Abstract: An optical waveguide-forming material has a low propagation loss even in a long wavelength region and has a high refractive index at a wavelength of 1,550 nm. An optical waveguide-forming composition includes (a) 100 parts by mass of a reactive silsesquioxane compound that is a polycondensation product of an alkoxysilane compound A of the following Formula [1]: Ar1—Si(OR1)3??[1] and an alkoxysilane compound B of the following Formula [2]: Ar2—Si(OR2)3??[2] and (b) 10 to 500 parts by mass of a fluorene compound of the following Formula [3]: An optical waveguide can be formed by using the composition.

Abstract: There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: wherein R1 to R3 each independently are a hydrogen atom or methyl group, and L1 to L3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

Abstract: An optical waveguide-forming material has a low propagation loss even in a long wavelength region and has a high refractive index at a wavelength of 1,550 nm. An optical waveguide-forming composition includes (a) 100 parts by mass of a reactive silsesquioxane compound that is a polycondensation product of an alkoxysilane compound A of the following Formula [1]: Ar1—Si(OR1)3??[1] and an alkoxysilane compound B of the following Formula [2]: Ar2—Si(OR2)3??[2] and (b) 10 to 500 parts by mass of a fluorene compound of the following Formula [3]: An optical waveguide can be formed by using the composition.

Abstract: A polymerizable composition suitable for use in producing molded articles that can maintain a high refractive index, and can be prevented from cracking, peeling from a support, and dimensional changes due to a high-temperature thermal history. A polymerizable composition including (a) 100 parts by mass of a specific reactive silsesquioxane compound, (b) 10 to 500 parts by mass of a specific fluorene compound, and (c) 0.1 to 50 parts by mass of a polymer having a weight average molecular weight of 5,000 to 100,000; a cured product obtained by polymerizing the polymerizable composition; and a high-refractive-index resin lens material including the polymerizable composition.

Abstract: There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: wherein R1 to R3 each independently are a hydrogen atom or methyl group, and L1 to L3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

Abstract: A polymerizable composition suitable for use in producing molded articles that can maintain a high refractive index, and can be prevented from cracking, peeling from a support, and dimensional changes due to a high-temperature thermal history. A polymerizable composition including (a) 100 parts by mass of a specific reactive silsesquioxane compound, (b) 10 to 500 parts by mass of a specific fluorene compound, and (c) 0.1 to 50 parts by mass of a polymer having a weight average molecular weight of 5,000 to 100,000; a cured product obtained by polymerizing the polymerizable composition; and a high-refractive-index resin lens material including the polymerizable composition.