Abstract: To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

Abstract: A semiconductor stack device having semiconductor chips stacked therein, wherein pads 4d of an uppermost semiconductor chip 2d are disposed on the side of a base substrate 1, and the pads 4d of the semiconductor chip 2d and electrodes 8d of the base substrate 1 are connected to each other via a flexible substrate 5 having circuit components 7 mounted thereon.

Abstract: To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 ?m and not more than 100 ?m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 ?m and not more than 200 ?m.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 &mgr;m and not more than 100 &mgr;m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 &mgr;m and not more than 200 &mgr;m.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 &mgr;m and not more than 100 &mgr;m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 &mgr;m and not more than 200 &mgr;m.

Abstract: A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing thereof.

Abstract: A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing thereof.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 &mgr;m and not more than 100 &mgr;m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 &mgr;m and not more than 200 &mgr;m.

Abstract: The present invention provides a metal wiring board in which metal wiring buried in a surface layer of an electrically insulating substrate is adhered to a carrier sheet covering the metal wiring that can be mechanically detached and that can prevent oxidation of the metal wiring. A semiconductor device that uses this substrate is structured so that a metal terminal electrode buried in an electrically insulating substrate is electrically connected to a protruding electrode on a semiconductor element, the protruding electrode has a structure wherein its tip is flattened by mounting the semiconductor element to the substrate, and the portion where the substrate and the semiconductor element are connected is reinforced by an insulating resin structure and formed into a single unit therewith.

Abstract: A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing thereof.

Abstract: A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing thereof.

Abstract: Disclosed is a method for mounting a semiconductor element, the method requiring no strict flatness for a substrate and being reliable in a semiconductor device produced by mounting a semiconductor element on a circuit substrate. In the multilayer circuit substrate comprising bump electrodes formed of a conductive paste, a conductive adhesive is applied to the top of bump electrodes and then leveled to obtain the end portions on the bump electrodes with a high coplanarity in height. The semiconductor element is mounted on this substrate using a combination of a conductive resin and a sealing resin or an anisotropic conductive sheet. Every top of the bump electrodes after the conductive adhesive is applied has a high coplanarity. The semiconductor element can be mounted with high reliability, on the substrate having such a poor flatness of the electrode face that mounting by a conventional method can not be applied.

Abstract: A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.

Abstract: A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired.

Abstract: The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.

Abstract: The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.

Abstract: A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.