Abstract: An optical modulation element that can be housed in the same housing together with an electronic circuit is implemented without deteriorating the high-frequency characteristics and the optical modulation characteristics and without increasing a size of the housing.

Abstract: An optical waveguide element includes a substrate, an optical waveguide disposed inside the substrate or on the substrate, and an electrode provided along the optical waveguide, working on the optical waveguide to generate a phase change in a light wave propagating through the optical waveguide. The electrode is a traveling-wave electrode. In a modulation section where the light wave is controlled by the electrode, the electrode and the optical waveguide are configured so that the phase change generated in a first modulation section located within a predetermined distance range from a downstream side end portion along a propagation direction of a traveling wave of an electrical signal propagating through the electrode has a sign opposite to a sign of the phase change generated in a second modulation section located within a predetermined distance range from an input end of the electrical signal on an upstream side along the propagation direction.

Abstract: A liquid ejection head including a recording element substrate for ejecting liquid supported by a support member with an adhesive layer provided between the recording element substrate and the support member. A terminal is provided at an end portion of the recording element substrate with a sealing member covering the end portion of the recording element substrate including the terminal. The sealing member is in contact with a side surface of the end portion and an end surface of the adhesive layer. The adhesive layer comprises includes a first adhesive portion and a second adhesive portion positioned between the first adhesive portion and the sealing member. Rigidity of the second adhesive portion is less than the rigidity of the sealing member and less than the rigidity of the first adhesive portion.

Abstract: Misalignment of printing positions between print heads associated with thermal expansion is reduced without increasing a data processing load. To this end, printing element substrates in a reference head and an adjustment target head are adjusted to a target temperature, and a liquid is circulated through the print element substrates. After thermal expansion of the reference head and the adjustment target head reaches a steady state, a first printing region being a printing region of the reference head and a second printing region being a printing region of the adjustment target head in a longitudinal direction are obtained from an image printed by using all printing elements. Then, used regions to be used for actual printing are set among the printing elements arranged on the reference head and the adjustment target head based on the first printing region and the second printing region.

Abstract: An optical modulation element that can be housed in the same housing together with an electronic circuit is implemented without deteriorating the high-frequency characteristics and the optical modulation characteristics and without increasing a size of the housing.

Abstract: A liquid ejection head including a recording element substrate for ejecting liquid supported by a support member with an adhesive layer provided between the recording element substrate and the support member. A terminal is provided at an end portion of the recording element substrate with a sealing member covering the end portion of the recording element substrate including the terminal. The sealing member is in contact with a side surface of the end portion and an end surface of the adhesive layer. The adhesive layer comprises includes a first adhesive portion and a second adhesive portion positioned between the first adhesive portion and the sealing member. Rigidity of the second adhesive portion is less than the rigidity of the sealing member and less than the rigidity of the first adhesive portion.

Abstract: Provided is an optical waveguide element capable of connection such as wire bonding, suppressing usage of gold, and suppressing deterioration of a conductor loss. An optical waveguide element includes a substrate 1 having an electro-optic effect, an optical waveguide 2 formed on the substrate, and a control electrode (30, 31) provided on the substrate and controlling a light wave propagating through the optical waveguide. The control electrode is made of a material other than gold, and the gold is disposed on at least a wire bonding portion 4 of the control electrode.

Abstract: Misalignment of printing positions between print heads associated with thermal expansion is reduced without increasing a data processing load. To this end, printing element substrates in a reference head and an adjustment target head are adjusted to a target temperature, and a liquid is circulated through the print element substrates. After thermal expansion of the reference head and the adjustment target head reaches a steady state, a first printing region being a printing region of the reference head and a second printing region being a printing region of the adjustment target head in a longitudinal direction are obtained from an image printed by using all printing elements. Then, used regions to be used for actual printing are set among the printing elements arranged on the reference head and the adjustment target head based on the first printing region and the second printing region.

Abstract: A substrate heating apparatus includes: a substrate support configured to substantially horizontally support a substrate; a heater provided below the substrate support substantially parallel to the substrate, and having a predetermined planar shape; and a side portion extending downward from an outer peripheral portion of the heater.

Abstract: A resin molding method includes a first molding step, a sliding step, a second molding step and a mold opening step. In the first molding step, first molded part supported in a fixed mold and a second molded part supported in a die slide mold are molded in different positions in a second direction. In the sliding step, the movable mold is removed in a first direction and the first molded part and the second molded part are aligned by the die slide mold is moved in the second direction. In the second molding step, the movable mold is clamped again with the fixed mold and resin is injected into engaged portions. Each of the first molded part and the second molded part includes at least one wall extending in the first direction, and in the second molding step, the first molded part and the second molded part are engaged with each other at sides of the walls extending in the first direction.

