Patents by Inventor Satoshi Higuma

Satoshi Higuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8883564
    Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: November 11, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
  • Patent number: 8546842
    Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: October 1, 2013
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Satoshi Higuma, Hideki Hirotsuru, Shinya Narita
  • Publication number: 20120112236
    Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.
    Type: Application
    Filed: July 16, 2010
    Publication date: May 10, 2012
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Satoshi Higuma, Hideki Hirotsuru, Shinya Narita
  • Publication number: 20110316038
    Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.
    Type: Application
    Filed: February 8, 2010
    Publication date: December 29, 2011
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
  • Patent number: 7993728
    Abstract: A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 ?m in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies, wherein the aluminum layers each has an average thickness of from 10 to 150 ?m, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 ?m, and the difference between average thicknesses of the aluminum layers on the respective pr
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: August 9, 2011
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Goh Iwamoto, Hideo Tsukamoto, Satoshi Higuma, Nobuyuki Hashimoto
  • Publication number: 20090092793
    Abstract: A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 ?m in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies, wherein the aluminum layers each has an average thickness of from 10 to 150 ?m, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 ?m, and the difference between average thicknesses of the aluminum layers on the respective pr
    Type: Application
    Filed: April 23, 2007
    Publication date: April 9, 2009
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Goh Iwamoto, Hideo Tsukamoto, Satoshi Higuma, Nobuyuki Hashimoto