Patents by Inventor Saverio Trotta

Saverio Trotta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11417963
    Abstract: A radio frequency (RF) system includes an RF integrated circuit (IC) die, and an antenna coupled to the RF IC die. The RF system further includes a reflector layer over the RF IC die, the reflector layer extending over at least a portion of the antenna, a combination of the antenna and the reflector layer having a radiation pattern that comprises a main lobe in a first direction parallel to a top surface of the reflector layer.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: August 16, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Ashutosh Baheti
  • Patent number: 11411311
    Abstract: An embodiment method for signal path measurement includes providing a first signal at a common node coupled to a plurality of signal paths that each includes a respective phase rotation circuit. The method also includes providing a second signal, over a first test path, to a first node coupled to a first signal path of the plurality of signal paths, providing the second signal, over a second test path, to a second node coupled to a second signal path of the plurality of signal paths, selecting a signal path from the plurality of signal paths, transmitting, over the selected signal path, one of the first signal and the second signal, and mixing the first signal with the second signal to obtain a measurement signal of the selected signal path. A difference in phase delay between the second test path and the first test path includes a first known phase delay.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: August 9, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Saverio Trotta
  • Patent number: 11397239
    Abstract: In an embodiment, a method of operating a radar includes: transmitting a radiation pulse with the radar during an active mode; asserting a sleep flag after transmitting the radiation pulse; turning off a crystal oscillator circuit of the radar after the sleep flag is asserted; clocking a counter of the radar with a low power oscillator during a low power mode after the sleep flag is asserted; asserting a timer flag when the counter reaches a first threshold; and transitioning into the active mode after the timer flag is asserted.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 26, 2022
    Assignee: Infineon Technologies AG
    Inventors: Reinhard-Wolfgang Jungmaier, Christoph Rumpler, Saverio Trotta
  • Patent number: 11360185
    Abstract: In an embodiment, a method of operating a radar includes: generating a set of chirps; transmitting the set of chirps; receiving chirps corresponding to the transmitted set of chirps; using a finite state machine (FSM) to apply a phase shift to each of the transmitted chirps or each of the received chirps based on a code; and demodulating the received chirps based on the code.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Reinhard-Wolfgang Jungmaier, Christoph Rumpler, Avik Santra, Saverio Trotta, Raghavendran Vagarappan Ulaganathan
  • Publication number: 20220175314
    Abstract: A system includes a millimeter-wave radar sensor disposed on a circuit board, a plurality of antennas coupled to the millimeter-wave radar sensor and disposed on the circuit board, and a processing circuit coupled to the millimeter-wave radar sensor and disposed on the circuit board. The processing circuit is configured to determine vital signal information based on output from the millimeter-wave radar sensor.
    Type: Application
    Filed: February 25, 2022
    Publication date: June 9, 2022
    Inventors: Ashutosh Baheti, Reinhard-Wolfgang Jungmaier, Avik Santra, Saverio Trotta
  • Patent number: 11355838
    Abstract: A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: June 7, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ashutosh Baheti, Marwa Abdel-Aziz, Mustafa Dogan, Muhammad Tayyab Qureshi, Saverio Trotta, Maciej Wojnowski
  • Patent number: 11346936
    Abstract: A method of measuring vital signals using a millimeter-wave radar sensor system includes performing a first set of radar measurements using a millimeter-wave radar sensor to produce a first set of radar data; determining a first set of range gate measurements from the first set of radar data; determining high response range gates from the first set of range gate measurements; and extracting vital signal information from the high response range gates.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: May 31, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ashutosh Baheti, Reinhard-Wolfgang Jungmaier, Avik Santra, Saverio Trotta
  • Patent number: 11336026
    Abstract: A radio frequency (RF) system includes an RF integrated circuit (IC) die, and an antenna coupled to the RF IC die. The RF system further includes a reflector layer over the RF IC die, the reflector layer extending over at least a portion of the antenna, a combination of the antenna and the reflector layer having a radiation pattern that comprises a main lobe in a first direction parallel to a top surface of the reflector layer.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: May 17, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Ashutosh Baheti
  • Publication number: 20220148951
    Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
    Type: Application
    Filed: December 7, 2021
    Publication date: May 12, 2022
    Applicant: Infineon Technologies AG
    Inventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Theyerl, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski
  • Patent number: 11316597
    Abstract: In accordance with an embodiment, a method includes: receiving, by an adjustable frequency doubling circuit, a first clock signal having a first clock frequency; using the adjustable frequency doubling circuit, generating a second clock signal having a second clock frequency that is twice the first clock frequency; measuring a duty cycle parameter of the second clock signal, where the duty cycle parameter is dependent on a duty cycle of the first clock signal or a duty cycle of the second clock signal; and using the adjustable frequency doubling circuit, adjusting the duty cycle of the first clock signal or the second clock signal based on the measuring.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: April 26, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Siegfried Albel, Michael Aichner, Reinhard-Wolfgang Jungmaier, Dennis Noppeney, Christoph Rumpler, Saverio Trotta
