Patents by Inventor Satoshi Ootani

Satoshi Ootani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing joined structure
    Patent number: 11446752
    Abstract: A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: September 20, 2022
    Assignee: KOKI Company Limited
    Inventors: Satoshi Ootani, Mitsuyasu Furusawa
  • Solder paste using a solder paste flux and solder powder
    Patent number: 11425825
    Abstract: Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: August 23, 2022
    Assignee: KOKI Company Limited
    Inventors: Yuki Yamamoto, Satoshi Ootani, Mitsuyasu Furusawa
  • METHOD FOR PRODUCING JOINED STRUCTURE
    Publication number: 20210260679
    Abstract: A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.
    Type: Application
    Filed: October 1, 2019
    Publication date: August 26, 2021
    Inventors: Satoshi OOTANI, Mitsuyasu FURUSAWA
  • FLUX FOR SOLDER PASTE AND SOLDER PASTE
    Publication number: 20190182966
    Abstract: Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.
    Type: Application
    Filed: August 2, 2017
    Publication date: June 13, 2019
    Inventors: Yuki YAMAMOTO, Satoshi OOTANI, Mitsuyasu FURUSAWA
  • Color marking apparatus for a recording apparatus
    Patent number: 5206687
    Abstract: A color marking apparatus for marking designated areas of an original with a designated color by recording the whole area of an original with a first color, such as black. Desired areas on the original are designated, and the designated areas are colored with a second color different from the first color, and the second color is recorded with a copy density different from the copy density used to record the first color. The color marking apparatus is controlled such that the recording operations of the apparatus are carried out in a selected order.
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: April 27, 1993
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Takanobu Suzuki, Michihiro Kawamura, Akio Arai, Kiyoshi Matsuzawa, Takeshi Huruya, Satoshi Ootani, Mamoru Kobayashi