Abstract: A signal processing circuit includes a reference signal line, a processing circuit that processes a potential of the reference signal line and a potential of an input signal, a first reference voltage supplying circuit that outputs a predetermined potential to one end of the reference signal line, and a second reference voltage supplying circuit that outputs a predetermined potential to the other end of the reference signal line.

Abstract: An on-board device includes a processor. The processor is configured to operate as an acquisition unit configured to acquire data from a sensor mounted on a vehicle, a human-machine-interface (HMI) unit configured to perform a process for exerting a human-machine-interface (HMI) function, and a data management unit configured to make determination on a category of the data delivered from the acquisition unit and deliver, to the HMI unit, data in a first category that does not contain data that is not desired to be delivered to the HMI unit. The HMI unit is configured to perform the process for exerting the HMI function based on the data delivered from the data management unit.

Abstract: This high-strength cold-rolled steel sheet has a predetermined chemical composition, wherein a microstructure at a ¼ position of a sheet thickness from a surface includes predetermined ranges of volume percentages of tempered martensite, residual austenite, ferrite and bainite, and martensite, wherein a microstructure at a position 25 ?m from the surface includes, predetermined ranges of volume percentage of ferrite and bainite, and martensite and tempered martensite, wherein in the position 25 ?m from the surface, an average grain size of the martensite and the tempered martensite is 5.0 ?m or less, a tensile strength is 1,310 MPa or more, and a uniform elongation is 5.0% or more, and R/t is 5.0 or less, the R/t being a ratio of a limit bend radius R in 90° V-bending to a sheet thickness t.

Abstract: A semiconductor device includes a support, a semiconductor chip, a first insulating film, and a wiring layer. The support comprises a first electrode. The semiconductor chip has a first surface facing the support and a second surface facing away from the support with a second electrode thereon. The first insulating film has a first portion in contact with the first surface and a second portion in contact with at least one side surface of the semiconductor chip. The wiring layer connects the first electrode to the second electrode. The wiring layer is on the support, the second surface of the semiconductor chip, a side surface of the second portion of the first insulating film.

Abstract: A powder/granular material spreader that allows easy cleaning of a passage for powder/granular material includes a housing that houses motors, a passage that extends through the housing and provides a passage for the powder/granular material, a roller provided in the passage to feed the powder/granular material and that is driven by one of the motors, and a spinner driven by the motor to spread the powder/granular material. The passage includes an integral first wall that shields the motor from the passage, an integral second wall that shields the motor from the passage, and an opening located at an inlet of the passage. The opening is integral with the first wall and the second wall. The housing includes an integral cover that covers tops and sides of the motors, and fits over an outer surface of the opening. A seal is provided at a location where the opening and the cover are connected with each other.

Abstract: According to one embodiment, a semiconductor device includes a plurality of stacked semiconductor chips each of which has a first surface having an electrode formed thereon, a plurality of wires each of which has one end portion connected to each of the electrodes of the plurality of semiconductor chips and extends in a stacking direction of the semiconductor chips, a sealing resin that covers the plurality of semiconductor chips, has a second surface having recesses formed therein, and is formed so that the other end portions of the plurality of wires and the recesses overlap each other when viewed from the stacking direction, and a plurality of terminals that is provided so as to fill the recesses, each of which has one end portion connected to the other end portion of each of the plurality of wires and has the other end portion exposed from the sealing resin.

Abstract: A resin film-laminated metal sheet includes a metal sheet and thermoplastic resin films that are fused to both surfaces of the metal sheet, the metal sheet is a steel sheet having a thickness of 0.08 mm or more or an aluminum sheet having a thickness of 0.15 mm or more, and, when a surface of the thermoplastic resin film opposite to a surface that is fused to the metal sheet is defined as a first surface, the surface tension on the first surface in at least one of the thermoplastic resin films is 50 mN/m or less, the surface tension on the surface that is fused to the metal sheet is 36 mN/m or more, and the amount of a wax attached to the first surface is more than 0 mg/m2 and 5.00 mg/m2 or less.

Abstract: A bending device to bend leads of a component one by one in the same direction at different timings. The bending device including a support block below the component that is movable in a vertical direction; a pair of support members fixed to the support block, the pair of support members contacting and supporting the leads of the component from below; a pair of clamp arms swingably held to the support block, the pair of clamp arms contacting and clamping the leads of the component from above; and a pair of bending rollers arranged above the leads of the component that bend the leads at the different timings.

Abstract: A fuel cell system includes a reformer, a fuel cell, a desulfurizer, a recirculation passage through which the reformer communicates with the desulfurizer such that a part of the anode gas generated in the reformer flows into the desulfurizer, and an orifice member provided on the recirculation passage. The orifice member or at least a part of an inner wall of a portion that constitutes an upstream side from the orifice member in the recirculation passage is made of a material containing a material having an antifungal action.

Abstract: A driving assistance device that detects an object in a traveling direction of a vehicle and to assist avoiding a collision of the vehicle with the object, including: a decision unit that decides whether there is a possibility of the own vehicle colliding with the detected object; a creation unit that creates an action plan for the own vehicle to avoid colliding with the detected object; a transmission unit that transmits the action plan to another vehicle; a receiving unit that receives, from the other vehicle that received the action plan, a response including information on whether it is possible for the other vehicle to take an action to avoid colliding with the own vehicle; a determination unit that determines an action based on the action plan and the response from the other vehicle; and an execution unit that executes the action determined by the determination unit.

