Patents by Inventor Scott Hendrickson
Scott Hendrickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130284204Abstract: Embodiments of the invention generally provide methods for cleaning a UV processing chamber. In one embodiment, the method includes flowing an oxygen-containing gas through a plurality of passages formed in a UV transparent gas distribution showerhead and into a processing region located between the UV transparent gas distribution showerhead and a substrate support disposed within the thermal processing chamber, exposing the oxygen-containing gas to UV radiation under a pressure scheme comprising a low pressure stage and a high pressure stage to generate reactive oxygen radicals, and removing unwanted residues or deposition build-up from exposed surfaces of chamber components presented in the thermal processing chamber using the reactive oxygen radicals.Type: ApplicationFiled: April 4, 2013Publication date: October 31, 2013Inventors: BO XIE, Alexandros T. Demos, Scott A. Hendrickson, Sanjeev Baluja, Juan Carlos Rocha-Alvarez
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Publication number: 20130122611Abstract: The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a chamber, determining the relative irradiance on a substrate corresponding to a first lamp and a second lamp, and determining correction or compensation factors based on the relative irradiances and the baseline irradiance. The lamps are then adjusted via closed loop control using the correction or compensation factors to individually adjust the lamps to the desired output. The lamps may optionally be adjusted to equal irradiances prior to adjusting the lamps to the desired output. The closed loop control ensures process uniformity from substrate to substrate. The irradiance measurement and the correction or compensation factors allow for adjustment of lamp set points due to chamber component degradation, chamber component replacement, or chamber cleaning.Type: ApplicationFiled: November 5, 2012Publication date: May 16, 2013Inventors: YAO-HUNG YANG, Abhijit Kangude, Sanjeev Baluja, Michael Martinelli, Liliya Krivulina, Thomas Nowak, Juan Carlos Rocha-Alvarez, Scott A. Hendrickson
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Patent number: 8343881Abstract: A silicon dioxide layer is deposited onto a substrate using a process gas comprising BDEAS and an oxygen-containing gas such as ozone. The silicon dioxide layer can be part of an etch-resistant stack that includes a resist layer. In another version, the silicon dioxide layer is deposited into through holes to form an oxide liner for through-silicon vias.Type: GrantFiled: June 4, 2010Date of Patent: January 1, 2013Assignee: Applied Materials, Inc.Inventors: Yong-Won Lee, Vladimir Zubkov, Mei-Yee Shek, Li-Qun Xia, Prahallad Iyengar, Sanjeev Baluja, Scott A Hendrickson, Juan Carlos Rocha-Alvarez, Thomas Nowak, Derek R Witty
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Patent number: 8309421Abstract: The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a chamber, determining the relative irradiance on a substrate corresponding to a first lamp and a second lamp, and determining correction or compensation factors based on the relative irradiances and the baseline irradiance. The lamps are then adjusted via closed loop control using the correction or compensation factors to individually adjust the lamps to the desired output. The lamps may optionally be adjusted to equal irradiances prior to adjusting the lamps to the desired output. The closed loop control ensures process uniformity from substrate to substrate. The irradiance measurement and the correction or compensation factors allow for adjustment of lamp set points due to chamber component degradation, chamber component replacement, or chamber cleaning.Type: GrantFiled: January 21, 2011Date of Patent: November 13, 2012Assignee: Applied Materials, Inc.Inventors: Yao-Hung Yang, Abhijit Kangude, Sanjeev Baluja, Michael Martinelli, Liliya Krivulina, Thomas Nowak, Juan Carlos Rocha-Alvarez, Scott Hendrickson
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Publication number: 20120258259Abstract: Embodiments of the present invention provide apparatus and methods for performing UV treatment and chemical treatment and/or deposition in the same chamber. One embodiment of the present invention provides a processing chamber including a UV transparent gas distribution showerhead disposed above a substrate support located in an inner volume of the processing chamber, a UV transparent window disposed above the UV transparent gas distribution showerhead, and a UV unit disposed outside the inner volume. The UV unit is configured to direct UV lights towards the substrate support through the UV transparent window and the UV transparent gas distribution showerhead.Type: ApplicationFiled: April 5, 2012Publication date: October 11, 2012Inventors: Amit Bansal, Dale R. Du Bois, Juan Carlos Rocha-Alvarez, Sanjeev Baluja, Scott A. Hendrickson, Thomas Nowak
