Patents by Inventor Satoshi Sasaki

Satoshi Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170077578
    Abstract: A transmission line includes a dielectric base body including a first and second base bodies. Each of the first and second base bodies includes dielectric layers stacked on top of one another. The first base body includes a first signal conductor located between ground conductors in a stacking direction. The second base body includes a second signal conductor located between ground conductors in the stacking direction. The first and second base bodies are brought together so that one of the ground conductors of the first base body and one of the ground conductors of the second base body abut against or are adjacent to each other. Lead conductors defining both ends of the first signal conductor and lead conductors defining both ends of the second signal conductor are exposed on a mounting surface of the dielectric base body parallel or substantially parallel to the stacking direction.
    Type: Application
    Filed: November 28, 2016
    Publication date: March 16, 2017
    Inventors: Takahiro BABA, Satoshi SASAKI, Kuniaki YOSUI
  • Publication number: 20170077579
    Abstract: In a transmission line, first and second signal conductors are located inside a dielectric base body. The first and second signal conductors are located between first and second ground conductors in a thickness direction of the dielectric base body. A main conductor portion of the second ground conductor is located between the first and second signal conductors in a width direction of the dielectric base body. First and second auxiliary conductor portions of the second ground conductor respectively extend from the main conductor portion to first-signal-conductor-side and second-signal-conductor-side lateral surfaces of the dielectric base body. A first lateral-surface conductor connects the first auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor. A second lateral-surface conductor connects the second auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor.
    Type: Application
    Filed: November 28, 2016
    Publication date: March 16, 2017
    Inventors: Takahiro BABA, Satoshi SASAKI, Kuniaki YOSUI
  • Publication number: 20170059029
    Abstract: A reduction gear of the present invention is compact and light and can be used for tire portions of an apparatus for travelling, etc. Each of outer and inner pins is formed by a rolling bearing. The reduction gear includes block-shaped lubricating members which supply a lubricant to the outer rings of the outer pins to thereby lubricate them, and a ring-shaped lubricating member which supplies the lubricant to the outer rings of the inner pins to thereby lubricate them. The lubricant can be supplied to a pair of cycloid gears through the outer pins and the inner pins for lubrication. Since the cycloid gears, the outer pins, and the inner pins are lubricated by the lubricating members, the reduction gear can enhance its durability, reduce the friction between components to thereby lower the frictional resistance, and realize a light and compact structure.
    Type: Application
    Filed: August 19, 2016
    Publication date: March 2, 2017
    Inventor: Satoshi SASAKI
  • Patent number: 9583836
    Abstract: An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: February 28, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Satoshi Sasaki
  • Publication number: 20170025730
    Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
    Type: Application
    Filed: October 5, 2016
    Publication date: January 26, 2017
    Inventors: Satoshi SASAKI, Nobuo IKEMOTO, Shigeru TAGO
  • Patent number: 9490513
    Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: November 8, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi Sasaki, Nobuo Ikemoto, Shigeru Tago
  • Patent number: 9484612
    Abstract: A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: November 1, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi Sasaki, Yuki Wakabayashi
  • Patent number: 9471530
    Abstract: To provide a semiconductor device and a mobile terminal device capable of operating with stability. A semiconductor device includes an HSIC physical layer circuit fixedly connected to another semiconductor device through a bus line, a USB link control unit that operates with either a USB host function or a USB device function, and link-connects to the another semiconductor device, a nonvolatile storage unit that stores selection data, the selection data being used to select the USB function with which the USB link control unit operates, and a semiconductor substrate on which the HSCI physical control unit, the USB link control unit, and the nonvolatile storage unit are formed.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: October 18, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Satoshi Sasaki
  • Publication number: 20160268666
    Abstract: A high-frequency signal line includes a dielectric base with a first line portion and a second line portion each extending along a predetermined straight line parallel or substantially parallel to a predetermined direction, and a third line portion mutually connecting first side ends of the first line portion and the second line portion in the predetermined direction, a signal line, a first ground conductor located on the first side in the layer stacking direction of the signal line, a second ground conductor located on a second side in the layer stacking direction of the signal line, and one or more interlayer connection conductors connecting the first ground conductor and the second ground conductor. In the third line portion, the interlayer connection conductor is provided on the second side in the predetermined direction of the signal line when viewed from the layer stacking direction.
