Abstract: Photobiomodulation therapy systems provide a highly effective way to treat many common ailments to the human body. Many embodiments described herein enable two or more light therapy devices to be communicatively coupled together in various ways. In some embodiments, the light therapy system includes a first light device and a second light device arranged and configured to be communicatively coupled to the first light device. Each of the light devices may include a housing, a communication module, and a plurality of lights arranged and configured to emit at least one of red light and near infrared light.

Abstract: In some examples, systems and techniques for repairing or otherwise forming a blade of a bladed disk. In one example, a method including positioning a shield member around a perimeter of a partial blade extending from a rotor disk of a bladed disk, the shield member being positioned adjacent to a build surface of the partial blade; and depositing, with the shield member around the perimeter of the partial blade, a material on the build surface using an additive manufacturing technique to form a repaired portion on the build surface of the partial blade.

Abstract: A method may include removing a portion of a base component adjacent to a damaged portion of the base component to define a repair portion of the base component. The base component may include a cobalt- or nickel-based superalloy, and the repair portion of the base component may include a through-hole extending from a first surface of the base component to a second surface of the base component. The method also may include forming a braze sintered preform to substantially reproduce a shape of the through-hole. The braze sintered preform may include a Ni- or Co-based alloy. The method additionally may include placing the braze sintered preform in the through-hole and heating at least the braze sintered preform to cause the braze sintered preform to join to the repair portion of the base component and change a microstructure of the braze sintered preform to a brazed and diffused microstructure.

Abstract: A method may include controlling, by a computing device, an energy source to form a melt pool at a build surface; and controlling, by the computing device, a material delivery device to direct a powder at the melt pool to form the seal fin comprising a metal matrix composite on the build surface, wherein the metal matrix composite comprises a matrix material and a reinforcement phase.

Abstract: Photobiomodulation therapy systems provide a highly effective way to treat many common ailments to the human body. Many embodiments described herein enable two or more light therapy devices to be communicatively coupled together in various ways. In some embodiments, the light therapy system includes a first light device and a second light device arranged and configured to be communicatively coupled to the first light device. Each of the light devices may include a housing, a communication module, and a plurality of lights arranged and configured to emit at least one of red light and near infrared light.

Abstract: Defoliation of maize plants, based on percent seed moisture, has advantageous outcomes including greater number of seeds per pound; increased volume or proportion of saleable seed per field and per female acre; decreased discard of seed due to commercially undesirable size or shape; lower moisture content of seed at harvest; earlier harvest date; less fuel and time expended in drying seed for storage; improved performance in laboratory tests for germination at cold temperatures; improved seed treatment efficacy; improved emergence under stress in field conditions; improved plantability in mechanical systems; more uniform stand; fewer runt plants and improved grain yield.

Abstract: A system for monitoring contamination level of effluent of an offline brush conditioning system includes a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush and a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush, and the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor contamination levels of the first and second effluents, wherein the monitored contamination levels may provide feedback for use in the brush conditioning.

Abstract: A method for connecting or joining a first substrate and a second substrate across an interface between the first substrate and the second substrate. The method includes disposing a fastener precursor in the bore and sintering the fastener precursor in the bore. The fastener precursor densifies and shrinks in at least one dimension to mechanically interlock with a contour in the bore and form a mechanical fastener in the bore, and the mechanical fastener forms an interlock between the first substrate and the second substrate.

Abstract: A heat shield assembly adapted for use with gas turbine engines, airframes, and aircraft includes a carrier and a heat-shield tile. The carrier is adapted to couple to the gas turbine engine, airframe, or aircraft. The heat-shield tile includes material different than the carrier and is arranged to cover the carrier to protect the carrier from high-temperature gases surrounding the heat shield assembly.

Abstract: In some examples, an additive manufacturing technique including forming an as-deposited coating on a substrate by depositing a filament via a filament delivery device, wherein the filament includes a sacrificial binder and a powder; removing substantially all the binder from the as-deposited coating; and sintering the as-deposited coating to form a thermal coating; wherein the thermal coating is configured to ablate in response to absorption of energy from an external environment, and wherein the ablation of the thermal coating reduces the energy transferred to the substrate.

Abstract: In some examples, a braze material includes a first set of particles, a second set of particles, and a polymeric binder. The first set of particles includes a braze powder, where the braze powder comprises an Si-containing alloy. The first set of particles defines an average or median particle diameter between about 1 ?m and about 40 ?m. The second set of particles includes at least one of SiC or a transition metal carbide, where the second set of particles has a multimodal particle size distribution.

Abstract: In some examples, a method for forming a ballistic armor article, the method including forming a preform article by depositing a filament via a filament delivery device, wherein the filament includes a sacrificial binder and a powder; removing the binder from the preform article; and sintering the preform article to form the ballistic armor article, wherein the ballistic armor article is configured to absorb energy from an external projectile that impacts the ballistic armor article, and wherein the ballistic armor article is configured to prevent the projectile from penetrating through the ballistic armor article.

Abstract: A method for additive manufacturing, the method including delivering, via one or more delivery nozzles of a deposition head, a feedstock material to a substrate, wherein the delivered material defines a material distribution volume on and/or adjacent the substrate; and rotating the deposition head about an axis to control the material distribution volume, wherein the rotation of the deposition head adjusts a position of the one or more delivery nozzles of the deposition head relative to the substrate

Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

Abstract: A material deposition head includes a body portion and at least one nozzle. The body portion includes a first end, a second end, and a first exterior surface extending from the first end to the second end. The at least one nozzle is coupled to the body portion at or near the second end. The nozzle defines a second exterior surface and a material delivery channel that is fluidically coupled to a fluidized powder source configured to provide a plurality of particles of a material. At least one of the first exterior surface or the second exterior surface includes a microtextured surface configured to reduce a wettability of molten particles of the plurality of particles thereon.

Abstract: A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

Abstract: Various example embodiments are directed towards an improved control drum, as well as systems, apparatuses, and/or methods for operating a nuclear reactor with a plurality of improved control drums. The control drum includes an outer shell, an inner shell, a plurality of tubes, the plurality of tubes including at least one neutron absorbing tube and at least one neutron scattering tube, and at least one baffle plate arranged between the outer shell and the inner shell, the at least one baffle plate including a plurality of perforations, and at least one perforation of the plurality of perforations configured to support a tube of the plurality of tubes.

Abstract: Photobiomodulation therapy systems provide a highly effective way to treat many common ailments to the human body. Many embodiments described herein enable two or more light therapy devices to be coupled together in various ways. In some embodiments, the light therapy system includes a first light device and a second light device arranged and configured to be mechanically and/or electrically coupled to the first light device. Each of the light devices may include a housing and a plurality of lights arranged and configured to emit at least one of red light and near infrared light. The first light device and the second light device can be coupled in a side-by-side orientation or a top-to-bottom orientation. The light therapy system can also be coupled to a mobile stand or a door stand.

Abstract: An example article may include a component, a substrate including a first ceramic, a joining layer between the component and the substrate, and a joint surface coating between the substrate and the joining layer. The joint surface coating may include a diffusion barrier layer including a second ceramic material, and a compliance layer including at least one of a metal or a metalloid. An example technique may include holding a first joining surface of a coated component adjacent a second joining surface of a second component. The example technique may further include heating at least one of the coated component, the second component, and a braze material, and brazing the coated component by allowing the braze material to flow in a region between the first joining surface and the second joining surface.