substrate that electrically connects the transmit-only and receive-only circuit boards.

Abstract: In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device.