Patents by Inventor Scott D. Garner

Scott D. Garner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030155105
    Abstract: A vapor chamber for spreading heat includes a housing having spaced-apart first and second plates, the first and second plates defining a hollow chamber. At least one opening is defined through the first and second plates, the opening being isolated from the hollow chamber. At least one insert is fitted into each opening. The insert may be a snap-in insert or may be stamped into the opening.
    Type: Application
    Filed: August 30, 2002
    Publication date: August 21, 2003
    Inventor: Scott D. Garner
  • Publication number: 20030155102
    Abstract: A vapor chamber for spreading heat includes a housing having spaced-apart first and second plates, the first and second plates defining a hollow chamber. At least one opening is defined through the first and second plates, the opening being isolated from the hollow chamber. At least one insert is fitted into each opening. The insert may be a snap-in insert or may be stamped into the opening.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Inventor: Scott D. Garner
  • Publication number: 20030051863
    Abstract: A heat pipe system for an automobile comprising: a separator layer, at least one wick layer in contact with the separator layer, at least two outer walls enclosing the separator layer and the at least one wick layer, one of the at least two outer walls being spaced away from the at least one wick layer to form a vapor space therebetween.
    Type: Application
    Filed: October 17, 2002
    Publication date: March 20, 2003
    Inventor: Scott D. Garner
  • Publication number: 20030000721
    Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.
    Type: Application
    Filed: June 26, 2002
    Publication date: January 2, 2003
    Inventor: Scott D. Garner
  • Publication number: 20020195242
    Abstract: The present invention provides a loop thermosiphon including an evaporator and a condenser interconnected in flow communication by a vapor conduit and a condensate conduit. A wick is disposed in a portion of the evaporator and a portion of the at least one condensate conduit adjacent to the evaporator to facilitate capillary action to cycle a coolant fluid through the loop thermosiphon. Advantageously, a porous valve is lodged within the condensate conduit so that a first pressure on a condenser side of the porous valve is greater than a second pressure on an evaporator side of the porous valve. In this way, a portion of the liquid coolant fluid disposed within the loop thermosiphon is forced through the porous valve and a remaining portion is forced through the at least one condenser.
    Type: Application
    Filed: June 20, 2001
    Publication date: December 26, 2002
    Inventor: Scott D. Garner
  • Patent number: 6437437
    Abstract: A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: August 20, 2002
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Scott D. Garner
  • Publication number: 20020104642
    Abstract: A heat pipe system for an automobile comprising: a separator layer, at least one wick layer in contact with the separator layer, at least two outer walls enclosing the separator layer and the at least one wick layer, one of the at least two outer walls being spaced away from the at least one wick layer to form a vapor space therebetween.
    Type: Application
    Filed: February 5, 2001
    Publication date: August 8, 2002
    Inventor: Scott D. Garner
  • Patent number: 6065664
    Abstract: The disclosure is for a method of installing a heat pipe within another structure. A completely processed heat pipe is coated with solder and inserted into a cylindrical hole within the structure with sliding clearance. The casing of the heat pipe is then expanded into tight contact with the surrounding hole by heating the heat pipe and expanding the heat pipe casing with the heat pipe's own internal vapor pressure. The application of heat also simultaneously melts the solder to bond the heat pipe into the hole.
    Type: Grant
    Filed: August 10, 1998
    Date of Patent: May 23, 2000
    Assignee: Thermal Corp.
    Inventors: Scott D. Garner, Douglas W. Grove
  • Patent number: 5822187
    Abstract: The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: October 13, 1998
    Assignee: Thermal Corp.
    Inventors: Scott D. Garner, George A. Meyer, IV, Jerome E. Toth, Richard W. Longsderff
  • Patent number: 5818693
    Abstract: The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.
    Type: Grant
    Filed: January 9, 1997
    Date of Patent: October 6, 1998
    Assignee: Thermal Corp.
    Inventors: Scott D. Garner, Jerome E. Toth
  • Patent number: 5642776
    Abstract: The disclosure is for a heat pipe in the form of a simple foil envelope and a method of constructing such a heat pipe. Two plastic coated metal foil sheets are sealed together on all four edges to enclose a semi-rigid channeled sheet of plastic foam, and the envelope is evacuated and loaded with a suitable quantity of liquid to act as a heat pipe. Despite the use of the essentially poor thermally conductive materials such as the plastic coating on the surface of the casing and the foam plastic for the wick, the apparatus operates well as a heat spreader for an integrated circuit chip placed in contact with the envelope surface. The heat is transferred across the thin plastic coating with only a small temperature differential, and the foam plastic wick with channels efficiently transports condensed liquid back to the heat input location for evaporation.
    Type: Grant
    Filed: February 27, 1996
    Date of Patent: July 1, 1997
    Assignee: Thermacore, Inc.
    Inventors: George A. Meyer, IV, Scott D. Garner
  • Patent number: 5566751
    Abstract: The apparatus is a non-condensible gas venting device for vapor sources which can include a sonic orifice for vapor pressure reduction in high vapor pressure systems. A typical vapor source has a evaporator chamber with an evaporating wick containing liquid which is heated and produces vapor. The invention is a venting chamber connected to the evaporator chamber so that the vapor has access to the venting chamber. The venting chamber also includes a condensing wick interconnected to the evaporating wick in the evaporator chamber by a capillary capillary device through which the condensed liquid is returned to the evaporating wick. The condenser chamber is vented to a lower pressure region or vacuum so that non-condensible gas present moves out of the condenser chamber into the lower pressure while the vapor is trapped by the condensing wick and is retained in the system.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: October 22, 1996
    Assignee: Thermacore, Inc.
    Inventors: William G. Anderson, Kevin H. Richardson, Scott D. Garner