Patents by Inventor Satoshi Utsunomiya

Satoshi Utsunomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210362770
    Abstract: Provided is a steering function-equipped hub unit including: a hub unit body including a hub bearing; a unit support member configured to be provided to a chassis frame component, the unit support member supporting the hub unit body such that the hub unit body is rotatable about a turning axis extending in a vertical direction; and a steering actuator configured to rotationally drive the hub unit body about the turning axis, wherein the hub bearing includes an outer race integrally provided with turning shaft parts protruding upward and downward in the vertical direction on an outer peripheral surface of the outer race, each of the turning shaft parts having an axis coinciding with the turning axis, and the hub unit body is rotatably supported by the unit support member through the turning shaft parts.
    Type: Application
    Filed: August 5, 2021
    Publication date: November 25, 2021
    Applicant: NTN CORPORATION
    Inventors: Satoshi UTSUNOMIYA, Yusuke OHATA
  • Publication number: 20210309285
    Abstract: Provided is a steering function equipped hub unit (1) including: a hub unit body (2); a unit support member (3) configured to be provided to a knuckle (6) and to support the hub unit body (2) such that the hub unit body is rotatable about a turning axis (A) extending in a vertical direction; and a steering actuator (5) configured to rotate the hub unit body (2) about the turning axis (A), wherein the steering actuator (5) includes a motor (26) and a linear motion mechanism (25) configured to convert a rotary output from the motor (26) into a linear motion, the linear motion mechanism (25) includes a feed screw mechanism (33) of a sliding screw type including a nut part (36) and a threaded shaft (36), and a surface hardening layer is provided on at least a threaded surface of one or both of the nut part (35) and the threaded shaft (36).
    Type: Application
    Filed: June 17, 2021
    Publication date: October 7, 2021
    Applicant: NTN CORPORATION
    Inventors: Hirokazu OOBA, Satoshi UTSUNOMIYA, Yusuke OHATA
  • Patent number: 11097768
    Abstract: A supplemental turning function-equipped hub unit includes: a hub unit body including a hub bearing; and a unit support member configured to be mounted through a suspension device, the unit support member supporting the hub unit body through rotation-permitting support components at two upper and lower portions of the hub unit body such that the hub unit body is rotatable about a supplemental turning axis. A supplemental turning force receiving part is provided on a side part of the hub unit body, which part is configured to receive a force that causes the hub unit body to rotate about the supplemental turning axis.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: August 24, 2021
    Assignee: NTN CORPORATION
    Inventors: Hirokazu Ooba, Tomomi Ishikawa, Kentaro Nishikawa, Satoshi Utsunomiya, Yusuke Ohata, Taisuke Igi, Norio Ishihara
  • Publication number: 20210197887
    Abstract: The present invention relates to a steering function-equipped hub unit (1) having a function of steering a rear wheel, the hub unit including: a hub unit body (2) having a hub bearing (15) configured to support the rear wheel (9R); a unit support member (3) rotatably supporting the hub unit body (2) about a turning axis (A) extending in a vertical direction, the unit support member being configured to be provided to a rear-wheel suspension (Rs); and a steering actuator (5) configured to rotate the hub unit body (2) about the turning axis (A).
    Type: Application
    Filed: March 17, 2021
    Publication date: July 1, 2021
    Applicant: NTN CORPORATION
    Inventors: Yusuke OHATA, Hirokazu OOBA, Satoshi UTSUNOMIYA
  • Publication number: 20210009199
    Abstract: Provided are a steering function-equipped hub unit that has a simple structure, high rigidity and a reduced size, a steering system, as well as a vehicle including the steering function-equipped hub unit. The steering function-equipped hub unit includes: a hub unit main body including a hub bearing supporting a wheel; a unit support member provided to a knuckle of a suspension device and rotatably supporting the hub unit main body about a turning axis extending in a vertical direction; and a steering actuator configured to rotationally drive the hub unit main body about the turning axis. The hub unit main body is supported by the unit support member through a preloaded rolling bearing.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Applicant: NTN CORPORATION
    Inventors: Hirokazu OOBA, Satoshi UTSUNOMIYA, Norio ISHIHARA, Yusuke OHATA
  • Publication number: 20210009193
    Abstract: Provided is a steering system capable of enhancing traveling stability when a vehicle drives straight and improving small-turn performance. The steering system includes: a first steering device; a second steering device including a mechanical section configured to individually steer each of left and right wheels by driving a steering actuator and a control section configured to control the steering actuator; and a vehicle information detection section configured to detect a velocity of the vehicle and a steering angle. The control section includes a turning angle control module configured to control the steering actuator pursuant to a predetermined rule in accordance with the velocity of the vehicle and the steering angle so as to control turning angles of the left and right wheels.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Applicant: NTN CORPORATION
    Inventors: Hirokazu OOBA, Norio ISHIHARA, Satoshi UTSUNOMIYA, Yusuke OHATA
  • Publication number: 20200282769
    Abstract: Provided is a turning function-equipped having a reduced size and having improved strength to an external shock force and improved reliability. The turning function-equipped hub unit includes: a hub unit main body; a unit support member; and a turning actuator. The unit support member is provided to a chassis frame component. The unit support member includes an abutment part with which a part of the hub unit main body is brought into abutment in a vertical direction during non-normal time, the abutment part being separated from the hub unit main body in the vertical direction during normal time, and the non-normal time in which the abutment is caused, is a time when an impact load equal to or greater than a predetermined value acts on the hub unit main body in the vertical direction due to an external force from the wheel.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 10, 2020
