Patents by Inventor SATYA CHINNUSAMY

SATYA CHINNUSAMY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100289129
    Abstract: A bonding plate forms high-performance, low-resistance interconnections between integrated circuit die and an electronic package lead frame. The bonding plate is made from copper, aluminum, or metalized silicon and is processed using standard semiconductor fabrication techniques to apply solder bumps and, optionally, copper pillars. The bonding plates are singulated from a wafer and applied to the die package using standard pick-and-place and solder reflow equipment and processes. This achieves high performance interconnect at low cost without the need for specialized tooling.
    Type: Application
    Filed: May 13, 2010
    Publication date: November 18, 2010
    Inventor: SATYA CHINNUSAMY