Abstract: Disclosed herein is a flexible metal laminate including: a first thermosetting polyimide resin layer containing 5 wt % to 75 wt % of a fluorine-based resin; a second thermosetting polyimide resin layer formed on at least one surface of the first thermosetting polyimide resin layer, and containing 1 wt % or less of the fluorine-based resin; and a thermoplastic polyimide resin layer formed on one surface of the second thermosetting polyimide resin layer so as to face the first thermosetting polyimide resin layer, wherein the first thermosetting polyimide resin layer and the second thermosetting polyimide resin layer include the same thermosetting polyimide resin.

Abstract: This disclosure relates to a flexible metal laminate including a porous polyimide resin layer including 30 wt % to 95 wt % of a polyimide resin, and 5 wt % to 70 wt % of fluorine-containing resin particles, wherein micropores having a diameter of 0.05 ?m to 20 ?m are distributed in the porous polyimide resin layer, and a method for preparing the same.

Abstract: The present invention relates to a flexible metal laminate with low dielectric constant, which may be applied for a substrate for a flexible printed circuit. A flexible metal laminate according to one aspect of the invention includes a first metal layer; a first polyimide layer; a polyimide layer including fluoropolymer dispersed therein, formed on the first polyimide layer; and a second polyimide layer formed on the polyimide layer including fluoropolymer dispersed therein; wherein in the polyimider layer including dispersed fluoropolymer, the content of the fluoropolymer per unit volume is higher at 40 to 60% depth than at 5 to 10% depth of the total thickness from the surface of the polyimide layer.

Abstract: Disclosed herein is a flexible metal laminate including: a first thermosetting polyimide resin layer containing 5 wt % to 75 wt % of a fluorine-based resin; a second thermosetting polyimide resin layer formed on at least one surface of the first thermosetting polyimide resin layer, and containing 1 wt % or less of the fluorine-based resin; and a thermoplastic polyimide resin layer formed on one surface of the second thermosetting polyimide resin layer so as to face the first thermosetting polyimide resin layer, wherein the first thermosetting polyimide resin layer and the second thermosetting polyimide resin layer include the same thermosetting polyimide resin.

Abstract: There is provided a flexible metal laminate including a polymer resin layer including a polyimide resin of a specific structure and a fluororesin, wherein the fluororesin is more distributed through the inside of the polymer resin layer than at the surface of the polymer resin layer.

Abstract: This disclosure relates to a flexible metal laminate including a porous polyimide resin layer including 30 wt % to 95 wt % of a polyimide resin, and 5 wt % to 70 wt % of fluorine-containing resin particles, wherein micropores having a diameter of 0.05 ?m to 20 ?m are distributed in the porous polyimide resin layer, and a method for preparing the same.

Abstract: The present invention relates to an adhesive resin composition for fabrication of circuit boards and its use. The adhesive resin composition of the present invention includes a cyanate ester resin, a fluorine-based resin powder dispersed in the cyanate ester resin, and a rubber component and has low dielectric constant and low dielectric loss factor, which enables the fabrication of circuit boards with further enhanced electrical characteristics.

Abstract: There is provided a flexible metal laminate including a polymer resin layer including a polyimide resin of a specific structure and a fluororesin, wherein the fluororesin is more distributed through the inside of the polymer resin layer than at the surface of the polymer resin layer.

Abstract: The present invention relates to a flexible metal laminate with low dielectric constant, which may be applied for a substrate for a flexible printed circuit. A flexible metal laminate according to one aspect of the invention includes a first metal layer; a first polyimide layer; a polyimide layer including fluoropolymer dispersed therein, formed on the first polyimide layer; and a second polyimide layer formed on the polyimide layer including fluoropolymer dispersed therein; wherein in the polyimider layer including dispersed fluoropolymer, the content of the fluoropolymer per unit volume is higher at 40 to 60% depth than at 5 to 10% depth of the total thickness from the surface of the polyimide layer.

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10?6 to 2.5×10?5/° C. and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10-6 to 2.5×10-5/iÉ and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.