    Applicant: NTN CORPORATION
    Inventors: Satoshi UTSUNOMIYA, Hirokazu OOBA, Yusuke OHATA
  • Publication number: 20200122771
    Abstract: A supplemental turning function-equipped hub unit includes: a hub unit body including a hub bearing; and a unit support member configured to be mounted through a suspension device, the unit support member supporting the hub unit body through rotation-permitting support components at two upper and lower portions of the hub unit body such that the hub unit body is rotatable about a supplemental turning axis. A supplemental turning force receiving part is provided on a side part of the hub unit body, which part is configured to receive a force that causes the hub unit body to rotate about the supplemental turning axis.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Applicant: NTN CORPORATION
    Inventors: Hirokazu OOBA, Tomomi Ishikawa, Kentaro Nishikawa, Satoshi Utsunomiya, Yusuke Ohata, Taisuke Igi, Norio Ishihara
  • Patent number: 7602052
    Abstract: To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: October 13, 2009
    Assignee: Panasonic Corporation
    Inventors: Satoshi Utsunomiya, Yoshihiro Takano
  • Publication number: 20090156318
    Abstract: There is provide a shaft coupling of the type which can transmit power between two parallel shafts through rolling elements disposed at intersecting portions of guide grooves that intersect each other at a right angle which can always stably transmit power. Guide grooves 5 and 6 are formed in opposed surfaces of two plates 1 and 2 such that each adjacent pair of guide grooves formed in each of the plates extend in a direction that forms an angle of 45 degrees with a reference line X connecting the midpoint between their respective intersecting portions and the center of the plates. Elongated holes 7 are formed in the retainer 4 so that each elongated hole extends along a straight line connecting the two adjacent intersecting portions between the two adjacent pairs of opposed guide grooves. Each elongated hole 7 and two pairs of opposed guide grooves 5 and 6 form a pair of rolling element guide mechanisms.
    Type: Application
    Filed: July 10, 2006
    Publication date: June 18, 2009
    Inventors: Katsumi Tashiro, Satoshi Utsunomiya, Daiji Okamoto
  • Publication number: 20090069099
    Abstract: An object is to provide a shaft coupling of the type in which power is transmitted between two parallel shafts through rolling elements each disposed at the intersecting portion of two guide grooves that intersect each other at a right angle which always operates stably. The rolling elements 3 are cylindrically shaped, and have both ends thereof guided by the respective guide grooves 5 and 6 of the plates 1 and 2 with their central portions each passed through and held by an elongated hole 7 formed in the retainer 4, and sliders 10 are provided each extending from the outer periphery of one of the rolling elements 3 in the shape of a flange and engaging the retainer 4, thereby preventing each rolling element 3 from pivoting in a plane including an axis of the rolling element. With this arrangement, it is possible to prevent forces in the axial direction of the rotary members from acting on the rolling elements, thereby preventing axial movements of the rotary members.
    Type: Application
    Filed: May 25, 2006
    Publication date: March 12, 2009
    Inventor: Satoshi Utsunomiya
  • Publication number: 20060267166
    Abstract: To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.
    Type: Application
    Filed: September 14, 2005
    Publication date: November 30, 2006
    Inventors: Satoshi Utsunomiya, Yoshihiro Takano
  • Patent number: 6779264
    Abstract: A method for manufacturing an electronic device by placing within a die a first lead with an element placement pad, a second lead, and an electronic element placed on the element placement pad. The electronic element, the element placement pad, a part of the first lead, and a part of the second lead are sealed in a package by injecting a sealing resin in the die from a position on a longer side of the package, with the position being offset toward one shorter side thereof. The first lead is bent in an S shape, with a bending depth being at least as large as the thickness of the first lead. A thickness of the resin on a non-device side of the element placement pad is smaller than the bending depth.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: August 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Kobayashi, Hideki Fukazawa, Satoshi Utsunomiya
  • Patent number: 6504097
    Abstract: A resin sealed electronic device has an electronic element (30), a first external lead (10) with an element placement pad (11) having a thickness t of less than 0.1 mm, and a second external lead (20), which is disposed at a distance from the element placement pad (11), the first external lead (10) being bent into an S shape, the bending depth d thereof being made at least the thickness t of the first external lead (10), and the thickness T of the sealing resin on the non-element side of the element placement pad (11) being made smaller than the bending depth d. The electronic element (30), part of the first external lead (10), and part of the second external lead (20) are sealed by a sealing resin (40). This structure provides a compact electronic device, the vertical, horizontal, and height dimensions of which are all under 1 mm.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: January 7, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Kobayashi, Hideki Fukazawa, Satoshi Utsunomiya
  • Publication number: 20020130405
    Abstract: A resin sealed electronic device has an electronic element (30), a first external lead (10) with an element placement pad (11) having a thickness t of less than 0.1 mm, and a second external lead (20), which is disposed at a distance from the element placement pad (11), the first external lead (10) being bent into an S shape, the bending depth d thereof being made at least the thickness t of the first external lead (10), and the thickness T of the sealing resin on the non-element side of the element placement pad (11) being made smaller than the bending depth d. The electronic element (30), part of the first external lead (10), and part of the second external lead (20) are sealed by a sealing resin(40). This structure provides a compact electronic device, the vertical, horizontal, and height dimensions of which are all under 1 mm.
