Abstract: A physical quantity sensor includes first and second fixed electrode sections on a substrate, a first movable electrode section having a movable electrode opposite a fixed electrode of the first fixed electrode section, a second movable electrode section having a movable electrode opposite a fixed electrode of the second fixed electrode section, first and second fixed sections fixed to the substrate, a first support beam having one end coupled to the first fixed section, a first coupling section coupling the other end of the first support beam and the first movable electrode section, a second support beam having one end coupled to the second fixed section, and a second coupling section coupling the other end of the second support beam and the second movable electrode section. The first movable electrode section, the second fixed section, the first fixed section, and the second movable electrode section are disposed side by side.

Abstract: A physical quantity sensor includes: a first fixed electrode portion; a first movable electrode portion; a first fixed portion fixed to a substrate; a first support beam having one end coupled to the first fixed portion; a second support beam having one end coupled to the first fixed portion; and a first coupling portion coupling the other end of the first support beam and the other end of the second support beam to the first movable electrode portion. In a plan view in a third direction orthogonal to the substrate, the first movable electrode portion and the first fixed portion are disposed along a first direction, the first support beam and the second support beam are disposed along a second direction, and the first coupling portion includes a first portion disposed along the second direction side by side with the first support beam and the second support beam, and a second portion coupled to the first portion and the first movable electrode portion and disposed along the first direction.

Abstract: An inertial sensor, includes: a substrate; a fixing portion that is provided on the substrate; a first movable body that faces the substrate and that is displaceable with a first support beam as a first rotation axis; the first support beam that is arranged in a first direction and that couples the first movable body and the fixing portion; a second movable body that is displaceable due to deformation of a second support beam; the second support beam that is arranged in a second direction intersecting the first direction and that couples the first movable body and the second movable body; and a protrusion that is provided on the substrate or the second movable body, overlaps the second movable body in plan view from a third direction and that protrudes toward the second movable body or the substrate.

Abstract: An inertial sensor includes: a substrate; a fixing part arranged at one surface of the substrate; a moving element having an opening and configured to swing about a rotation axis along a first direction; a support beam supporting the moving element as the rotation axis in the opening of the moving element; and a support part supporting the support beam. The support part includes a first part fixed to the fixing part, and a second part formed only of a part not fixed to the fixing part. A length in the first direction of the second part is longer than a length in the first direction of the first part.

Abstract: A substrate processing method of drying a substrate by using a processing fluid in a supercritical state is performed by a substrate processing apparatus. The substrate processing apparatus includes a fluid discharge unit, a supply line, a fluid drain unit, a drain line and a flow control device. The substrate processing method includes: flowing the processing fluid from the fluid discharge unit to the fluid drain unit such that the processing fluid flows along a surface of the substrate. The flowing of the processing fluid includes flowing the processing fluid in a first flow mode and flowing the processing fluid in a second flow mode. Between the first flow mode and the second flow mode, a flow direction distribution of the processing fluid is different, and a switchover between the first flow mode and the second flow mode is performed by the flow control device.

Abstract: An attached body production method having a sealing material disposing step for disposing a sealing material on a mold and/or a molded product so that a molded surface of the molded product is surrounded by the sealing material when the mold and the molded product are attached together; a pressure reduction step for reducing the pressure of the atmosphere around the mold and the molded product in a state where the mold and the molded product are separated from each other; a sealing step for putting the mold and the molded product on top of each other, and sealing a space between the mold 1 and the molded product with the sealing material; and a first pressure-application step for applying pressure with a fluid in a state where the space between the mold and the molded product is sealed, wherein the sealing material has fluidity in at least the sealing step, and is configured to attach to only one of the mold and the molded product when the molded product is released from the mold.

Abstract: A semiconductor light emitting device includes a light extraction layer having a light extraction surface. The light extraction layer includes: a plurality of cone-shaped parts formed in an array on the light extraction surface, and a plurality of granular parts formed both on a side part of the cone-shaped part and in a space between adjacent cone-shaped parts. A method of manufacturing the semiconductor light emitting device includes: forming a mask having an array pattern on the light extraction layer; and etching the mask and the light extraction layer from above the mask. The etching includes first dry-etching performed until an entirety of the mask is removed and second dry-etching performed to further dry-etch the light extraction layer after the mask is removed.

Abstract: The present disclosure provides an imprinting device and an imprinting method. The present disclosure also provides a stamp comprising a resin-made molding component.

Abstract: A physical quantity sensor includes a substrate, a movable body that is provided displaceably in a state of being opposed to the substrate and is provided with a first through-hole and a second through-hole as through-holes, and a protrusion configured integrally with the substrate at a side of the movable body of the substrate, and in which the protrusion is provided at a position where the protrusion overlaps the through-hole and the movable body in plan view.

