Patents by Inventor Satoru Kuramochi
Satoru Kuramochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335465Abstract: A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.Type: ApplicationFiled: June 26, 2023Publication date: October 19, 2023Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Satoru KURAMOCHI
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Publication number: 20230282557Abstract: A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.Type: ApplicationFiled: May 15, 2023Publication date: September 7, 2023Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Takamasa TAKANO, Satoru KURAMOCHI
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Patent number: 11742273Abstract: A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.Type: GrantFiled: February 5, 2021Date of Patent: August 29, 2023Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Takamasa Takano, Satoru Kuramochi
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Patent number: 11728243Abstract: A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.Type: GrantFiled: October 14, 2020Date of Patent: August 15, 2023Assignee: DAI NIPPON PRINTING CO., LTD.Inventor: Satoru Kuramochi
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Publication number: 20220246512Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: ApplicationFiled: April 21, 2022Publication date: August 4, 2022Inventors: Satoru KURAMOCHI, Sumio KOIWA, Hidenori YOSHIOKA
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Patent number: 11362028Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: GrantFiled: July 23, 2020Date of Patent: June 14, 2022Assignee: Dai Nippon Printing Co., Ltd.Inventors: Satoru Kuramochi, Sumio Koiwa, Hidenori Yoshioka
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Publication number: 20220105494Abstract: An exhaust gas purification catalyst is provided which can be more enhanced in NOx purification performance.Type: ApplicationFiled: January 20, 2020Publication date: April 7, 2022Inventors: Itaru MORITA, Satoru KURAMOCHI, Takahiro KOGAWA, Takashi WAKABAYASHI
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Publication number: 20210159153Abstract: A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.Type: ApplicationFiled: February 5, 2021Publication date: May 27, 2021Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Takamasa TAKANO, Satoru KURAMOCHI
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Patent number: 10950533Abstract: A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.Type: GrantFiled: June 20, 2019Date of Patent: March 16, 2021Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Takamasa Takano, Satoru Kuramochi
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Publication number: 20210028090Abstract: A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.Type: ApplicationFiled: October 14, 2020Publication date: January 28, 2021Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Satoru KURAMOCHI
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Patent number: 10847444Abstract: A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.Type: GrantFiled: March 5, 2019Date of Patent: November 24, 2020Assignee: DAI NIPPON PRINTING CO., LTD.Inventor: Satoru Kuramochi
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Publication number: 20200357733Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: ApplicationFiled: July 23, 2020Publication date: November 12, 2020Inventors: Satoru KURAMOCHI, Sumio KOIWA, Hidenori YOSHIOKA
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Patent number: 10790221Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: GrantFiled: January 15, 2020Date of Patent: September 29, 2020Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Satoru Kuramochi, Sumio Koiwa, Hidenori Yoshioka
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Publication number: 20200152564Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: ApplicationFiled: January 15, 2020Publication date: May 14, 2020Inventors: Satoru KURAMOCHI, Sumio KOIWA, Hidenori YOSHIOKA
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Patent number: 10580727Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: GrantFiled: February 4, 2019Date of Patent: March 3, 2020Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Satoru Kuramochi, Sumio Koiwa, Hidenori Yoshioka
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Publication number: 20190304888Abstract: A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.Type: ApplicationFiled: June 20, 2019Publication date: October 3, 2019Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Takamasa TAKANO, Satoru KURAMOCHI
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Publication number: 20190198427Abstract: A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.Type: ApplicationFiled: March 5, 2019Publication date: June 27, 2019Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Satoru KURAMOCHI
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Publication number: 20190172780Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: ApplicationFiled: February 4, 2019Publication date: June 6, 2019Inventors: Satoru KURAMOCHI, Sumio KOIWA, Hidenori YOSHIOKA
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Patent number: 10256176Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture 5 being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planar view is smallest among a plurality of areas of the through-hole in a planar view, a filler arranged within the 10 through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: GrantFiled: May 19, 2016Date of Patent: April 9, 2019Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Satoru Kuramochi, Sumio Koiwa, Hidenori Yoshioka
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Publication number: 20160276257Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.Type: ApplicationFiled: May 19, 2016Publication date: September 22, 2016Inventors: Satoru KURAMOCHI, Sumio KOIWA, Hidenori YOSHIOKA