    Type: Application
    Filed: October 8, 1999
    Publication date: September 19, 2002
    Inventors: TAKESHI KOBAYASHI, HIDEKI FUKAZAWA, SATOSHI UTSUNOMIYA
  • Patent number: 6359326
    Abstract: A semiconductor device requires a reduced cost, has a decreased substrate mounting area, and ensures that paired transistors, etc., have equivalent characteristics to each other. A separation strip 10 splits a semiconductor substrate 3 of one conductivity type into pairing regions and surrounds the semiconductor substrate, and has a high impurity concentration than a front surface side of the semiconductor substrate 3 but the same conductivity type with semiconductor substrate 3. A pair of vertical type semiconductor elements 1, 2 is disposed which shares the semiconductor substrate as a collector region, and the semiconductor elements 1, 2 comprise base regions 12, 22 of a reverse conductivity type which are formed respectively in the pairing regions and emitter regions 13, 23 of the one conductivity type which are formed within the base regions 12, 22 of the reverse conductivity type.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: March 19, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Utsunomiya, Nobuo Tomita
  • Publication number: 20010011598
    Abstract: A resin sealed electronic device has an electronic element (30), a first external lead (10) with an element placement pad (11) having a thickness t of less than 0.1 mm, and a second external lead (20), which is disposed at a distance from the element placement pad (11), the first external lead (10) being bent into an S shape, the bending depth d thereof being made at least the thickness t of the first external lead (10), and the thickness T of the sealing resin on the non-element side of the element placement pad (11) being made smaller than the bending depth d. The electronic element (30), part of the first external lead (10), and part of the second external lead (20) are sealed by a sealing resin(40). This structure provides a compact electronic device, the vertical, horizontal, and height dimensions of which are all under 1 mm.
    Type: Application
    Filed: April 12, 2001
    Publication date: August 9, 2001
    Applicant: Matsushita Electronics Corporation
    Inventors: Takeshi Kobayashi, Hideki Fukazawa, Satoshi Utsunomiya
  • Patent number: 5851163
    Abstract: Plating 5 having good slide friction characteristics is applied onto the pocket surfaces 4a1, 4a2, which are opposite each other in the circumferential direction of the pockets 4a of the carrier and onto the end face 4a3 in the axial direction. It is possible to improve the lubrication conditions at the contacting area of the outer circumferential surface of the planetary rollers and the pocket surface 4a1 of the carrier 4 by coating the plating 5 having good slide friction characteristics onto the pocket surfaces 4a1,4a2 of the pocket 4 of the carrier 4 and further onto the end face 4a3. That is, the friction force at the contacting area is able to be decreased by the plating 5 having good friction characteristics, whereby even in a case where the contacting area is lubricated with a little lubricant, thermal deterioration of the lubricant due to heat generation of the contacting area is suppressed and good lubrication actions can be expected.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: December 22, 1998
    Assignee: NTN Corporation
    Inventors: Tatsuo Kawase, Takashi Nozaki, Tomoaki Makino, Satoshi Utsunomiya
  • Patent number: 4060451
    Abstract: Pulp particles consisting essentially of 50 to 90% by weight of mica particles and 50 to 10% by weight of polyamide-imide, said polyamide-imide forming a continuous phase in which said mica particles are dispersed discontinuously.A paper-like sheet comprising an integrated intimate mixture of 20 to 95% by weight of the pulp particles and 80 to 5% by weight of staple fibers of a thermally stable polymer.
    Type: Grant
    Filed: July 8, 1976
    Date of Patent: November 29, 1977
    Assignee: Teijin Limited
    Inventors: Shuichi Uchiyama, Satoshi Utsunomiya, Hideo Watase
  • Patent number: D570260
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: June 3, 2008
    Assignee: Mazda Motor Corporation
    Inventors: Hideki Suzuki, Kaname Sawai, Satoshi Utsunomiya, Atsushi Hayasaka