Abstract: A display may include a viewing area and a border about the viewing area. The border is visibly opaque and near infrared transparent. An encoded pattern underlies the border.

Abstract: A display may include a viewing area and a border about the viewing area. The border is visibly opaque and near infrared transparent. An encoded pattern underlies the border.

Abstract: A system and method for stabilizing a mating is provided. One embodiment comprises an apparatus for stabilizing a mating between signal connectors. The apparatus comprises a body operable to be coupled to a unit comprising a first signal connector, said body forming an aperture operable to receive at least a portion of a surface to which a second signal connector is coupled, wherein said apparatus restrains movement of the at least a portion of the surface received by the aperture when the first signal connector and the second signal connector are mated.

Abstract: In certain embodiments, a system for cooling components of an electronic device includes a chassis having a base, sides, and a removable cover disposed over the sides; a first component, a second component, and a third component disposed in the chassis; and a duct disposed in the chassis. In some embodiments, a duct includes a passage, an inlet to the passage, and an outlet from the passage, wherein the passage is disposed over the first component but not over the second and third components; and an upper member disposed against the removable cover lengthwise along the duct, wherein the duct and the upper member are configured to separate the second component from the third component in substantially different regions within the chassis. In particular embodiments, the system also includes a fan disposed angularly in the duct, such that the fan can provide an airflow in an angular direction relative to the first component.

Abstract: A system and method for mounting a device into a rack comprises a mounting shelf that is attached to the rack, a first bracket that is attached to a first side of the device, and a second bracket that is attached to a second side of the device, wherein the second side is located opposite to the first side, wherein the first bracket and the second bracket are substantially similar, and wherein the device, with the first bracket and the second bracket attached thereto, is slideably positioned into the mounting shelf and attached to the mounting shelf via the first bracket and the second bracket.

Abstract: A system and method that enables installation of media devices in a chassis. The chassis has an internal cavity defined by a plurality of walls. Additionally, a first media device has a first external width dimension and a second media device has a second external width dimension. The second external width dimension is different than the first external width dimension. A plurality of mounting features are connected to the plurality of walls to hold the first media device and the second media device in a plurality of orientations relative to the chassis.

Abstract: A system and method for mounting a device into a rack comprises a mounting shelf that is attached to the rack, a first bracket that is attached to a first side of the device, and a second bracket that is attached to a second side of the device, wherein the second side is located opposite to the first side, wherein the first bracket and the second bracket are substantially similar, and wherein the device, with the first bracket and the second bracket attached thereto, is slideably positioned into the mounting shelf and attached to the mounting shelf via the first bracket and the second bracket.

Abstract: A system and method for mounting a device into a rack comprises a mounting shelf that is attached to the rack, a first bracket that is attached to a first side of the device, and a second bracket that is attached to a second side of the device, wherein the second side is located opposite to the first side, wherein the first bracket and the second bracket are substantially similar, and wherein the device, with the first bracket and the second bracket attached thereto, is slideably positioned into the mounting shelf and attached to the mounting shelf via the first bracket and the second bracket.

Abstract: A transformable computer comprises a computer chassis and a plurality of mounts. The computer chassis comprises a mounting latch member. The plurality of mounts are interchangeably coupleable with the mounting latch member, wherein the plurality of mounts comprise a rail mount for a rack mount computer configuration and a tower base mount for a vertical tower computer configuration. A method of using a computer chassis comprising providing a computer chassis and interchangeably coupling one of a rack mountable rail and a tower base mount to the computer chassis at least partially with a tool-free coupling member.

Abstract: A system and method that enables installation of media devices in a chassis. The chassis has an internal cavity defined by a plurality of walls. Additionally, a first media device has a first external width dimension and a second media device has a second external width dimension. The second external width dimension is different than the first external width dimension. A plurality of mounting features are connected to the plurality of walls to hold the first media device and the second media device in a plurality of orientations relative to the chassis.

Abstract: A system and method for stabilizing a mating is provided. One embodiment comprises an apparatus for stabilizing a mating between signal connectors. The apparatus comprises a body operable to be coupled to a unit comprising a first signal connector, said body forming an aperture operable to receive at least a portion of a surface to which a second signal connector is coupled, wherein said apparatus restrains movement of the at least a portion of the surface received by the aperture when the first signal connector and the second signal connector are mated.