Abstract: Provided is an optical waveguide element capable of connection such as wire bonding, suppressing usage of gold, and suppressing deterioration of a conductor loss. An optical waveguide element includes a substrate 1 having an electro-optic effect, an optical waveguide 2 formed on the substrate, and a control electrode (30, 31) provided on the substrate and controlling a light wave propagating through the optical waveguide. The control electrode is made of a material other than gold, and the gold is disposed on at least a wire bonding portion 4 of the control electrode.

Abstract: There is provided a liquid supply member capable of suppressing deformation of a liquid supply path and decrease in sealing property of a liquid supply path, during molding, and a manufacturing method of the liquid supply member. For that purpose, in die-slide injection molding that combines two components, a protection portion that protects a part of one component easily affected by heat and pressure, is provided on the other component.

Abstract: There is provided a manufacturing method of a liquid supply member capable of suppressing decrease in sealing property of a liquid supply path and deformation of the liquid supply path or the external shape. For that purpose, a manufacturing process of a liquid supply member prevents inflow of a molten resin into a concave portion of a portion other than a liquid supply flow path in a liquid supply member.

Abstract: A molded part including a first member having a plurality of openings and a second member contacting with a peripheral edge of each of the plurality of openings so as to cover the openings, and having a hollow portion formed by sealing the contact portion with a sealing material, wherein: the second member defines a flow channel for filling the sealing material between the first member and the second member; the second member has a branched shape in which sections corresponding to positions covering the plurality of openings are branched from each other, and portions near a gate of the flow channel are connected as a common section; and the branched shape has a bridge structure for connecting the respective branched sections.

Abstract: A liquid ejection head is capable of performing high-speed ejection operation as well as reducing a depth dimension. For this purpose, in a configuration in which flexible circuits electrically connect element substrates to electrical substrates, the electrical substrates are arrayed in two lines along a plane different from a plane on which the element substrates are arrayed and the flexible circuits electrically connect the element substrates to the electrical substrates while being bent.

Abstract: A liquid ejection head includes a recording element substrate which ejects a liquid downward; an electric substrate which is disposed above the recording element substrate, which has a plurality of electric components, including a capacitor, and which is electrically connected to the recording element substrate; a wall which covers the electric substrate such that a liquid can be retained between the wall and the electric substrate; and a sensor which is disposed in an area covered by the wall and which detects for the presence of a liquid. In the attitude of the liquid ejection head as attached to the main unit of a liquid ejection apparatus, the sensor is disposed below the capacitor in a vertical direction.

Abstract: There is provided a manufacturing method for molding a liquid supply member by using a first mold and a second mold. The method includes a first molding step of performing injection molding to form a first component part of the liquid supply member and a plurality of component parts of the liquid supply member other than the first component part at different positions from each other, with the first and the second mold closed relative to each other, a contacting step of moving each of the formed plurality of component parts relatively to the first component part to bring the formed first component part into contact with the formed plurality of component parts, with the first and the second mold opened relative to each other, and a second molding step of performing injection molding to join the first component part and the plurality of component parts.

Abstract: A filter is compressed between facing surfaces of a first configuration component and a second configuration component, and a molten resin is poured in such a compressed state. Injection molding of the first configuration component and the second configuration component, joining of the configuration components, and sealing of the circumference of the filter are performed by a pair of metal molds.

Abstract: An inkjet print head includes an ejection module having a printing element substrate that ejects ink to a print medium and a flexible wiring substrate electrically connected to the printing element substrate; and a member for supporting the ejection module by joining, wherein the flexible wiring substrate has a capacitor, a periphery of the capacitor being covered with a sealing agent, and the capacitor is provided in a recess formed on the member.

Abstract: A resin molding method includes a first molding step of molding a first molded part and a second molded part in a mold and a second molding step of joining the first molded part and the second molded part. In the first molding step, the second molded part is formed by injecting resin into an area where a first core movable in the first direction and a second core movable in a second direction are engaged. In the second molding step, the second molded part is joined to the first molded part by injecting the resin while the first core is in contact with the second molded part and the second core is removed from the second molded part. Areas where the first core and the second core are located in the first molding step become hollow areas connected to each other and part of ends of the first core in the first direction is not in contact with the second core.