Abstract: A can lid made of a resin laminate steel sheet for a resin-metal composite container, includes: a top sheet portion; and a curved portion located at an outer periphery of the top sheet portion, in which the resin laminate steel sheet includes a steel sheet, a thermoplastic polyester-based resin layer provided at a first surface of the steel sheet, a modified polypropylene-based resin layer provided at a second surface of the steel sheet, a polypropylene-based resin layer, and an ethylene-propylene copolymer resin layer, a melting point of the ethylene-propylene copolymer resin layer is 135° C. or higher and 150° C. or lower, a melting point of the thermoplastic polyester-based resin layer is higher than a melting point of the polypropylene-based resin layer by 40° C. or more, and a range of a proportion of the ethylene component in the ethylene-propylene copolymer in the ethylene-propylene copolymer resin layer is 1.0 mass % or more and 45.0 mass % or less.

Abstract: A film-laminated metal plate having excellent retort adhesiveness includes: a metal plate; a resin film thermally fusion-bonded to a surface of the metal plate; and a bubble contained between the metal plate and the resin film. An average bubble height of three bubbles with higher heights among the bubbles measured by using a 3D analysis image of a laser microscope is 0 ?m or more and 5.0 ?m or less. The test piece is obtained by cutting a portion of one end side of the metal plate in a longitudinal direction while leaving the resin film on a side which becomes an inner surface side of the container when the film-laminated metal plate is processed into a container. When a retort treatment is carried out on the test piece at a temperature of 125° C.

Abstract: A photoelectric conversion device comprising: a first signal transfer unit group having a plurality of signal transfer units which transfer digital signals to a first common output line from a first holding circuit group; and a second signal transfer unit group having a plurality of signal transfer units which transfer digital signals to a second common output line from a second holding circuit group, wherein each of the plurality of signal transfer units is capable of transiting to a second state in which current consumption is less than current consumption in a first state, and, in a predetermined period, a number of the signal transfer units in the second state increases in the first signal transfer unit group and a number of the signal transfer units in the second state decreases in the second signal transfer unit group.

Abstract: Metal-organic framework molecules with pyrene group-containing or biphenyl group-containing linkers for use in the removal of uremic toxins from biological samples that contain such toxins are provided. Also provided are methods for using the MOFs to remove uremic toxins from biological samples. The methods include hemodialysis of blood samples from patients suffering from a uremia-related disease, such as chronic kidney failure.

Abstract: A signal processing circuit includes a reference signal line, a processing circuit that processes a potential of the reference signal line and a potential of an input signal, a first reference voltage supplying circuit that outputs a predetermined potential to one end of the reference signal line, and a second reference voltage supplying circuit that outputs a predetermined potential to the other end of the reference signal line.

Abstract: An imaging device includes: a first pad portion that is connected to a voltage supply line in an aperture pixel region, and to which a reference voltage from outside of the semiconductor substrate is supplied; and a second pad portion that is connected to the voltage supply line in the light-shielded pixel region, and to which the reference voltage from outside of the semiconductor substrate is supplied, the second pad portion being separated from the first pad portion.

Abstract: A photoelectric conversion apparatus, comprising: a pixel array; a first and a second signal line groups; a first and a second readout circuit groups; a first multiplexer group that selects one of at least two first signal lines, and connects the selected first signal line to one first readout circuit; and a second multiplexer group that selects one of at least two second signal lines, and connects the selected second signal line to one second readout circuit, a number of the first readout circuits is more than a number of the first signal lines, a number of the second readout circuits is more than a number of the second signal lines, the selection operations by the first and second multiplexer groups are executable independently from each other, the selection operation of the first multiplexer group is controlled collectively, and the selection operation of the second multiplexer group is controlled collectively.

Abstract: A photoelectric conversion device comprising: a first signal transfer unit group having a plurality of signal transfer units which transfer digital signals to a first common output line from a first holding circuit group; and a second signal transfer unit group having a plurality of signal transfer units which transfer digital signals to a second common output line from a second holding circuit group, wherein each of the plurality of signal transfer units is capable of transiting to a second state in which current consumption is less than current consumption in a first state, and, in a predetermined period, a number of the signal transfer units in the second state increases in the first signal transfer unit group and a number of the signal transfer units in the second state decreases in the second signal transfer unit group.

Abstract: A semiconductor device includes a support, a semiconductor chip, a first insulating film, and a wiring layer. The support comprises a first electrode. The semiconductor chip has a first surface facing the support and a second surface facing away from the support with a second electrode thereon. The first insulating film has a first portion in contact with the first surface and a second portion in contact with at least one side surface of the semiconductor chip. The wiring layer connects the first electrode to the second electrode. The wiring layer is on the support, the second surface of the semiconductor chip, a side surface of the second portion of the first insulating film.

Abstract: A transmitter includes a processor configured to: acquire positional information indicating a position of the transmitter; and transmit, to a receiver, first transmission target data out of transmission target data retained by the transmitter and including a data body and effective range information indicating an effective range of the data body, the first transmission target data including the effective range information indicating a first effective range that covers the position of the transmitter that is indicated by the positional information.