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Patent number: 8203126Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.Type: GrantFiled: July 22, 2010Date of Patent: June 19, 2012Assignee: Applied Materials, Inc.Inventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
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Publication number: 20120129275Abstract: The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a chamber, determining the relative irradiance on a substrate corresponding to a first lamp and a second lamp, and determining correction or compensation factors based on the relative irradiances and the baseline irradiance. The lamps are then adjusted via closed loop control using the correction or compensation factors to individually adjust the lamps to the desired output. The lamps may optionally be adjusted to equal irradiances prior to adjusting the lamps to the desired output. The closed loop control ensures process uniformity from substrate to substrate. The irradiance measurement and the correction or compensation factors allow for adjustment of lamp set points due to chamber component degradation, chamber component replacement, or chamber cleaning.Type: ApplicationFiled: January 21, 2011Publication date: May 24, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Yao-Hung Yang, Abhijit Kangude, Sanjeev Baluja, Michael Martinelli, Liliya Krivulina, Thomas Nowak, Juan Carlos Rocha-Alvarez, Scott Hendrickson
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Publication number: 20120097330Abstract: A substrate processing system includes a thermal processor or a plasma generator adjacent to a processing chamber. A first processing gas enters the thermal processor or plasma generator. The first processing gas then flows directly through a showerhead into the processing chamber. A second processing gas flows through a second flow path through the showerhead. The first and second processing gases are mixed below the showerhead and a layer of material is deposited on a substrate under the showerhead.Type: ApplicationFiled: October 20, 2010Publication date: April 26, 2012Applicant: Applied Materials, Inc.Inventors: Prahallad Iyengar, Sanjeev Baluja, Dale R. DuBois, Juan Carlos Rocha-Alverez, Thomas Nowak, Scott A. Hendrickson, Yong-Won Lee, Mei-Yee Shek, Li-Qun Xia, Derek R. Witty
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Publication number: 20110298099Abstract: A silicon dioxide layer is deposited onto a substrate using a process gas comprising BDEAS and an oxygen-containing gas such as ozone. The silicon dioxide layer can be part of an etch-resistant stack that includes a resist layer. In another version, the silicon dioxide layer is deposited into through holes to form an oxide liner for through-silicon vias.Type: ApplicationFiled: June 4, 2010Publication date: December 8, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Yong-Won LEE, Vladimir Zubkov, Mei-Yee SHEK, Li-Qun XIA, Prahallad IYENGAR, Sanjeev BALUJA, Scott A. HENDRICKSON, Juan Carlos ROCHA-ALVAREZ, Thomas NOWAK, Derek R. WITTY
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Publication number: 20100285240Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.Type: ApplicationFiled: July 22, 2010Publication date: November 11, 2010Applicant: Applied Materials, IncInventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
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Patent number: 7777198Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.Type: GrantFiled: March 15, 2007Date of Patent: August 17, 2010Assignee: Applied Materials, Inc.Inventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
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Patent number: 7692171Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.Type: GrantFiled: March 15, 2007Date of Patent: April 6, 2010Inventors: Andrzei Kaszuba, Juan Carlos Rocha-Alvarez, Sanjeev Baluja, Tom K. Cho, Hichem M'Saad, Scott A. Hendrickson, Dustin W. Ho, Thomas Nowak
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Patent number: 7663121Abstract: An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV bulbs per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV bulbs can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.Type: GrantFiled: June 15, 2006Date of Patent: February 16, 2010Assignee: Applied Materials, Inc.Inventors: Thomas Nowak, Juan Carlos Rocha-Alvarez, Andrzej Kaszuba, Scott A. Hendrickson, Dustin W. Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M'Saad
