Abstract: Techniques for corrosive substance detection for electronic devices are described herein. An aspect includes applying an electrical bias to a detector structure of a corrosive substance detector, wherein a layer of a hydrophilic gel is located over an electrode of the detector structure. Another aspect includes monitoring a resistance of the detector structure. Another aspect includes, based on determining that the resistance of the detector structure has dropped below a minimum resistance, indicating exposure to a corrosive substance by the corrosive substance detector.

Abstract: A method of prohibiting personal information identification of a photographic subject including: digitally photographing the photographic subject to form a photo of the photographic subject, the photographic subject having an indicia incorporated in the photo indicating prohibiting personal information identification of the photographic subject, the indicia being invisible to the human eye; reading the indicia; responsive to reading the indicia, processing the indicia to make a determination when the indicia prohibits identification of personal information of the photographic subject; and disclosing on a social network system the photo and the personal information of the photographic subject according to the determination.

Abstract: A method of prohibiting personal information identification of a photographic subject including: digitally photographing the photographic subject to form a photo of the photographic subject, the photographic subject having an indicia incorporated in the photo indicating prohibiting personal information identification of the photographic subject, the indicia being invisible to the human eye; reading the indicia; responsive to reading the indicia, processing the indicia to make a determination when the indicia prohibits identification of personal information of the photographic subject; and disclosing on a social network system the photo and the personal information of the photographic subject according to the determination.

Abstract: Techniques for corrosive substance detection for electronic devices are described herein. An aspect includes applying an electrical bias to a detector structure of a corrosive substance detector, wherein a layer of a hydrophilic gel is located over an electrode of the detector structure. Another aspect includes monitoring a resistance of the detector structure. Another aspect includes, based on determining that the resistance of the detector structure has dropped below a minimum resistance, indicating exposure to a corrosive substance by the corrosive substance detector.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: Chip mounting is provided in which the pitch between bumps can be further narrowed without establishing contact between bumps. In a chip mounting structure in which a flip-chip bond has been established between a chip and a board via bumps, the bumps are provided so that the height position of the bumps from the connection surface of the chip or the connection surface of the board has a difference in height exceeding the thickness of adjacent bumps. This further narrows the pitch between bumps without establishing contact between the bumps.

Abstract: The service life of electrical equipment is predicted using a thermal history sensor mounted in the electrical equipment. At least one thermal history sensor is mounted inside or on an outer wall surface of electrical equipment. The thermal history sensor includes dissimilar metal joints, and the resistance values of the dissimilar metal joints change in response to the amount of intermetallic compound growing in the dissimilar metal joints due to the temperature inside the electrical equipment or of the outer wall thereof during operation. A determining mechanism periodically or irregularly monitors and stores in memory the resistance values of the dissimilar metal joints from the thermal history sensor, and uses the stored history of resistance values to predict the service life of the electrical equipment.

Abstract: Chip mounting is provided in which the pitch between bumps can be further narrowed without establishing contact between bumps. In a chip mounting structure in which a flip-chip bond has been established between a chip and a board via bumps, the bumps are provided so that the height position of the bumps from the connection surface of the chip or the connection surface of the board has a difference in height exceeding the thickness of adjacent bumps. This further narrows the pitch between bumps without establishing contact between the bumps.

Abstract: A semiconductor device having two or more semiconductor chips stacked upon one another in a manner that makes them less susceptible to damage from warping of the semiconductor device.

Abstract: A semiconductor integrated circuit device and method of making same wherein recessed bus bar regions are provided in an elongated bus bar to accommodate location of bonding wires which couple the device's chip pads and associated inner leads. Fillets are formed of insulative adhesive material (from the tape used to secure the leads and bus bar to the chip) up about the bus bar region sides to thereby engage the bonding wires to prevent contact between the wires and bus bar.

Abstract: A semiconductor integrated circuit device and method of making same wherein recessed bus bar regions are provided in an elongated bus bar to accommodate bonding wires which couple the device's chip pads and associated inner leads. Fillets are formed of insulative adhesive material (from the tape used to secure the leads and bus bar to the chip) up about the bus bar region sides to thereby engage the bonding wires to prevent contact between the wires and bus bar.