Abstract: An inertial sensor includes a substrate, a movable element that swings around a swing axis; and a protrusion that overlaps with the movable element in the plan view and protrudes from the substrate toward the movable element. The protrusion includes a first protrusion and a second protrusion so located as to be farther from the swing axis than the first protrusion, and when the movable element swings relative to the substrate around the swing axis, the first protrusion and the second protrusion come into contact with the movable element at the same time or the first protrusion comes into contact with the movable element and then the second protrusion comes into contact with the movable element.

Abstract: An inertial sensor includes a movable element including a first movable section and a second movable section, a first detection electrode, and a first dummy electrode. The first movable section has a first section, a second section that is farther from the swing axis than the first section, and a third section disposed between the first section and second section. The first section of the first movable section has a first opening and the third section of the first movable section has a second opening. An opening ratio of the first opening to the first section of the first movable section is smaller than an opening ratio of the second opening to the third section of the first movable section.

Abstract: A method for cleaning a substrate includes supplying, to a substrate which does not have a resist formed thereon, a film-forming processing liquid which includes a volatile component and forms a processing film, volatilizing the volatile component of the film-forming processing liquid such that the film-forming processing liquid on the substrate is solidified or cured and that the processing film is formed on the substrate, heating a peeling processing liquid which peels off the processing film from the substrate without dissolving the processing film such that a heated peeling processing liquid is prepared, and supplying, to the processing film formed on the substrate, the heated peeling processing liquid such that the heated peeling processing liquid peels off the processing film from the substrate without dissolving the processing film.

Abstract: A semiconductor light emitting device includes a light extraction layer having a light extraction surface. Multiple cone-shaped parts formed in an array are provided on the light extraction surface of the semiconductor light emitting device. A proportion of an area occupied by the multiple cone-shaped parts per a unit area of the light extraction surface is not less than 65% and not more than 95% in a plan view of the light extraction surface, and an aspect ratio h/p defined as a proportion of a height h of the cone-shaped part relative to a distance p between apexes of adjacent cone-shaped parts is not less than 0.3 and not more than 1.0.

Abstract: An inertial sensor includes a movable element including a first movable section and a second movable section, a first detection electrode, and a first dummy electrode. The first movable section has a first section, a second section that is farther from the swing axis than the first section, and a third section disposed between the first section and second section. A separation distance between the third section and the first dummy electrode is greater than a separation distance between the first section and the first detection electrode.

Abstract: A coil device comprising a coil, and a ferrite core arranged in a hollow portion of the coil, and a resin covering them; the ferrite core being a Ni ferrite core having initial permeability ?i of 450 or more at a frequency of 100 kHz and a temperature of 20° C., and an average crystal grain size of 5-9 ?m, both of temperature-dependent inductance change ratios TLa and TLb and stress-dependent inductance change ratios PLa and PLb being ?0.6% to +0.6%, and both of the sum of TLa and PLa and the sum of TLb and PLb being more than ?1.0% and less than +1.0%; and an antenna comprising it.

Abstract: A method for cleaning a substrate includes supplying to a substrate on which a resist layer is not formed a film-forming processing liquid which includes a volatile component and forms a film on the substrate, forming a processing film on the substrate by solidifying or curing the film-forming processing liquid supplied on the substrate, and supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate.

Abstract: A physical quantity sensor includes a substrate, and a moving member facing the substrate in a third direction via a gap and becoming displaced in the third direction in relation to the substrate. The moving member has a first part and a second part, and a plurality of penetration holes arranged at the first part and the second part and penetrating the moving member in the third direction. In at least one of a first area overlapping the first part and a second area overlapping the second part, as viewed in a plan view from the third direction, C?1.5×Cmin is satisfied, where C is a damping and Cmin is a minimum value of the damping.

Abstract: A superordinate controlling device for a heat source system (1) including a plurality of heat sources, the superordinate controlling device being applied to the heat source system (1) and controlling heat-pump type chillers (2a) and (2b) and absorption-type chillers (2c) and (2d) in such a manner that a heat transfer medium leaving temperature that is the temperature of a heat transfer medium supplied to an external load (6) is equal to a setting temperature. The heat-pump type chillers (2a) and (2b) each have a higher Coefficient of Performance (COP) than that of each of the absorption-type chillers (2c) and (2d).

Abstract: A physical quantity sensor includes a substrate and a movable body. A first region to an n-th region in which a step is provided between adjacent regions are provided on a first surface of a first mass portion of the movable body. Ends of the first region to the n-th region on a side far from the rotation axis are referred to as a first end to an n-th end.

Abstract: A display device control apparatus is provided to control a display device provided on an instrument panel of a vehicle. The display device control apparatus acquires a state of the vehicle, and sets an inclination of a display screen unit included in the display device according to the state of the vehicle.