Abstract: A system including: an automatic exchanging device configured to move along the multiple component mounters arranged in a line and automatically exchange automatically exchangeable units of the component mounters; an operation monitoring device configured to monitor an operation state of the automatically exchangeable units of the component mounters and monitor whether it is necessary to exchange the automatically exchangeable units due to maintenance or a breakdown; and a management device configured to, when the operation monitoring device determines that exchange of one of the automatically exchangeable units of the component mounters is necessary due to maintenance or a breakdown, move the automatic exchanging device to the component mounter in question and cause the automatic exchanging device to perform automatic exchange of the automatically exchangeable unit of the component mounter with an exchange-use unit.

Abstract: A system including: an automatic exchanging device configured to move along the multiple component mounters arranged in a line and automatically exchange automatically exchangeable units of the component mounters; an operation monitoring device configured to monitor an operation state of the automatically exchangeable units of the component mounters and monitor whether it is necessary to exchange the automatically exchangeable units due to maintenance or a breakdown; and a management device configured to, when the operation monitoring device determines that exchange of one of the automatically exchangeable units of the component mounters is necessary due to maintenance or a breakdown, move the automatic exchanging device to the component mounter in question and cause the automatic exchanging device to perform automatic exchange of the automatically exchangeable unit of the component mounter with an exchange-use unit.

Abstract: In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

Abstract: The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

Abstract: The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

Abstract: In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.