Abstract: A semiconductor crystal body processing method includes providing a semiconductor crystal body, sandwiching the semiconductor crystal body between a pair of conductive pressurizing tools, applying a pulse-like current between the pair of pressurizing tools to heat the semiconductor crystal body to a target temperature equal to or higher than a temperature at which the semiconductor crystal body is plastically deformed by pressurization and lower than its melting point, and applying pressure and a pulse-like current between the pair of pressurizing tools to thereby maintain the temperature of the semiconductor crystal body at the target temperature and mold the semiconductor crystal body into a target shape by plastic deformation.

Abstract: A semiconductor crystal body processing method includes providing a semiconductor crystal body, sandwiching the semiconductor crystal body between a pair of conductive pressurizing tools, applying a pulse-like current between the pair of pressurizing tools to heat the semiconductor crystal body to a target temperature equal to or higher than a temperature at which the semiconductor crystal body is plastically deformed by pressurization and lower than its melting point, and applying pressure and a pulse-like current between the pair of pressurizing tools to thereby maintain the temperature of the semiconductor crystal body at the target temperature and mold the semiconductor crystal body into a target shape by plastic deformation.

Abstract: A discharge plasma machining device that includes punches as a pressing unit for applying a pressure with respect to a machined item, a direct current pulse current generator as a pulse current applying unit for applying a pulse current with respect to the machined item, a spectroscope as a detection unit for detecting a spectrum of light of plasma generated by application of a pulse current, and a control unit for controlling a pulse current in accordance with a detection result of the detection unit.

Abstract: A glass product manufacturing method that includes a step of disposing a workpiece configured of a glass material between two mutually-opposing punches, a step of starting to apply a pulsed current to the workpiece, and a step of starting to apply pressure to the workpiece using the two punches. The glass product is obtained from the workpiece through a discharge plasma process that causes the workpiece to deform in a state where the temperature of the workpiece has been increased by the application of the pulsed current.

Abstract: An acoustic transducer unit includes a first member having a recess, and a plate-like second member having main surfaces. The second member is bonded to the first member so as to cover the recess and form a housing. A microphone element, which is an acoustic transducer, is accommodated in an internal space of the housing, and an acoustic path is provided between the internal space and an external space of the housing. A conductive electromagnetic-shielding member and terminal members for electrically connecting the microphone element and an external circuit are embedded in a resin body of the first member by insert molding. An electromagnetic shield layer of the second member is electrically connected to the electromagnetic-shielding member.

Abstract: A semiconductor crystal body processing method includes providing a semiconductor crystal body, sandwiching the semiconductor crystal body between a pair of conductive pressurizing tools, applying a pulse-like current between the pair of pressurizing tools to heat the semiconductor crystal body to a target temperature equal to or higher than a temperature at which the semiconductor crystal body is plastically deformed by pressurization and lower than its melting point, and applying pressure and a pulse-like current between the pair of pressurizing tools to thereby maintain the temperature of the semiconductor crystal body at the target temperature and mold the semiconductor crystal body into a target shape by plastic deformation.

Abstract: An acoustic transducer unit that includes (a) an acoustic transducer having an acoustic transducer portion that converts sound into an electrical signal or converts an electrical signal into sound, and (b) packages that accommodate the acoustic transducer. The packages include a cylindrical conductive portion formed of a conductive material and having an inner space with both end apertures. At least the acoustic transducer portion of the acoustic transducer is located in the inner space of the conductive portion such as to be spaced from the apertures.

Abstract: An acoustic transducer unit includes a first member having a recess, and a plate-like second member having main surfaces. The second member is bonded to the first member so as to cover the recess and form a housing. A microphone element, which is an acoustic transducer, is accommodated in an internal space of the housing, and an acoustic path is provided between the internal space and an external space of the housing. A conductive electromagnetic-shielding member and terminal members for electrically connecting the microphone element and an external circuit are embedded in a resin body of the first member by insert molding. An electromagnetic shield layer of the second member is electrically connected to the electromagnetic-shielding member.

Abstract: A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.

Abstract: A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.

Abstract: A piezoelectric component prevents development of a short circuit between separate electrodes of a piezoelectric element and provides a high level of connection reliability. The piezoelectric component includes a piezoelectric element utilizing a longitudinal oscillation mode and being mounted on a mounting substrate. The piezoelectric element has on one main surface thereof a first electrode and a second electrode formed by dividing electrode material via longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate. The support members are adhered to and secured to pattern electrodes of the mounting substrate by conductive adhesive.

Abstract: A piezoelectric element prevents the development of a short circuit between separate electrodes and provides a high level of connection reliability. The piezoelectric element utilizing a longitudinal oscillation mode includes a piezoelectric substrate which has on one main surface thereof a first electrode and a second electrode separated by longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate.

Abstract: An ultrasonic sensor includes: a floored cylindrical case, a piezoelectric vibration element and input-output terminals. The floored cylindrical case has a separately prepared cylinder part and a separately prepared vibration part, and the cylinder part and the vibration part are adhered together with an adhesive material having an elastic modulus in the range from 100 through 20,000 kgf/mm.sup.2 at a temperature range from 25 through 125.degree. C. The piezoelectric vibration element is disposed on the inner bottom floor of the floored cylindrical case. The input-output terminals are electrically connected to the piezoelectric vibration element and are adapted for electrical connection to outside of the floored cylindrical case.

Abstract: A piezoelectric component prevents development of a short circuit between separate electrodes of a piezoelectric element and provides a high level of connection reliability. The piezoelectric component includes a piezoelectric element utilizing a longitudinal oscillation mode and being mounted on a mounting substrate. The piezoelectric element has on one main surface thereof a first electrode and a second electrode formed by dividing electrode material via longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate. The support members are adhered to and secured to pattern electrodes of the mounting substrate by conductive adhesive.

Abstract: A piezoelectric element prevents the development of a short circuit between separate electrodes and provides a high level of connection reliability. The piezoelectric element utilizing a longitudinal oscillation mode includes a piezoelectric substrate which has on one main surface thereof a first electrode and a second electrode separated by longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate.