Patents by Inventor Scott Haubrich

Scott Haubrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060083694
    Abstract: Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same. A flowing aerosol is generated that includes droplets of a precursor medium dispersed in a gas phase. The precursor medium contains a liquid vehicle and at least one precursor. At least a portion of the liquid vehicle is removed from the droplets of precursor medium under conditions effective to convert the precursor to the nanoparticles or the matrix and form the multi-component particles.
    Type: Application
    Filed: April 29, 2005
    Publication date: April 20, 2006
    Applicant: Cabot Corporation
    Inventors: Toivo Kodas, Mark Hampden-Smith, Scott Haubrich, Heng YU, Ned Hardman, Ralph Kornbrekke, Aaron Stump, Klaus Kunze, David Dericotte, Karel Vanheusden
  • Patent number: 6957608
    Abstract: A method of and device for controlled printing using liquid embossing techniques is disclosed. In accordance with the embodiments of the invention a stamp comprises a differentiated embossing surface with protruding and recessed surfaces to enhance the ability of the stamp to selectively displace liquid ink from a print surface and/or remove solvent from the liquid in a soft curing process. A stamp with differentiated surfaces is fabricated by selectively coating, or otherwise treating the protruding features, the recessed features, or a combination thereof, such that the surface energies and/or wettability of the protruding surfaces and the recessed surfaces are differentiated.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: October 25, 2005
    Assignee: Kovio, Inc.
    Inventors: Brian Hubert, Colin Bulthaup, Chris Gudeman, Chris Spindt, Scott Haubrich, Mao Takashima, Joerg Rockenberger, Klaus Kunze, Fabio Zurcher
  • Publication number: 20050164480
    Abstract: The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is preferably patterned conductive layer. The interface layer preferably provides Ohmic and/or rectifying contact between the active device layer and the substrate and preferably provides good adhesion of the active device layer to the substrate. The active device layer is preferably fashioned from a nanoparticle ink solution that is patterned using embossing methods or other suitable printing and/or imaging methods. The active device layer is preferably patterned into an array of gate structures suitable for the fabrication of thin film transistors and the like.
    Type: Application
    Filed: March 9, 2005
    Publication date: July 28, 2005
    Inventors: Scott Haubrich, Klaus Kunze, James Dunphy, Chris Gudeman, Joerg Rockenberger, Fabio Zurcher, Nassrin Sleiman, Mao Takashima, Christopher Spindt
  • Patent number: 6911385
    Abstract: The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is preferably patterned conductive layer. The interface layer preferably provides Ohmic and/or rectifying contact between the active device layer and the substrate and preferably provides good adhesion of the active device layer to the substrate. The active device layer is preferably fashioned from a nanoparticle ink solution that is patterned using embossing methods or other suitable printing and/or imaging methods. The active device layer is preferably patterned into an array of gate structures suitable for the fabrication of thin film transistors and the like.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: June 28, 2005
    Assignee: Kovio, Inc.
    Inventors: Scott Haubrich, Klaus Kunze, James C Dunphy, Chris Gudeman, Joerg Rockenberger, Fabio Zurcher, Nassrin Sleiman, Mao Takashima, Chris Spindt
  • Patent number: 6878184
    Abstract: Methods for making metal-based nanoparticles and inks are disclosed. In accordance with the method of the present invention, molecular metal precursors are reduced in the presence of a reaction medium to form the nanoparticles. The molecular metal precursors are preferably reduced by heating the metal precursor in the medium, by adding a reducing agent, such an aldehyde or a combination thereof. Metal precursor are preferably metal oxides, transition metal complexes or combination thereof. The method of the present invention is used to make high yield nanoparticles with a range of particle size distributions. Nanoparticle formed by the present invention include mixtures of nanoparticle, alloy nanoparticles, metal core shell nanoparticles or nanoparticle comprising a single metal species.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: April 12, 2005
    Assignee: Kovio, Inc.
    Inventors: Joerg Rockenberger, Fabio Zurcher, Scott Haubrich, Nassrin Sleiman
  • Publication number: 20050074589
    Abstract: Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ratio of at least about 5:1 within the liquid carrier. Examples of nanostructures include nanobelts, nanoplates, nanodiscs, nanowires, nanorods, and mixtures of these materials. These printable compositions can be used to form a conductive path on a substrate. The printable composition can be applied to a substrate using any number of conventional printing techniques. Following application of the printable composition, at least a portion of the liquid carrier can be removed such that the nanostructures can be in sufficient contact to provide a conductive path. The nanostructures arranged in a conductive path can be sintered or used as a conductive material without sintering.
    Type: Application
    Filed: September 18, 2003
    Publication date: April 7, 2005
    Inventors: Alfred Pan, Yoocharn Jeon, Scott Haubrich
  • Publication number: 20050008880
    Abstract: Compositions, inks and methods for forming a patterned silicon-containing film and patterned structures including such a film. The composition generally includes (a) passivated semiconductor nanoparticles and (b) first and second cyclic Group IVA compounds in which the cyclic species predominantly contains Si and/or Ge atoms. The ink generally includes the composition and a solvent in which the composition is soluble. The method generally includes the steps of (1) printing the composition or ink on a substrate to form a pattern, and (2) curing the patterned composition or ink. In an alternative embodiment, the method includes the steps of (i) curing either a semiconductor nanoparticle composition or at least one cyclic Group IVA compound to form a thin film, (ii) coating the thin film with the other, and (iii) curing the coated thin film to form a semiconducting thin film.
    Type: Application
    Filed: July 8, 2003
    Publication date: January 13, 2005
    Inventors: Klaus Kunze, Scott Haubrich, Fabio Zurcher, Brent Ridley, Joerg Rockenberger