    Type: Application
    Filed: May 20, 2016
    Publication date: September 15, 2016
    Inventors: Yuki WAKABAYASHI, Bunta OKAMOTO, Satoshi SASAKI
  • Publication number: 20160261017
    Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Noboru KATO, Shigeru TAGO, Jun SASAKI, Junichi KURITA, Satoshi SASAKI
  • Patent number: 9414482
    Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: August 9, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Shigeru Tago, Jun Sasaki, Junichi Kurita, Satoshi Sasaki
  • Patent number: 9401532
    Abstract: A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: July 26, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shigeru Tago, Satoshi Sasaki, Noboru Kato
  • Publication number: 20160152488
    Abstract: The present invention provides a water purifier, the water purification capability of which can be maintained over a long period of time. The water purifier 1 has: an attachment main body 10 that has an inflow passage P11, into which tap water flows from an inlet 11, and outflow passages P12 and P13 communicating with outlets 12 and 13; and a water purification main body 20 that has a first flow passage P21, a second flow passage P22, a third flow passage P23, a first filter material 25 between the first flow passage P21 and the second flow passage P22, and a second filter material 26 between the third flow passage P23 and the second flow passage P22 and is rotatably mounted onto the attachment main body 10. During a parallel filter material mode, the first flow passage P21 and the third flow passage P23 communicate with the inflow passage P11 and the second flow passage P22 communicates with the outflow passage P12.
    Type: Application
    Filed: March 10, 2015
    Publication date: June 2, 2016
    Inventors: Tsutomu SASAKI, Satoshi SASAKI
  • Patent number: 9263559
    Abstract: A radio communication device includes a power amplifier having a semiconductor device formed with a plurality of unit transistors. Base electrodes of the unit transistors are connected with each other by a base line, and an input capacitor is connected to the base line such that the input capacitor is commonly and electrically connected to the base electrodes of a plurality of the unit transistors.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: February 16, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi Sasaki, Yasunari Umemoto, Yasuo Osone, Tsutomu Kobori, Chushiro Kusano, Isao Ohbu, Kenji Sasaki
  • Publication number: 20160039811
    Abstract: Provided is a compound or a salt thereof, which has an excellent JAK inhibitory action, and is useful as a prophylactic or therapeutic agent for autoimmune diseases (rheumatoid arthritis, psoriasis, inflammatory bowel disease, Sjogren's syndrome, Behcet's syndrome, multiple sclerosis, systemic lupus erythematosus, etc.), cancer (leukemia, uterine leiomyosarcoma, prostate cancer, multiple myeloma, cachexia, myelofibrosis, etc.) and the like. The present invention relates to a compound represented by the formula (I) wherein each symbol is as defined in the present specification, or a salt thereof.
    Type: Application
    Filed: March 27, 2014
    Publication date: February 11, 2016
    Applicant: TAKEDA PHARMACEUTICAL COMPANY LIMITED
    Inventors: Masato YOSHIDA, Hiroyuki NAGAMIYA, Yusuke OHBA, Masaki SETO, Takatoshi YOGO, Satoshi SASAKI, Norihito TOKUNAGA, Kazuyoshi ASO
  • Publication number: 20150373238
    Abstract: A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
    Type: Application
    Filed: August 31, 2015
    Publication date: December 24, 2015
    Inventors: Shigeru TAGO, Hirofumi SHINAGAWA, Jerry HSIEH, Satoshi SASAKI, Jun SASAKI, Nobuo IKEMOTO, Yuki WAKABAYASHI
  • Publication number: 20150373854
    Abstract: A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.
    Type: Application
    Filed: August 28, 2015
    Publication date: December 24, 2015
    Inventors: Nobuo IKEMOTO, Makoto OSAMURA, Satoshi SASAKI, Yuki WAKABAYASHI
  • Patent number: 9216894
    Abstract: A drinking water server includes a raw water storage unit that stores raw water containing chlorine and a cover that defines an inner space of the raw water tank by blocking an upper opening of the raw water tank; a purification unit that receives and filters the raw water and discharges the filtered raw water as purified water into a purified water tank which stores or discharges purified water in response to closing or opening of the purified water discharge path; a drinking water storage unit in which a drinking water discharge path is provided and which stores or discharges purified water in response to closing or opening of the drinking water discharge path by a float valve body based on an amount of the purified water by floating on the purified water, an inner space of the drinking water tank (40) being closed; and an air tube portion that communicates between the raw water tank and the drinking water tank.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: December 22, 2015
    Assignee: UCHIMURA CO., LTD.
    Inventor: Satoshi Sasaki
  • Patent number: 9185795
    Abstract: Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ?1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ?2 higher than the relative dielectric constant ?1 and is provided on the first principal surface so as to overlap the opening.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: November 10, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Shigeru Tago, Jun Sasaki, Satoshi Sasaki
  • Publication number: 20150317279
    Abstract: To provide a semiconductor device and a mobile terminal device capable of operating with stability. A semiconductor device includes an HSIC physical layer circuit fixedly connected to another semiconductor device through a bus line, a USB link control unit that operates with either a USB host function or a USB device function, and link-connects to the another semiconductor device, a nonvolatile storage unit that stores selection data, the selection data being used to select the USB function with which the USB link control unit operates, and a semiconductor substrate on which the HSCI physical control unit, the USB link control unit, and the nonvolatile storage unit are formed.
    Type: Application
    Filed: July 13, 2015
    Publication date: November 5, 2015
    Inventor: Satoshi Sasaki