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Publication number: 20090305515Abstract: Embodiments of the invention generally relate to a method and apparatus for curing dielectric material deposited in trenches or gaps in the surface of a substrate to produce a feature free of voids and seams. In one embodiment, the dielectric material is steam annealed while being exposed to ultraviolet radiation. In one embodiment, the dielectric material is further thermally annealed in a nitrogen environment.Type: ApplicationFiled: June 6, 2008Publication date: December 10, 2009Inventors: Dustin Ho, Scott Hendrickson, Juan Carlos Rocha-Alvarez, Sanjeev Baluja, Thomas Nowak
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Patent number: 7566891Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.Type: GrantFiled: March 15, 2007Date of Patent: July 28, 2009Assignee: Applied Materials, Inc.Inventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
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Publication number: 20090162259Abstract: An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV sources per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV sources can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.Type: ApplicationFiled: February 26, 2009Publication date: June 25, 2009Inventors: Thomas Nowak, Juan Carlos Rocha-Alvarez, Andrzej Kaszuba, Scott A. Hendrickson, Dustin W. Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M'saad
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Patent number: 7506654Abstract: A method and apparatus that reduces the time required to clean a processing chamber employing a reactive plasma cleaning process. A plasma is formed in an Astron fluorine source generator from a flow of substantially pure inert-source gas. After formation of the plasma, a flow of a fluorine source gas is introduced therein such that the fluorine source flow accelerates at a rate no greater than 1.67 standard cubic centimeters per second2 (scc/s2). In this fashion, the plasma contains a plurality of radicals and dissociated inert-source gas atoms, defining a cleaning mixture. The ratio of inert-source gas to fluorine source is greater than 1:1.Type: GrantFiled: October 18, 2004Date of Patent: March 24, 2009Assignee: Applied Materials, Inc.Inventors: Shankar N. Chandran, Scott Hendrickson, Gwendolyn D. Jones, Shankar Venkataraman, Ellie Yieh
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Publication number: 20080067425Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.Type: ApplicationFiled: March 15, 2007Publication date: March 20, 2008Applicant: Applied Materials, Inc.Inventors: Andrzei Kaszuba, Juan Rocha-Alvarez, Sanjeev Baluja, Tom Cho, Hichem M'Saad, Scott Hendrickson, Dustin Ho, Thomas Nowak
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Publication number: 20070295012Abstract: A re-circulating cooling system can be used with a curing system in order to reduce the exhaust requirements for the system. Further, using a cooling fluid such as nitrogen reduces the production of ozone and the sealing requirements for the system. A simple heat exchanger can be used between return and supply reservoirs in order to remove heat added to the re-circulating fluid during circulation past the curing radiation source. The nitrogen can come from a nitrogen source, or from a membrane or other device operable to split feed gas into its molecular components to provide a source of gas rich in nitrogen. An ozone destruction unit can be used with such a cooling system to reduce the amount of ozone to acceptable levels, and to minimize consumption of the nitrogen. A catalyst can be used to deplete the ozone that does not get consumed during the reaction.Type: ApplicationFiled: November 3, 2006Publication date: December 27, 2007Applicant: Applied Materials, Inc.Inventors: Dustin W. Ho, Juan Carlos Rocha-Alvarez, Dale R. Du Bois, Scott A. Hendrickson, Sanjeev Baluja, Ndanka O. Mukuti
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Publication number: 20070298167Abstract: A re-circulating cooling system can be used with a curing system in order to reduce the exhaust requirements for the system. Further, using a cooling fluid such as nitrogen reduces the production of ozone and the sealing requirements for the system. A simple heat exchanger can be used between return and supply reservoirs in order to remove heat added to the re-circulating fluid during circulation past the curing radiation source. The nitrogen can come from a nitrogen source, or from a membrane or other device operable to split feed gas into its molecular components to provide a source of gas rich in nitrogen. An ozone destruction unit can be used with such a cooling system to reduce the amount of ozone to acceptable levels, and to minimize consumption of the nitrogen. A catalyst can be used to deplete the ozone that does not get consumed during the reaction.Type: ApplicationFiled: November 6, 2006Publication date: December 27, 2007Applicant: Applied Materials, Inc.Inventors: DUSTIN W. HO, Juan Carlos Rocha-Alvarez, Dale R. Du Bois, Scott A. Hendrickson, Sanjeev Baluja, Ndanka O. Mukuti