  • Patent number: 11278241
    Abstract: A system includes a millimeter-wave radar sensor disposed on a circuit board, a plurality of antennas coupled to the millimeter-wave radar sensor and disposed on the circuit board, and a processing circuit coupled to the millimeter-wave radar sensor and disposed on the circuit board. The processing circuit is configured to determine vital signal information based on output from the millimeter-wave radar sensor.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: March 22, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ashutosh Baheti, Reinhard-Wolfgang Jungmaier, Avik Santra, Saverio Trotta
  • Publication number: 20220085484
    Abstract: A semiconductor system includes a semiconductor chip comprising a RF circuit, a buffer layer over the RF circuit and a plurality of bumps over the buffer layer, wherein the plurality of bumps comprising at least one functional bump electrically connected to the RF circuit, and at least one dummy bump which is maintained at a distance from the RF circuit and prevented from being electrically connected to the RF circuit by the buffer layer, a conductive layer disposed over the semiconductor chip and coupled to the plurality of bumps through a plurality of vias, a feedline structure disposed over the conductive layer, wherein the feedline structure is electrically coupled to the RF circuit, and a plurality of antennas disposed over the feedline structure, wherein at least one antenna of the plurality of antennas is coupled to the RF circuit through the feedline structure.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 17, 2022
    Inventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
  • Publication number: 20220077592
    Abstract: An electronic device includes a housing, an electrically conductive layer and millimeter-wave (mmw) circuitry configured to emit a mmw signal. The mmw circuitry is arranged in the housing and on a first side of the electrically conductive layer. The housing comprises at least one portion configured as a dielectric lens to refract the mmw signal at least partially outside the housing towards a second side opposite to the first side of the electrically conductive layer.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 10, 2022
    Inventors: Nadine Pfuhl, Marwa Abdel-Aziz, Ashutosh Baheti, Saverio Trotta
  • Publication number: 20220059925
    Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.
    Type: Application
    Filed: August 19, 2020
    Publication date: February 24, 2022
    Inventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
  • Patent number: 11258162
    Abstract: A semiconductor system includes a semiconductor chip comprising a RF circuit, a buffer layer over the RF circuit and a plurality of bumps over the buffer layer, wherein the plurality of bumps comprising at least one functional bump electrically connected to the RF circuit, and at least one dummy bump which is maintained at a distance from the RF circuit and prevented from being electrically connected to the RF circuit by the buffer layer, a conductive layer disposed over the semiconductor chip and coupled to the plurality of bumps through a plurality of vias, a feedline structure disposed over the conductive layer, wherein the feedline structure is electrically coupled to the RF circuit, and a plurality of antennas disposed over the feedline structure, wherein at least one antenna of the plurality of antennas is coupled to the RF circuit through the feedline structure.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: February 22, 2022
    Assignee: Infineon Technologies AG
    Inventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
  • Publication number: 20220029271
    Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.
    Type: Application
    Filed: July 27, 2020
    Publication date: January 27, 2022
    Inventors: Eung San Cho, Ashutosh Baheti, Saverio Trotta
  • Patent number: 11216077
    Abstract: A device includes a frame, a first circuit board within the frame, and a display over and coupled to the first circuit board. The device further includes a second circuit board electrically coupled to the first circuit board, and a mm-wave gesture sensing system mounted on the second circuit board.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: January 4, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Saverio Trotta
  • Patent number: 11204411
    Abstract: A method of operating a radar system includes transmitting a plurality of transmitted radio frequency (RF) signals by a plurality of directional antennas. The plurality of directional antennas is disposed on a planar surface of a substrate. Each of the plurality of antennas is in a fixed orientation and position on the planar surface. A respective individual coverage of each of the plurality of directional antennas is less than 360°. A combined coverage of the plurality of transmitted RF signals completely covers a 360° region surrounding the radar system. The method also includes receiving a reflected RF signal by a directional antenna of the plurality of directional antennas.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: December 21, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Reinhard-Wolfgang Jungmaier, Saverio Trotta, Ashutosh Baheti, Jagjit Singh Bal
  • Patent number: 11195787
    Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: December 7, 2021
    Assignee: Infineon Technologies AG
    Inventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski
  • Patent number: 11188495
    Abstract: In an embodiment, a method for writing to a set of serial peripheral interface (SPI) slaves coupled to an SPI bus includes: disabling master in slave out (MISO) drivers of the set of SPI slaves using the SPI bus; after disabling the MISO drivers, setting respective slave selection terminals of the set of SPI slaves to an active state; and after setting the respective slave selection terminals of the set of SPI slaves to the active state, simultaneously writing data to the set of SPI slaves using a master out slave in (MOSI) line.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: November 30, 2021
    Assignee: Infineon Technologies AG
    Inventors: Christoph Rumpler, Reinhard-Wolfgang Jungmaier, Dennis Noppeney, Saverio Trotta