Patents by Inventor Scott M. Jensen

Scott M. Jensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8042606
    Abstract: A substrate formed of a suitable conductive-heat-transfer material is formed with small channels of a size selected to provide surface tension forces dominating a motion of a liquid-phase working fluid. A space above the channels of the substrate provides comparatively unobstructed space for the transport motion of a vapor phase of the working fluid effecting a heat-pipe effect in a multi-dimensional device. Channels may typically be formed in an orthogonal grid providing capillary return of liquids from a comparatively cooler condensation region to a comparatively warmer evaporation region, without any wicks other that the adhesion of the liquid phase working fluid to the vertices of the channels. Interference between the boundary layers of the liquid phase and the vapor phase of the working fluid are minimized by the depth of the channels, and the pedestals formed by the channel walls.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: October 25, 2011
    Assignee: Utah State University Research Foundation
    Inventors: J. Clair Batty, Scott M. Jensen
  • Publication number: 20100132923
    Abstract: A substrate formed of a suitable conductive-heat-transfer material is formed with small channels of a size selected to provide surface tension forces dominating a motion of a liquid-phase working fluid. A space above the channels of the substrate provides comparatively unobstructed space for the transport motion of a vapor phase of the working fluid effecting a heat-pipe effect in a multi-dimensional device. Channels may typically be formed in an orthogonal grid providing capillary return of liquids from a comparatively cooler condensation region to a comparatively warmer evaporation region, without any wicks other that the adhesion of the liquid phase working fluid to the vertices of the channels. Interference between the boundary layers of the liquid phase and the vapor phase of the working fluid are minimized by the depth of the channels, and the pedestals formed by the channel walls.
    Type: Application
    Filed: May 2, 2007
    Publication date: June 3, 2010
    Inventors: J. Clair Batty, Scott M. Jensen
  • Publication number: 20090250196
    Abstract: A panel assembly for exchanging heat with an ambient environment maintains minimal temperature differential by virtue of operation as a heat pipe apparatus. Panels of a composite material having excellent structural strength and structural stiffness but comparatively modest thermal conductivity are machined as mirror images of one another. Two orthogonal arrays of parallel channels are machined in the faces of two panels, each intersection of channels forming and bounded by pedestals having a lower, broader base with a narrower upper portion extending from a shoulder of the base portion of the pedestals. The pedestals, in turn, form the bounds of the channels, each having a deeper and a narrower aspect extending along the bases of all the pedestals. Channels have a broader aspect extending along near the tops of the pedestals.
    Type: Application
    Filed: April 2, 2009
    Publication date: October 8, 2009
    Inventors: J. Clair Batty, Scott M. Jensen
  • Publication number: 20080289801
    Abstract: A composite panel provides structural strength and rigidity for modular assembly of spacecraft while serving the dual purposes of structure and heat transfer for thermal management of an environment for equipment, such as a spacecraft. Instruments, gimbals, surveillance, imaging, detectors, and the like may be mounted in a spacecraft designed and constructed from standard panels to provide the structural and heat transfer requirements to support the onboard equipment. Extremely small temperature differentials required by the panels support a substantially isothermal perimeter for the structure, able to sink heat from any location on a panel, transport it to a rejection site, and reject it to the cold environment of space, thus easing the task of design and packaging of instrumentation and infrastructure of satellites and other spacecraft.
    Type: Application
    Filed: August 7, 2008
    Publication date: November 27, 2008
    Inventors: J. Clair Batty, Scott M. Jensen
  • Patent number: D805580
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: December 19, 2017
    Inventor: Scott M. Jensen