Abstract: A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.

Abstract: A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.

Abstract: A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.

Abstract: The present invention provides a gaming machine which is capable of remarkably improving an effect given to a player. The gaming machine according to the present invention is provided with: a cabinet having a display portion for making a display according to the contents of a game played; a plurality of speakers 112A to 112D which are provided at their appropriate positions which are different from each other in height; and a control means for positionally changing a sound image of a sound that is outputted from a respective one of the speakers 112A to 112D, whereby a plurality of speakers 112A to 112D are provided at a top and a bottom of the gaming machine. A variety of effects exerted by means of sound can be provided in such a manner as if a position of a sound source were changed by positionally changing the sound image of the sound that is outputted from a respective one of these speakers 112A to 112D.

Abstract: The present invention provides a gaming machine which is capable of remarkably improving an effect given to a player. The gaming machine according to the present invention is provided with: a cabinet having a display portion for making a display according to the contents of a game played; a plurality of speakers 112A to 112D which are provided at their appropriate positions which are different from each other in height; and a control means for positionally changing a sound image of a sound that is outputted from a respective one of the speakers 112A to 112D, whereby a plurality of speakers 112A to 112D are provided at a top and a bottom of the gaming machine. A variety of effects exerted by means of sound can be provided in such a manner as if a position of a sound source were changed by positionally changing the sound image of the sound that is outputted from a respective one of these speakers 112A to 112D.

Abstract: The present invention provides a gaming machine which is capable of remarkably improving an effect given to a player. The gaming machine according to the present invention is provided with: a cabinet having a display portion for making a display according to the contents of a game played; a plurality of speakers 112A to 112D which are provided at their appropriate positions which are different from each other in height; and a control means for positionally changing a sound image of a sound that is outputted from a respective one of the speakers 112A to 112D, whereby a plurality of speakers 112A to 112D are provided at a top and a bottom of the gaming machine. A variety of effects exerted by means of sound can be provided in such a manner as if a position of a sound source were changed by positionally changing the sound image of the sound that is outputted from a respective one of these speakers 112A to 112D.

Abstract: A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.

Abstract: The present invention provides a gaming machine which is capable of remarkably improving an effect given to a player. The gaming machine according to the present invention is provided with: a cabinet having a display portion for making a display according to the contents of a game played; a plurality of speakers 112A to 112D which are provided at their appropriate positions which are different from each other in height; and a control means for positionally changing a sound image of a sound that is outputted from a respective one of the speakers 112A to 112D, whereby a plurality of speakers 112A to 112D are provided at a top and a bottom of the gaming machine. A variety of effects exerted by means of sound can be provided in such a manner as if a position of a sound source were changed by positionally changing the sound image of the sound that is outputted from a respective one of these speakers 112A to 112D.

Abstract: A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

Abstract: A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components connected to the lands to mount components. The circuit components are embedded in the resin layer. The plurality of lands have thicknesses that are greater than those of the wiring patterns adjacent to the corresponding lands.

Abstract: A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.

Abstract: A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

Abstract: A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

Abstract: A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the plurality of terminal electrodes are connected to the first principal surface and define a first terminal electrode group, and at least two of the plurality of terminal electrodes are connected to the second principal surface and define a second terminal electrode group. One terminal electrode in the first terminal electrode group is electrically connected to one terminal electrode in the second terminal electrode group via the internal electrodes, and capacitance is provided by a pair of the terminal electrodes in the first terminal electrode group via the dielectric layer, and capacitance is provided by a pair of the terminal electrodes in the second terminal electrode group via the dielectric layer.

Abstract: A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

Abstract: A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the plurality of terminal electrodes are connected to the first principal surface and define a first terminal electrode group, and at least two of the plurality of terminal electrodes are connected to the second principal surface and define a second terminal electrode group. One terminal electrode in the first terminal electrode group is electrically connected to one terminal electrode in the second terminal electrode group via the internal electrodes, and capacitance is provided by a pair of the terminal electrodes in the first terminal electrode group via the dielectric layer, and capacitance is provided by a pair of the terminal electrodes in the second terminal electrode group via the dielectric layer.

Abstract: In a method for manufacturing a component incorporating module, lands for mounting components are independently formed on a transfer plate in an isolated manner, and circuit components are connected to the lands for mounting components. An insulation resin layer is formed so as to cover the circuit components on the transfer plate, and is hardened. The circuit components and the lands for mounting components are embedded in the upper resin layer. Thereafter, the transfer plate is removed from the resin layer, and wiring patterns which are used to connect between lands or connect lands to other portions are formed on a back surface of the resin layer on which the lands for mounting components are exposed.

Abstract: The invention provides a means of deterring chalkbrood which is safer to honeybees and effective for a prolonged period. A chalkbrood determent comprising a carrier having a mixture of an isothiocyanate ester and an organic acid triglyceride and/or a rosin compound fixed to a carrier material with an embedding material is placed in a beehive or therearound.

Abstract: A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.

Abstract: A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.