Abstract: A system and method for mounting a device into a rack comprises a mounting shelf that is attached to the rack, a first bracket that is attached to a first side of the device, and a second bracket that is attached to a second side of the device, wherein the second side is located opposite to the first side, wherein the first bracket and the second bracket are substantially similar, and wherein the device, with the first bracket and the second bracket attached thereto, is slideably positioned into the mounting shelf and attached to the mounting shelf via the first bracket and the second bracket.

Abstract: A system and method for mounting a device into a rack comprises a mounting shelf that is attached to the rack, a first bracket that is attached to a first side of the device, and a second bracket that is attached to a second side of the device, wherein the second side is located opposite to the first side, wherein the first bracket and the second bracket are substantially similar, and wherein the device, with the first bracket and the second bracket attached thereto, is slideably positioned into the mounting shelf and attached to the mounting shelf via the first bracket and the second bracket.

Abstract: A system and method for situating a disk drive is provided. One embodiment comprises a system for situating a disk drive within a chassis. The system comprises a disk drive unit comprising a drive bracket coupled to the disk drive, as well as a lever member movably coupled to the drive bracket. The system further comprises a drive guide coupled to the chassis. There earlier-mentioned lever member is operable to engage the drive guide when the disk drive unit is being situated within the chassis. Furthermore, the system enables the situating of the disk drive unit within the chassis along a plane other than a plane along which a connector of the disk drive mates with a connector disposed within the chassis.

Abstract: A system and method for mounting a device into a rack comprises a mounting shelf that is attached to the rack, a first bracket that is attached to a first side of the device, and a second bracket that is attached to a second side of the device, wherein the second side is located opposite to the first side, wherein the first bracket and the second bracket are substantially similar, and wherein the device, with the first bracket and the second bracket attached thereto, is slideably positioned into the mounting shelf and attached to the mounting shelf via the first bracket and the second bracket.

Abstract: An EMI containment assembly for an integrated circuit chip. A frame forms an eletrically conductive wall around the perimeter of the integrated circuit chip. The bottom of the frame makes an electrically conductive contact with a ground trace on the printed circuit board to which the chip is mounted. The top of the frame makes an electrically conductive contact with an electrically conductive heat removal assembly that is disposed over the top of the chip. An electrically conductive bolster plate is mounted on the side of the printed circuit board opposite the integrated circuit chip and is disposed beneath the chip. Because each component of the assembly is electrically conductive, the assembly creates an EMI cage around the integrated circuit chip. Because the frame does not cover the top of the chip, it does not interfere with a thermally conductive contact that is made between the top of the chip package and the heat removal assembly.

Abstract: A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are parallel to one another and orthogonal to the bottom of the base portion. The fins have a constant profile relative to the bottom of the base portion, but the base portion has a central portion that is thicker than its end portions. The thickness of the central portion varies according to a radius. The radius is approximated by step differences in the depths of the fins.

Abstract: An actively cooled daughterboard system. One more daughterboards are mounted in parallel rows on a motherboard. Each daughterboard is oriented substantially perpendicular to the motherboard, but may optionally be mounted at an oblique angle relative to the motherboard. Each daughterboard has a low-profile thermally-efficient heatsink mounted thereon. A fan shroud partially covers the daughterboards, but has openings in its sides for directing air flow through plural fins on the heatsinks and through a fan mounted to the top of the fan shroud. The inventive daughterboard system enables multiple high heat dissipating daughterboards to be placed closer together than the daughterboard systems of the prior art while still keeping the daughterboards adequately cooled. Moreover, because only a single fan is used to cool all of the daughterboards under the shroud, noise and expense are reduced relative to prior art systems that employed one or more fans per daughterboard.

Abstract: A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are radially displaced from one another. The base portion includes a central portion that is thicker than the end portions. The thickness of the base portion and the profile formed by the outer ends of the fins vary according to radii. The inner radius associated with the central fins is shorter than the inner radius associated with the endmost fins.

Abstract: The inventive mechanism conducts heat through the leads of the connector to the solder connection points, and simultaneously reflows all of the solder on all of the pads. The inventive mechanism comprises a machined aluminum piece that mimics the mating geometry for the connector and couples to the connector as if it were a chip device. The inventive mechanism couples to the connector via heat conducting fins. Heat is transferred to the aluminum piece, and down through the fins and into the internal portion of the connector. The fins contact the internal portion of the connector leads. Thus, heat is transferred from the internal portion of the leads to the exterior portion of the leads, and down to the soldered connection point with the PCB board. Since the fins contact all of the internal leads of the connector, each of the soldered connections is reflowed at approximately the same time, and thus, the connector is then removed from the board.