Patents by Inventor Scott West
Scott West has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210126175Abstract: Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.Type: ApplicationFiled: November 9, 2020Publication date: April 29, 2021Inventor: R. Scott West
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Publication number: 20210083150Abstract: Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.Type: ApplicationFiled: September 25, 2020Publication date: March 18, 2021Inventors: Babak Imangholi, Khashayar Phil Oliaei, Scott West
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Patent number: 10903403Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.Type: GrantFiled: February 5, 2019Date of Patent: January 26, 2021Assignee: BRIDGELUX, INC.Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
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Publication number: 20210010656Abstract: A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.Type: ApplicationFiled: May 20, 2020Publication date: January 14, 2021Inventors: Jesus DEL CASTILLO, Scott WEST, Vladimir ODNOBLYUDOV
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Patent number: 10840424Abstract: Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.Type: GrantFiled: July 3, 2019Date of Patent: November 17, 2020Assignee: BRIDGELUX, INC.Inventor: R. Scott West
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Publication number: 20200313049Abstract: In one embodiment, the LED package comprises: (a) a submount comprising a substrate, at least one electrical interface, and a non-conductive reflective material disposed over substantially all of submount except for the at least one electrical interface; and (b) an LED chip having sides and at least one contact, the LED chip being flip-chip mounted to the submount such that the at least one contact is electrically connected to the at least one electrical interface, the LED chip covering a substantial portion of the at least one electrical interface, substantially all of the chip extending above the reflective material.Type: ApplicationFiled: June 21, 2017Publication date: October 1, 2020Inventors: Kevin HUANG, Aurelien J.F. DAVID, Stefan EBERLE, Rohit MODI, Scott WEST, Michael J. CICH, Rafael I. ALDAZ, Michael D. CRAVEN
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Patent number: 10790416Abstract: Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.Type: GrantFiled: April 8, 2019Date of Patent: September 29, 2020Assignee: BRIDGELUX INC.Inventors: Babak Imangholi, Khashayar Phil Oliaei, Scott West
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Publication number: 20200240614Abstract: A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.Type: ApplicationFiled: December 2, 2019Publication date: July 30, 2020Inventors: Xiaolu Chen, Wenhui Zhang, Scott West
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Patent number: 10714533Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.Type: GrantFiled: March 8, 2017Date of Patent: July 14, 2020Assignee: BRIDGELUX INC.Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
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Patent number: 10663142Abstract: A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.Type: GrantFiled: March 31, 2014Date of Patent: May 26, 2020Assignee: BRIDGELUX INC.Inventors: Jesus Del Castillo, Scott West, Vladimir Odnoblyudov
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Publication number: 20200035888Abstract: Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.Type: ApplicationFiled: July 3, 2019Publication date: January 30, 2020Inventor: R. Scott West
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Publication number: 20190371975Abstract: Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.Type: ApplicationFiled: April 8, 2019Publication date: December 5, 2019Inventors: Babak Imangholi, Khashayar Phil Oliaei, Scott West
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Patent number: 10495285Abstract: A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.Type: GrantFiled: August 14, 2017Date of Patent: December 3, 2019Assignee: BRIDGELUX INC.Inventors: Xiaolu Chen, Wenhui Zhang, Scott West
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Patent number: 10487992Abstract: There is provided an elongated optical component having a direction of elongation, comprising: a light transmissive core and a wavelength converting portion disposed on an exterior surface of the light transmissive core, wherein the wavelength converting portion comprises a photoluminescence material, and wherein the wavelength converting portion has a cross-section comprising an apex.Type: GrantFiled: April 20, 2018Date of Patent: November 26, 2019Assignee: Intematix CorporationInventor: Scott West
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Publication number: 20190341534Abstract: Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.Type: ApplicationFiled: May 17, 2019Publication date: November 7, 2019Inventors: Vladimir A. Odnoblyudov, R. Scott West
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Publication number: 20190288170Abstract: A flip-chip package comprising: (a) a lead frame; (b) a flip-chip LED defining a die footprint and having RDL contacts, the RDL contacts being configured to facilitate flip-chip mounting of the LED on the lead frame, each of the RDL contacts having a footprint greater than 20% of the die footprint; and (c) at least one bonding layer disposed between the RDL contacts and the lead frame package.Type: ApplicationFiled: March 15, 2019Publication date: September 19, 2019Inventors: Scott West, Robert Harris, William Pickering
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Publication number: 20190273192Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.Type: ApplicationFiled: February 5, 2019Publication date: September 5, 2019Inventors: Vladimir ODNOBLYUDOV, Scott WEST, Cem BASCERI, Zhengqing GAN
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Patent number: 10347807Abstract: Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.Type: GrantFiled: December 21, 2012Date of Patent: July 9, 2019Assignee: BRIDGELUX INC.Inventor: R. Scott West
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Patent number: 10325890Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.Type: GrantFiled: May 1, 2018Date of Patent: June 18, 2019Assignee: Bridgelux, Inc.Inventors: R. Scott West, Tao Tong, Mike Kwon, Michael Solomensky
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Patent number: 10297731Abstract: Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.Type: GrantFiled: November 26, 2014Date of Patent: May 21, 2019Assignee: Bridgelux, Inc.Inventors: Vladimir A. Odnoblyudov, R. Scott West