Satoru Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A probe is formed of an Au--Cu alloy essentially consisting of 74 to 76 parts by weight of gold and 24 to 26 parts by weight of copper, by a process comprising the steps of heating the alloy to at least 350.degree. C. and gradually cooling the heated alloy to the room temperature in at least 5 hours.
August 19, 1993
Date of Patent:
January 3, 1995
Tokyo Electron Limited, Tokyo Electron Yamanashi Limited
Abstract: A probe apparatus comprises a vertically movable table for placing a semiconductor wafer having semiconductor devices, a heater for heating the wafer at a predetermined temperature, and a probe card located above the wafer and having support and positioning portions for probes. The probe has a vertical portion which extends downward substantially vertically, and is capable of buckling. Two positioning plates are supported by the support positioning portion through which the vertical portions of said probes are downwardly extended wherein a temperature controller heats the probes at the positioning plates at a predetermined temperature.
Abstract: A probe to be electrically connected to an internal circuit of a semiconductor element, comprising a contact portion to be brought into pressure contact with an electrode formed on the semiconductor element, wherein the contact portion is made of an alloy consisting of Au, Cu, and an inevitable impurity. The contact resistance between the probe and electrode is low, and is maintained low in a stable manner even if the probe is repeatedly used.